• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Composites Research
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• v.29 no.2
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• pp.45-52
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• 2016

An understanding of the failure mechanisms of the adhesive layer is decisive in interpreting the performance of a particular adhesive joint because the delamination is one of the most common failure modes of the laminated composites such as the fiber metal laminates. The interface between different materials, which is the case between the metal and the composite layers in this study, can be loaded through a combination of fracture modes. All loads can be decomposed into peel stresses, perpendicular to the interface, and two in-plane shear stresses, leading to three basic fracture mode I, II and III. To determine the load causing the delamination growth, the energy release rate should be identified in corresponding criterion involving the critical energy release rate ($G_C$) of the material. The critical energy release rate based on these three modes will be $G_{IC}$, $G_{IIC}$ and $G_{IIIC}$. In this study, to evaluate the fracture behaviors in the fracture mode I and II of the adhesive layer in fiber metal laminates, the double cantilever beam and the end-notched flexure tests were performed using the reference adhesive joints. Furthermore, it is confirmed that the experimental results of the adhesive fracture toughness can be applied by the comparison with the finite element analysis using cohesive zone model.

• Composites Research
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• v.31 no.5
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• pp.177-185
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• 2018

Fiber metal laminate (FML) is a type of hybrid composites which consist of metallic and fiber-reinforced plastic sheets. As the FML has a drawback of the delamination that is a failure of the interfacial adhesive layer, the nominal stresses and the energy release rates should be determined to identify the delamination behavior. However, it is difficult to derive the nominal stresses and the energy release rates since the operating temperature of the equipment is restricted. For this reason, the objective of this paper is to predict the mode-I nominal stress and the mode-I energy release rate of the adhesive layer using the inverse analysis based on the Levenberg-Marquardt method. First, the mode-I nominal stress was assumed as the tensile strength of the adhesive layer, and the mode-I energy release rate was obtained from the double cantilever beam test. Next, the finite element method was applied to predict the mode-I delamination behavior. Finally, the mode-I nominal stress and the mode-I energy release rate were predicted by the inverse analysis. In addition, the convergence of the parameters was validated by trying to input two cases of the initial parameters. Consequently, it is noted that the inverse analysis can predict the mode-I delamination behavior, and the two input parameters were converged to similar values.

• Composites Research
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• v.27 no.6
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• pp.248-253
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• 2014

In this study, tapered double cantilever beam specimens are designed with the variable of angle to investigate the fracture property at the bonded surface of adjoint structure. These specimens are made with four kinds of models as the length of 200 mm and the slanted angles of bonded surfaces on specimens of $6^{\circ}$, $8^{\circ}$, $10^{\circ}$ and $12^{\circ}$. By investigating experiment and analysis result of these specimens, the maximum loads are happened at 120 N, 137 N, 154 N and 171 N respectively in cases of the specimens with slanted angles of $6^{\circ}$, $8^{\circ}$, $10^{\circ}$ and $12^{\circ}$. As the analysis result approach the experimental value, it is confirmed to have no much difference with the values of experiment and analysis. It is thought that the material property can be investigated effectively on shear behavior of the material composed of aluminum foam bonded with adhesive through simulation instead of experiment by applying this study method.

• Journal of the Korea Convergence Society
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• v.10 no.1
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• pp.155-161
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• 2019

As composite is the light weight material whose durability and mechanical property are more superior than the existing general material. By taking notice of the composite with light weight, this study was about to investigate the static fracture characteristic of the bonded CFRP structure jointed with adhesive. Also, CFRP double cantilever beam with the variable of laminate angle was designed and the static fracture analysis was carried out. The laminate angles of CFRP double cantilever beam designed for this study were $30^{\circ}$, $45^{\circ}$ and $60^{\circ}$ individually. As the study result, the specimen with the laminate angle of $45^{\circ}$ was shown to have the durability better than those with the layer angles of $30^{\circ}$ and $45^{\circ}$. It was checked that the specimen with the laminate angle of $30^{\circ}$ had the weakest durability among all specimens. The damage data of the bonded CFRP structure by laminate angle could be secured through this study result. As the damage data of bonded interface obtained on the basis of this study result are utilized, the esthetic sense can be shown by being grafted onto the machine or structure at real life.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.7-12
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• 2000

Copper-based leadframe sheets were oxidized in a black-oxide forming solution, and molded with epoxy molding compound (EMC) to form sandwiched double-cantilever beam (SDCB) specimens. The adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using SDCB specimens and the fracture surfaces were analyzed by various equipments such as glancing-angle XRD, AFM, and SEM. Results showed that three types of failure paths, which were closely related to the surface condition of leadframes before molding.

• Magazine of the Korea Concrete Institute
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• v.1 no.2
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• pp.101-112
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• 1989

콘크리트에 선형파괴역할의 적용가능성을 연구한 많은 논문이 발표되었다. 본 논문에서는 CLWL-DCB식편을 이용한 콘크리트의 개구형파괴를 연구하였다. 표면구열길이는 리프리카를 사용하여 직접적인 방법으로 측정하였고, 이 결과은 실험에서 얻은 측정가중과 구열개구변위의 관계곡선을 이용하여 분석하였다. 감계응력강도계수와 감계구열선단위는 Two Parameter 모델을 사용하여 유효구열선단에서 구하였다. LEFM 구열단면과 실험으로 구한 구열단면으로부터 폐쇄압력을 얻기 위하여 중첩법을 적용하여 5종의 균열모델을 평가하였다.

• Structural Engineering and Mechanics
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• v.7 no.3
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• pp.331-344
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• 1999

This paper provides an analysis of the transient behaviour of a right-angled bent cantilever beam subjected to a suddenly applied force at its tip perpendicular to its plane. Based on a rigid, perfectly plastic material model, a double-hinge mechanism is required to complete the possible deformation under a rectangular force pulse (constant force applied for a finite duration) with a four-phase response mode. The kinematics of the various response phases are described and the partitioning of the input energy at the plastic hinges during the motion is evaluated.