• Korean Journal of Optics and Photonics
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• v.9 no.1
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• pp.38-46
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• 1998

In this study, the color reproduction algorithm considering both of luminace and chromaticity of the background light is presented and tested to BT-H 1450 monitor(Panasonic). In the case of neglecting the background effect, the Macbeth ColorChecker's 24 colors are reproduced with the average color difference ${\Delta}E_{ab}^{*}$ more than 9.0. By using this method, the average color difference ${\Delta}E_{ab}^{*}$ is decreased less than 1.0. From this study, we can find that both of luminance and chromaticity of background light are very important factors in the color reproduction on a CRT display.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.79-84
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• 2017

This paper outlines the Taguchi optimization methodology, which is applied to optimize cutting parameters in end milling when machining STS304 with TiAlN coated SKH59 tool under up and down end milling conditions. The end milling parameters evaluated are depth of cut, spindle speed and feed rate. An orthogonal array, signal-to-noise (S/N) ratio and analysis of variance (ANOVA) are employed to analyze the effect of these end milling parameters. The Taguchi design is an efficient and effective experimental method in which a response variable can be optimized, given various control and noise factors, using fewer resources than a factorial design. An orthogonal array of $L_9(33)$ was used. The most important input parameter for cutting force, however, is the feed rate, and depending on the cutter rotation direction. Finally, confirmation tests verified that the Taguchi design was successful in optimizing end milling parameters for cutting force.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.20-24
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• 2017

For process improvement and cutting down on expenses in solar cell industry, it is necessary to improve recycling process of wafer manufacturing. In this research, a study is introduced to develop classifier which is for recycling of abrasive. First of all, recycling process of wafer manufacturing is analyzed. And then, 3 steps of experiments such as oil removal, impurities removal and classification were executed. For the classification of slurry, a classifier is designed and manufactured. From experiments, it is verified that ultra sound vibration and flux are very important factors for classification. By experiencing the recycling processes and making devices, the technique can be initiated industry if needed such as decreasing waste and cutting down on expenses.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.131-135
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• 2021

Numbers of studies related to optimization of design of organic light emitting diodes(OLED) through machine learning are increasing. We propose the generative method of the image to assess the performance of the device combining with machine learning technique. Principle parameter regarding dark spot growth mechanism of the OLED can be the key factor to determine the long-time performance. Captured images from actual device and randomly generated images at specific time and initial pinhole state are fed into the deep neural network system. The simulation reinforced by the machine learning technique can predict the device parameters accurately and faster. Similarly, the inverse design using multiple layer perceptron(MLP) system can infer the initial degradation factors at manufacturing with given device parameter to feedback the design of manufacturing process.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.161-166
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• 2021

To prevent accidents caused by changes in the surrounding environment or other factors, various protection facilities are installed at the photovoltaic connection module. The main causes of fire are sparks due to foreign substances inside the photovoltaic connection module through high temperature rise and dew condensation in the photovoltaic connection module, and fire due to heat from the power diode. The proposed method can predict the fire by measuring flame, carbon dioxide, carbon monoxide, temperature, humidity, input voltage, and current on the photovoltaic connection module, and when the fire conditions are reached, fire alarm and power off can be sent to managers and users in real time to prevent fire in advance.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.14-18
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• 2021

Electric Vehicle industry requires high technologies to stabilize apparatuses for the Coolant heater manufacturing. Vibrations of Leak Machine are one of the most critical factors for causing delivered of the defective product or poor inspection, which are the main reasons of the defects. In this study, the structure of the Leak Machine was analyzed through the experiment and the computer simulation to investigate the main reasons of the vibrations, and further to alter the design for the improved stability. And that design alterations were applied to the machine to identify the effects of those alterations. The result of the study shows that design alterations of the Leak Machine can effectively suppress about 97.8% of the vibrations, and further can improving the Inspection precision of the Coolant heater.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.62-66
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• 2022

Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.17-21
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• 2022

In the case of the manufacturing industry that produces high-tech components such as semiconductors and large flat panel displays, the manufacturing space is made into a cleanroom to increase product yield and reliability, and various environmental factors have been managed to maintain the environment. Among them, airborne particle is a representative management item enough to be the standard for actual cleanroom grade, and a sequential particle monitoring system is usually used as one parts of the FMS (Fab or Facility monitoring system). However, this method has a problem in that the measurement efficiency decreases as the length of the sampling tube increases. In this study, in order to solve this problem, a multiple regression model was created. This model can correct the measurement error due to the decrease in efficiency by sampling tube length.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.88-93
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• 2023

In software engineering, requirement analysis is an important task throughout the process and takes up a high proportion. However, factors that fail to analyze requirements include communication failure, different understanding of the meaning of requirements, and failure to perform requirements normally. To solve this problem, we derived actors and behaviors using morpheme analysis and BERT algorithms in the Korean requirement document and constructed them as ontologies. A chatbot system with ontology data is constructed to derive a final system event list through Q&A with users. The chatbot system generates the derived system event list as a requirement diagram and a requirement specification and provides it to the user. Through the above system, diagrams and specifications with a level of coverage complied with Korean requirement documents were created.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.