• Title/Summary/Keyword: Dissipation

Search Result 3,423, Processing Time 0.029 seconds

Design of the Heat Dissipation Rate of Automotive Radiation (I) Analysis of Heat Dissipation (자동차용 라디에이터의 방열성능설계에 관한 연구 (I)방열성능의 해석)

  • 정종수;이춘식
    • Journal of the korean Society of Automotive Engineers
    • /
    • v.11 no.5
    • /
    • pp.65-75
    • /
    • 1989
  • A method for analyzing the heat dissipation rates of automotive radiators has been proposed and also a new model equation of heat transfer rate of louvered fins has been proposed and tested. With the method, the effect of various design parameters on the performance of a radiator has also been studied. The proposed model equation for air-side heat transfer has made fair predictions which agree well with the experiments. Also the design value of heat dissipation rate with various fin pitches and radiator size has a good agreement with the heat dissipation of the commercial automotive radiators. Thus, the method of analyzing the radiator performance proposed in this study might be used to design new automotive radiators.

  • PDF

Analysis of Forced Convection Heat Transfer for Axial Annular Flow of Giesekus Viscoelastic Fluid

  • Mohseni, Mehdi Moayed;Rashidi, Fariborz;Movagar, Mohammad Reza Khorsand
    • Korean Chemical Engineering Research
    • /
    • v.53 no.1
    • /
    • pp.91-102
    • /
    • 2015
  • Analytical solutions for the forced convection heat transfer of viscoelastic fluids obeying the Giesekus model are obtained in a concentric annulus under laminar flow for both thermal and hydrodynamic fully developed conditions. Boundary conditions are assumed to be (a) constant fluxes at the walls and (b) constant temperature at the walls. Temperature profiles and Nusselt numbers are derived from dimensionless energy equation. Subsequently, effects of elasticity, mobility parameter and viscous dissipation are discussed. Results show that by increasing elasticity, Nusselt number increases. However, this trend is reversed for constant wall temperature when viscous dissipation is weak. By increasing viscous dissipation, the Nusselt number decreases for the constant flux and increases for the constant wall temperature. For the wall cooling case, when the viscous dissipation exceeds a critical value, the generated heat overcomes the heat which is removed at the walls, and fluid heats up longitudinally.

Minimum Heat Dissipation of HTS Current Lead Having Partial Current Sharing Region (일부 전류분류영역을 가짐으로서 최소 열손실을 갖는 초전도 전류도입선)

  • Seol, S.Y.;Her, K.S.
    • Proceedings of the KSME Conference
    • /
    • 2001.11b
    • /
    • pp.131-136
    • /
    • 2001
  • In this paper, a high-temperature superconductor(HTS) current lead operating in current sharing mode is described. The minimum heat dissipation and the optimum safety factor(cross-sectional area) is obtained analytically for partial current sharing HTS leads. It is assumed that the current lead is in conduction cooled state, and the sheath material is the alloy of silver and gold. The reduced cross-sectional area results partial current sharing state, and consequently reduces conduction heat transfer, but the Joule heat generation is increased. The optimized HTS current lead is different from the conventional copper leads. In the copper leads, the minimum heat dissipation is obtained for the zero gradient of temperature at warm end. However, the temperature gradient at warm end is not zero when the HTS lead operates at minimum dissipation state.

  • PDF

Energy dissipation of steel-polymer composite beam-column connector

  • Wang, Yun-Che;Ko, Chih-Chin
    • Steel and Composite Structures
    • /
    • v.18 no.5
    • /
    • pp.1161-1176
    • /
    • 2015
  • The connection between a column and a beam is of particular importance to ensure the safety of civil engineering structures, such as high-rise buildings and bridges. While the connector must bear sufficient force for load transmission, increase of its ductility, toughness and damping may greatly enhance the overall safety of the structures. In this work, a composite beam-column connector is proposed and analyzed with the finite element method, including effects of elasticity, linear viscoelasticity, plasticity, as well as geometric nonlinearity. The composite connector consists of three parts: (1) soft steel; (2) polymer; and (3) conventional steel to be connected to beam and column. It is found that even in the linear range, the energy dissipation capacity of the composite connector is largely enhanced by the polymer material. Since the soft steel exhibits low yield stress and high ductility, hence under large deformation the soft steel has the plastic deformation to give rise to unique energy dissipation. With suitable geometric design, the connector may be tuned to exhibit different strengths and energy dissipation capabilities for real-world applications.

Identification of ambient pore pressure and rigidity index from piezocone dissipation test (피에조콘 소산시험을 이용한 평형간극수압과 강성지수의 역해석)

  • 김영상
    • Proceedings of the Korean Geotechical Society Conference
    • /
    • 2002.03a
    • /
    • pp.49-54
    • /
    • 2002
  • This paper describes a systematic way of simultaneously identifying the ambient pore pressure and the rigidity index (=G/s$\_$u/) of soil by applying an optimization technique to the piezocone dissipation test result. An ambient pore pressure and optimal rigidity index were determined by minimizing the differences between theoretical excess pore pressures developed by Randolph & Wroth(1979) and measured excess pore pressures from piezocone using optimization technique. The effectiveness of the proposed back-analysis method was examined against the well-documented performance of piezocone dissipation tests (Tanaka & Sakagami, 1989), from the viewpoints of proper determination of selected target parameters and saving of test duration. It is shown that the proposed back-analysis method can evaluate properly the ambient pore pressure and the rigidity index by using only the early phase of the dissipation test data. Also, it is shown that with the optimized rigidity index and ambient pore pressure the proposed back-analysis method permits the horizontal coefficient of consolidation to be identified rationally.

  • PDF

Dissipation Effect in Causal Maps as a Source of Communication Problem

  • Kim, Dong-Hwan
    • Korean System Dynamics Review
    • /
    • v.6 no.1
    • /
    • pp.5-15
    • /
    • 2005
  • This paper investigates psychological differences between constructors and interpreters of causal maps. This paper argues that dissipation effects and dilution effects applies to those who are to interpret causal maps not to those who construct them. Dissipation effects are psychological tendency that people perceive causal effect as weak as the number of causal links increases. Dilution effects occur when people undervalue the strength of causal relation as the number of causal variables increases. Experimental results show that concentration effects opposite to the dissipation effects and dilution effects explain more correctly the perception of constructors of causal maps. This paper points out that this asymmetric psychological tendencies between constructors and interpreters of causal maps is the psychological source of the communication problems between systems thinkers and their clients.

  • PDF

An effect of Radiation Heat Transfer on the Thermal Dissipation from the Electronic Chip in an Enclosure (밀폐공간에 놓인 전자 칩의 열발산에 복사 열전달이 미치는 영향)

  • Choi, In-Su
    • Journal of the Korean Society of Industry Convergence
    • /
    • v.12 no.4
    • /
    • pp.179-186
    • /
    • 2009
  • Electronic components in an enclosure have been investigated to prevent undesired thermal problems. The electronic devices, such as ECUs of automotive engines, are operated under the contaminated environments, so that they rely on the passive cooling without any fluid-driving methods. Therefore the radiation heat dissipation plays more important role than the conduction and convection heat transfer. Hence their combined heat dissipation phenomena have been simulated by a numerical model to reveal the effects of supplied heat flux, emissivity of material, geometry of enclosure, charging gas and pressure. The result showed that the radiation had a significant effect on the heat dissipation of module in an enclosure, and some space above the module should be reserved to prevent its thermal problem. In addition, the higher thermal conductivity and pressure of gas in an enclosure could be necessary to improve the thermal dissipation from the electronic devices.

  • PDF

Application of Energy Dissipation Capacity for Nonlinear Analysis (비선형 해석을 위한 에너지 소산 산정법의 활용)

  • 임혜정;박홍근;엄태성
    • Proceedings of the Earthquake Engineering Society of Korea Conference
    • /
    • 2003.09a
    • /
    • pp.172-179
    • /
    • 2003
  • In the performance based seismic design method such as the capacity spectrum method, it is required to estimate precisely strength, deformability and energy dissipation of the member. However it merely depends on empirical equations which are not exact in the estimation of energy dissipation capacity. It is same to the generously used computer programs for nonlinear analysis such as DRAIN-2DX. On the other hand, simple equations for evaluating energy dissipation were developed in a recent study, In this paper, based on the evaluation method, a new cyclic behavior model for a flexure-dominated RC member is proposed. Although this model is simplified, it can accurately reflect the variation of energy dissipation capacity with design parameters. Using this model, a program for the nonlinear static/dynamic analysis of RC moment frame structures is also developed.

  • PDF

A novel approach for designing of variability aware low-power logic gates

  • Sharma, Vijay Kumar
    • ETRI Journal
    • /
    • v.44 no.3
    • /
    • pp.491-503
    • /
    • 2022
  • Metal-oxide-semiconductor field-effect transistors (MOSFETs) are continuously scaling down in the nanoscale region to improve the functionality of integrated circuits. The scaling down of MOSFET devices causes short-channel effects in the nanoscale region. In nanoscale region, leakage current components are increasing, resulting in substantial power dissipation. Very large-scale integration designers are constantly exploring different effective methods of mitigating the power dissipation. In this study, a transistor-level input-controlled stacking (ICS) approach is proposed for minimizing significant power dissipation. A low-power ICS approach is extensively discussed to verify its importance in low-power applications. Circuit reliability is monitored for process and voltage and temperature variations. The ICS approach is designed and simulated using Cadence's tools and compared with existing low-power and high-speed techniques at a 22-nm technology node. The ICS approach decreases power dissipation by 84.95% at a cost of 5.89 times increase in propagation delay, and improves energy dissipation reliability by 82.54% compared with conventional circuit for a ring oscillator comprising 5-inverters.

Effect of two temperature and energy dissipation in an axisymmetric modified couple stress isotropic thermoelastic solid

  • Lata, Parveen;Kaur, Harpreet
    • Coupled systems mechanics
    • /
    • v.11 no.3
    • /
    • pp.199-215
    • /
    • 2022
  • The present paper deals with the axisymmetric deformation in homogeneousisotropic thermoelastic solid with two temperatures, with and without energy dissipation using modified couple stresstheory. The effect of energy dissipation and two temperature isstudied due to the concentrated normalforce, normalforce overthe circularregion, thermal pointsource and thermalsource over the circular region. The Laplace and Hankel transform techniques have been used to find the solution to the problem. The displacement components, conductive temperature distribution, stress components and couple stress are computed in the transformed domain and further calculated in the physical domain using numerical inversion techniques. Effects of two temperature and energy dissipation on the conductive temperature,stress components and couple stress are depicted graphically.