• Journal of Welding and Joining
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• 제6권3호
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• pp.37-42
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• 1988

The Hole Drilling Method(HDM) is widely used to measure residual stresses in the welded structures. The purpose of this study is to evaluate the accuracy fo measuring residual stresses when drilling the hole by Air-abrasive Jet machine(AJM). Simulated residual stresses wre introduced by applying known stresses to steel bars. These known streses were then compared with measured stresses relaxed from hole drilling. the obtained results are summarized as follows; 1) It was possible to obtain well defined holes with the nozzle designed for this study. 2) If the hole shape is not cylindrical, critical may occur. 3) In the uniaxial strain field, the measurement error of the maximum principal stress was within .+-.10 percent. The orientation angle of the maximum principal stress was within 8.deg. from the given directioin. 4) meausrements were made varying hole depths. Little or no change of stresses occurs since holse were drilled more than the depth of the 0.6 times diameter. 5) The air-abrasive jet machining for drilling holse does not cause appreciable apparent stresses which si critical to measure residual stresses.

• Journal of Welding and Joining
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• 제8권4호
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• pp.76-82
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• 1990

Lots of research works have been done to improve the accuracy of the hole drilling method to measure residual stress by many investigators. In this study, first, size effect of specimen was analyzed based on the solution of hole in a strip under tension. If the ratio of hole diameter tothe strip width is less than 0.2, the stress distribution around hold may be given from the solution of hole in an infinite plate. Second, the residual stress above $0.6{\sigma}_y$(yield stress) may be measured less than the actual stress by 10-15 percent. Third, eccentricity of hole relative to the rosette center effects on the accuracy of residual stress measurements by 10 percent. The error due to eccentricity of hole can be corrected by the iteration method or the direct method.

• 한국정밀공학회지
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• 제13권12호
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• pp.46-53
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• 1996

Micro drilling is one of the most important machining types and its necessity becomes more and more increasing in the whole field of industry. Micro drilling, however, has few the case of practical application, because it requests high techniques : manufacturing micro drill, treating chip, producting precise hole shape and progressing machining effeciency. Micro drilling has a technical problem: drill breakage from the lack of drill rigdity and the interuption of chip. It is, therefore, essential to select the proper cutting conditions and the step fed for the method solving the lack of rigidity and the interruption of chip. Especially, step feed is very efficient to avoid the breakage of drill, but bring about reducing of cutting efficiency. The study on step feed must be requested more than the present in the near future. The purpose of this paper is to investigate experimentally about cutting conditions which affect on tools and round errors and to estimate about the effect of step feed as well as optimal step feed size to solve the breakage of drill.

• 한국강구조학회 논문집
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• 제11권3호통권40호
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• pp.301-309
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• 1999

본 연구의 목적은 소성영역에서의 철골 부재내에 존재하는 존재응력을 추정하는 법을 개발하기 위함이다. 여기에선 선행 실험 연구를 근거로 하여 응력집중 현상에 기인한 국부 소성화를 고려하여 보정계수법이 제안되었다. 구멍주위의 응력 분포를 파악하기 위하여 유한요소 해석을 수행하였고, 그 결과를 탄 소성역에서의 구멍내기법에 의한 결과와 비교하였다. 보정계수법을 적용한 결과, 본 연구에서 제안된 방법은 실재 초기 존재응력값과 약 2% 정도의 오차를 가진 매우 좋은 결과치를 나타냈다.

• 한국기계가공학회지
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• 제4권3호
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• pp.32-38
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• 2005

Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

• 대한전자공학회논문지SD
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• 제47권12호
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• pp.55-67
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• 2010

고다층 배선 기판에 형성된 개방 스터브(open stub)를 제거한 후면드릴가공홀(Back-Drilled-Hole, BDH)과 일반적인 구조인 관통홀(Plated-Through-Hole, PTH) 구조의 전기적 특성에 대한 분석을 하였으며, 고속 선호를 부품 실장면으로부터 내층의 스트립라인으로 전송하기 위해 비아홀의 급전 길이가 가장 긴 전송층을 선택하였다. 10 GHz의 광대역 주파수 내에서 실험계획법(DOE, design of experiment)을 적용하여 비아홀 구조 내에 외층과 급전층 사이의 비아홀의 길이, 접지층에 형성된 천공(anti-pad)의 크기와 급전층에 형성된 패드 (pad)의 크기가 최대 반사 손실 반전력 주파수와 삽입 손실에 미치는 영향을 분석하였다. 이로 부터 거시적 모델(macro model)을 위한 회귀 실험식을 추출하여 실험 결과와 비교 평가하였고, 실험 영역 외에서도 측정 결과와 5% 이내의 오차를 보이고 있음을 확인하였다.

• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• 한국정밀공학회지
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• 제18권12호
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• pp.152-158
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• 2001

In this paper, we have developed an electro discharge machine for micro drilling driven by a voice coil actuator. Because the voltage signal of the electro-discharging circuit shows a lot of peaks and valleys, the active type low-pass filtering technique is adopted to get the average of the signal. Since the motion of the voice coil is precisely controlled by the error value between the object voltage value and the measured one, it is possible to prevent the mechanical contact between the rotating electrode and the workpiece and to maintain the appropriate machining conditions during the process. The electro-chemical machining technology was also adopted to make small diameter electrodes. Pure water is used as a dielectric. The machining procedure is performed to verify the feasibility of the developed system. It takes about 10 seconds to drill the ${\phi}m$100${\mu}m$ hole to the 100${\mu}m$ thickness stainless steel plate. The machining time depends on the values of the resister and the capacitor. There may exist the optimal values of time constant and the tendency is displayed In the appendix.

• 화약ㆍ발파
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• 제39권3호
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• pp.15-23
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• 2021

통기 수갱은 지하공간 개발시 분진 또는 매연 등을 제거하기 위해 광산과 터널에서 사용되는 통로이다. 광산에서는 통기 수갱 개발을 위해 10~20m 구간의 크라운필라 영역을 1회의 장공발파로 굴착하는 공법이 적용 가능하다. 이 경우 천공오차를 파악하기 위해 장약공을 완전히 천공하였을 때 장약공 하부가 구속되지 않으며, 또한 이는 폭약 장약과 발파효율을 떨어트리는 문제를 발생시킨다. 이는 장약공 하부에 전색을 사용함으로 장약공 하부를 전색하여 폭약 장약의 문제를 해결하고 발파효율을 증가시킬 수 있다. 본 연구에서는 ANSYS AUTODYN 2D SPH(Smooth particle hydrodynamics) 해석기법을 이용하여 장약공 직경(45, 76mm)과 다양한 전색장을 달리한 통기 수갱 발파 시뮬레이션을 실시하였다. 또한 발파에 따른 하부의 대괴 사이즈, 저항선을 확인하여 최적의 하부전색장을 도출하였다. 해석 결과 하부전색장 30cm 이하의 경우 발파효율이 저하되며, 발파효율을 높이기 위해서 30cm 이상의 전색장을 적용하여야 함을 확인하였다.