• Title/Summary/Keyword: Distribution packaging

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A Study on the Vibration and Dropping Shock of Refrigerator during Physical Distribution (냉장고의 유통 중 진동 및 낙하충격에 관한 연구)

  • Lee, Soo-Keun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.8 no.1
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    • pp.23-26
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    • 2002
  • This study was carried out to investigate vibration shock and dropping shock of refrigerator during physical distribution. The values of vibration shock were measured to be ${\sim}3G$ for up and down direction, ${\sim}0.8G$ for right and left direction and ${\sim}0.5G$ for back and forth direction on the national road. There was no damage during transport. From the results of dropping test by KS A 1026(General Rules of Performance Testing for Packaged Freights), relative equations were gained as follow : y = 0.12x + 7.63(where y is G-factor and x is Dropping height). The maximum values of dropping shock during materials handling were measured to be 11G. This shock value was corresponding to dropping shocks of dropping height 28.3cm by KS A 1026.

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Multilayer thin Film technology as an Enabling technology for System-in-Package (SIP) and "Above-IC" Processing

  • Beyne, Eric
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.09a
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    • pp.93-100
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    • 2003
  • The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

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Development of a Optimum Inward Design Software for Corrugated Board (Corrugated Board의 최적내형설계 소프트웨어 개발)

  • Park, Jong-Min
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.10 no.1
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    • pp.27-36
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    • 2004
  • Software summarized packaging technology related is needed for low cost and high efficiency in production and packaging design of corrugated board, and in development of these softwares, distribution and packaging environment of one's country must be reflected, well. In domestic occasion, software related to corrugated board packaging dont's exist nearly, and in many industrial fields, the more higher role and importance of packaging in various industrial field is, the more higher necessity of that is. In this study, on the base of preceeding studies (Park, 2001; 2003; 2003), software to optimize board combination that is most importance and sensitivity in composition of cost elements in production and packaging design of corrugated board was developed. This software was composed of input module, output module, database and management module, and calculation module, and efficiency of this software was analyzed on the both sides of sensitivity in design result and effectiveness in a case analyse. In the inward design results having same strength, board combination balance, bursting strength, box weight, and cost were greatly different. Therefore, optimum inward design according to user's design specifications is possible, and in a case analysis for actual products, obtained the more profitable results than before design.

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Stress distribution in glass panel of a field emission display without spacers and displacement thereof during vacuum packaging (Field Emission Display 용 진공 패키징시 진공하에서 유리 두께에 따른 유리에 걸리 는 응력 및 변위(Spacer 가 없는 경우))

  • 문제도
    • Journal of the Microelectronics and Packaging Society
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    • v.4 no.2
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    • pp.17-24
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    • 1997
  • Spacer가 없는 Field Emission Display 정보표시소자의 진공 패키징시 패널 유리 두 께에 따른 패널 유리가 받는 응력과 패널의 중앙 부위에서의 변위를 계산하였다. 판의 각 모서리가 고정된 상태에서 일정한 압력을 받는 경우의 bending moment로부터 우리가 받는 압력을 계산하였으며 3.7"와 5.7"크기의 두가지 경우를 실험하여 계산값과 파괴양상 및 중앙 에서의 변위를 비교하였다.변위를 비교하였다.

Static and Dynamic FEM Simulation of Packaging Tray Cup Pad for Korean Pears

  • Choi, Dong-Soo;Son, Jea-Yong;Kim, Jin-Se;Kim, Yong-Hoon;Park, Chun-Wan;Jung, Hyun-Mo;Hwang, Sung-Wook
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.25 no.3
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    • pp.89-94
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    • 2019
  • Among the many packaging materials used in cushion packaging, there is a lack of optimum design for the tray cup pad used in fruit packaging for export and domestic distribution. It causes over-packaging due to excessive material input, and this could be solved by applying various parameters needed to optimize the design of the tray cup pad considering the packaging material and the quantity of fruits in the box. In the case of a tray cup for fruits, the economic efficiency of material and thickness should be considered. Therefore, it is possible to design a tray cup pad depending on the packaging material used by applying appropriate design parameters. The static and dynamic characteristics of the materials used for packaging of pears were analyzed by using the FEM (finite element Method) simulation technique to derive the optimal design parameters. And by applying the appropriate design parameters considering the quantity of fruit and distribution environment, it is possible to design an appropriate fruit tray cup pad. In this study, as a result of simulating the contact stresses between the fruit and the tray cup for the PP, PE, and PS materials used in the fruit tray cup, the material with the lowest contact stress was PP and the value was found to be 398 Pa. The contact displacement between fruit and tray cup using this material was about 0.0463 mm, which was the lowest value compared with other materials. Also the resonance frequency band of tray cup made of PP material was below 36.81 Hz, and the strain energy was below 12.20 J. The resonant frequency band of the pear is more than 80 Hz and it could be applied to all the tray cup materials as compared with the resonance band of 38.81 Hz or less which is the resonance band of all tray cup pads for packaging. Finally, PP is the most suitable material for the tray cup pad.

Manufacture of Water-Resistant Corrugated Board Boxes for Agricultural Products in the Cold Chain System

  • Jo, Jung-Yeon;Min, Choon-Ki;Shin, Jun-Seop
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.44 no.2
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    • pp.29-34
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    • 2012
  • For the purpose of developing liner board for water-resistant corrugated board in the cold chain system, several types of base paper for corrugated board were purchased from the market and 6 different boards were produced in the paperboard mill by applying the chemicals on the base paper. Then, water-moisture resistant performance and physical properties of the boards were compared each other. The liner board which is dried at high temperature with pressure by Condebelt papermaking system(CK paper) showed a superior performance in strength over common liner boards. Strength of the board increased by surface chemical treatment up to 60% of compressive strength and 30% of bursting strength. Starch insolubilization with Ammonium-Zirconium Carbonate(AZC) and surface coating with a surface size and a moisture resistant chemical on CK paper showed the best result. Therefore, this method was recommended to produce the outer liner board for water -resistant corrugated board.

A study on how to maintain the freshness of agricultural products distribution (농산물 유통 신선도 유지방안 연구)

  • Choe, Yoowha
    • The Journal of the Convergence on Culture Technology
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    • v.6 no.3
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    • pp.377-380
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    • 2020
  • The increase in single households, changes in consumption behavior, and the size of marts are becoming larger, whereas the packaging form is being changed to small packaging containers, small packages are being exported when exporting agricultural products, especially fruits and related crops, leading to CO2 at the time of export. Although it was processed, it was difficult to guarantee the freshness of the crops inside the package during the transportation period. Therefore, it is necessary to provide a new method of maintaining freshness for application to agricultural products distributed in small packaging containers as a freshness retention agent to prevent deterioration of crops by microorganisms due to changes in product temperature during transportation or display during distribution of agricultural products. I was researching ways to bring about innovation.

Analysis of the Causes of Deformation of Packaging Materials Used for Ready-to-Eat Foods after Microwave Heating (즉석편의 식품용 포장재의 전자레인지 가열에 의한 변형 원인 분석)

  • Yoon, Chan Suk;Hong, Seung In;Cho, Ah Reum;Lee, Hwa Shin;Park, Hyun Woo;Lee, Keun Taik
    • Korean Journal of Food Science and Technology
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    • v.47 no.1
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    • pp.63-69
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    • 2015
  • The aim of this study was to investigate the deformation of packaging materials used for ready-to-eat (RTE) foods after the retort process and microwave heating. From the multilayer films consisting of polyethylene terephthalate (PET), polyamide (PA), and cast polypropylene (CPP) in a stand-up pouch form used for RTE foods, some deformation of the CPP layer, which was in direct contact with the food, was observed after the retort process and microwave heating. The damage was more severely caused by microwave heating than by the retort process. This may be attributed to diverse factors including the non-uniform heating in a microwave oven, the sorption of oil into the packaging film, and the different characteristics of food components such as viscosity, salt and water content. The development of heat-resistant packaging materials and systems suitable for microwave heating of RTE foods is required for the safety of consumers.

Guidelines for Packaging, Transport, and Storage of Source Cells for Organoids

  • Sungin Lee;Dayeon Kwon;Han Byeol Lee;Sooyeon Jeon;Chihye Park;Tae Sung Kim;Jin Hee Lee;Il Ung Oh;Sun-Ju Ahn
    • International Journal of Stem Cells
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    • v.17 no.2
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    • pp.113-119
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    • 2024
  • This report presents guidelines for the systematic management of packaging, storage, transportation, and traceability of source cells used for organoid research. Given the important role of source cells in organoid studies, it is important to ensure the preservation of their quality and integrity throughout transportation and distribution processes. The proposed guidelines, therefore, call for a cohesive strategy through these stages to minimize the risks of contamination, deterioration, and loss-threats that significantly compromise the safety, efficacy, and efficiency of source cells. Central to these guidelines is the quality control measures that include roles and responsibilities across the entire supply chain, with recommendations specific to packaging materials, transportation facilities, and storage management. Furthermore, the need for an integrated management system is emphasized, spanning from source cell collection to the final application. This system is crucial for maintaining the traceability and accountability of source cells, facilitating the sharing, distribution, and utilization on a global scale, and supporting to advance organoid research and development.