• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.9
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• pp.717-723
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• 2009

Ni/Al ('/' denotes deposition sequence) contacts were deposited on Al-implanted 4H-SiC for ohmic contact formation, and the conduction properties were characterized and compared with those of Ni-only contacts. The thicknesses of the Ni and Al thin film were 30 nm and 300 nm, respectively, and the films were sequentially deposited bye-beam evaporation without vacuum breaking. Rapid thermal anneal (RTA) temperature was varied as follows : $840^{\circ}C$, $890^{\circ}C$, and $940^{\circ}C$. The specific contact resistivity of the Ni contact was about $^{\sim}2\;{\pm}\;10^{-2}\;{\Omega}{\cdot}cm^2$, However, with the addition of Al overlayer, the specific contact resistivity decreased to about $^{\sim}2\;{\pm}\;10^{-4}\;{\Omega}{\cdot}cm^2$, almost irrespective of RTA temperature. X-ray diffraction (XRD) analysis of the Ni contact confirmed the existence of various Ni silicide phases, while the results of Ni/Al contact samples revealed that Al-contaning phases such as $Al_3Ni$, $Al_3Ni_2$, $Al_4Ni_3$, and $Ab_{3.21}Si_{0.47}$ were additionally formed as well as the Ni silicide phases. Energy dispersive spectroscopy (EDS) spectrum showed interfacial reaction zone mainly consisting of Al and Si at the contact interface, and it was also shown that considerable amounts of Si and C have diffused toward the surface. This indicates that contact resistance lowering of the Ni/Al contacts is related with the formation of the formation of interfacial reaction zone containing Al and Si. From these results, possible mechanisms of contact resistance lowering by the addition of Al were discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.114-114
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• 2008

반도체 device의 성능을 향상시키기 위하여 패턴은 더욱 더 고 집적화 되고 배선 또한 다층배선 구조를 가지게 되었으며 요구되는 선폭 또한 더욱 미세화 되어 CMP 공정이 도입되게 되었다. 이러한 CMP 공정에 사용되는 소모품으로는 크게 세 가지의 중요한 부분으로 나눌 수 있다. 그것은 slurry와 pad, conditioner이다. 그중에 pad conditioning 공정은 CMP 공정시 pad의 마모에 따라 감소하는 removal rate(RR)값을 회복시키기 위한 공정으로 마모된 pad의 표면을 활성화 시켜주는 중요한 공정이다. 하지만 pad conditioning 공정을 장시간 진행하게 되면 conditioner 표면에 오염물이 발생하게 되며, 오염물로 인하여 wafer표면에 scratch 및 defect을 발생시키는 원인이 될 수 있다. 이러한 문제점을 보완하기 위하여 conditioner의 표면을 변화시켜 공정중의 오염이 발생하지 않도록 하는 것이 중요하다. 본 논문에서는 oxide CMP 실험을 통하여 conditioner표면에 오염물이 발생함을 확인하였으며 energy dispersive spectroscopy(EDS) 분석을 통하여 주오염물의 성분이 oxide slurry중 silica임을 확인하였다. Conditioner의 표면을 소수성으로 만들기 위하여 self assembled monolayer(SAM) 방법을 이용하여 표면에 코팅을 하였으며, 소수성 박막이 코팅된 conditioner와 코팅되지 않은 conditioner의 비교 실험을 통하여 오염 정도를 비교하였다.

• Nuclear Engineering and Technology
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• v.40 no.3
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• pp.225-232
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• 2008

To understand the effect of the cyclic strain rate on the environmentally assisted cracking behaviors of SA508 Gr.1a low alloy steel in deoxygenated water at $310^{\circ}C$, the fatigue surface and a sectioned area of specimens were observed after low cycle fatigue tests. On the fatigue surface of the specimen tested at a strain rate of 0.008 %/s, unclear ductile striations and a blunt crack tip were observed. Therefore, metal dissolution could be the main cracking mechanism of the material at this strain rate. On the other hand, on the fatigue surfaces of the specimens tested at strain rates of 0.04 and 0.4 %/s, brittle cracks and flat facets, which are evidences of the hydrogen induced cracking, were observed. In addition, a tendency of linkage between the main crack and the micro-cracks was observed on the sectioned area. Therefore, at higher strain rates, the main cracking mechanism could be hydrogen induced cracking. Additionally, evidence of the dissolved MnS inclusions was observed on the fatigue surface from energy dispersive x-ray spectrometer analyses. Thus, despite the low sulfur content of the test material, the sulfides seem to contribute to environmentally assisted cracking of SA508 Gr.1a low alloy steel in deoxygenated water at $310^{\circ}C$.

• Journal of Hydrogen and New Energy
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• v.24 no.1
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• pp.61-69
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• 2013

Polymer exchange membrane (PEM) fuel cells have multifunctional properties, and bipolar plates are one of the key components in these fuel cells. Generally, a bipolar plate has a gas flow path for hydrogen and oxygen liberated at the anode and cathode, respectively. In this study, the influence of iodine applied to a bipolar plate was investigated. Accordingly, we compared bipolar plates with and without iodine coating, and the performances of these plates were evaluated under operating conditions of $75^{\circ}C$ and 100% relative humidity. The membrane and platinum-carbon layer were affected by the iodine-coated bipolar plate. Bipolar plates coated with iodine and a membrane-electrode assembly (MEA) were investigated by electron probe microanalyzer (EPMA) and energy-dispersive x-ray spectroscopy (EDS) analysis. Polarization curves showed that the performance of a coated bipolar plate is approximately 19% higher than that of a plate without coating. Moreover, electrochemical impedance spectroscopy (EIS) analysis revealed that charge transfer resistance and membrane resistance decreased with the influence of the iodine charge transfer complex for fuel cells on the performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.7
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• pp.503-509
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• 2013

In this study, $Cu(In_{1-x},Ga_x)Se_2$ (CIGS) thin films were prepared on the Mo coated soda-lime glass by the DC magnetron sputtering and a subsequent selenization process. For the selenization process, selenization rapid thermal process(RTP) with cracker cell, which was helpful to smaller an atomic of Se, was adopted. To make CIGS layer, they were then annealed with the cracked Se. Based on this selenization method, we made several CIGS thin film and investigated the effects of In deposition time, and selenization time. Through x-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and atomic force microscopy (AFM), it is found that the Mo/In/CuGa structure and the high sputtering power shows the dominant chalcopyrite structure and have a uniform distribution of the grain size. The CIGS films with the In deposition time of 5 min has the best structure due to the smooth surface. And CIGS films with the selenization time of 50 min show good crystalline growth without any voids.

• Tribology and Lubricants
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• v.35 no.1
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• pp.9-15
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• 2019

Graphene is a fascinating material for fabricating flexible and transparent devices owing to its thickness and mechanical properties. To utilize graphene as a core material for devices, the transfer process of graphene is an inevitable step. The transfer process can be classified into wet and dry methods depending on the surrounding environment. The adhesion between graphene and a target substrate determines the success or failure of the transfer process. As the surface energy of graphene is an important parameter that provides adhesion, it is useful to estimate the surface energy to understand the mechanisms of the transfer process. However, the exact surface energy of graphene is still disputed because the wetting transparency of graphene depends on the polarity of the liquid and target substrate. Previously reported results use graphene transferred by the wet method. However, there are few reports on the surface energy of graphene transferred by the dry method. In this study, the surface energy of graphene transferred by the wet and dry methods is estimated. Wetting transparency occurs for certain combinations of liquids and substrates. For graphene on a polar substrate, the surface energy decreases by 25 and 35% for the wet and dry transfer methods, respectively. However, the surface energy of graphene on dispersive substrates decreases by ~10% regardless of the transfer method. In conclusion, the surface energy of graphene is $36{\sim}38mJ/m^2$, and differs depending on the transfer method and polarity of the substrate.

• Journal of Powder Materials
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• v.28 no.6
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• pp.462-469
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• 2021

Tin/graphite composites are prepared as anode materials for Li-ion batteries using a dry ball-milling process. The main experimental variables in this work are the ball milling time (0-8 h) and composition ratio (tin:graphite=5:95, 15:85, and 30:70 w/w) of graphite and tin powder. For comparison, a tin/graphite composite is prepared using wet ball milling. The morphology and structure of the different tin/graphite composites are investigated using X-ray diffraction, Raman spectroscopy, energy-dispersive X-ray spectroscopy, and scanning and transmission electron microscopy. The electrochemical properties of the samples are also examined. The optimal dry ball milling time for the uniform mixing of graphite and tin is 6 h in a graphite-30wt.%Sn sample. The electrode prepared from the composite that is dry-ball-milled for 6 h exhibits the best cycle performance (discharge capacity after 50^th cycle: 308 mAh/g and capacity retention: 46%). The discharge capacity after the 50^th cycle is approximately 112 mAh/g, higher than that when the electrode is composed of only graphite (196 mAh/g after 50^th cycle). This result indicates that it is possible to manufacture a tin/graphite composite anode material that can effectively buffer the volume change that occurs during cycling, even using a simple dry ball-milling process.

• Journal of the Korean Society of Propulsion Engineers
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• v.26 no.1
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• pp.1-11
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• 2022

In a gas turbine, fuel is exposed to a high temperature environment until it is fed to the combustor through the injector. Hydrocarbon fuels can coke under high temperature conditions, which can cause coking material to deposit on fuel lines or block the injector passages. In this study, a specimen simulating a fuel line located inside a gas turbine and Jet A-1 were heated using electric devices. Jet A-1 coking tests were performed by changing the wall temperature of the stainless steel specimen and the temperature of Jet A-1 supplied to the specimen. After the coked specimens were cut, the coking material and the inner surface were analyzed using an energy dispersive X-ray spectrometer and a field emission scanning electron microscope.

• Restorative Dentistry and Endodontics
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• v.46 no.1
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• pp.1.1-1.13
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• 2021

Objectives: The aim of this study was to evaluate the dystrophic mineralization deposits from 3 calcium silicate-based cements (Micro-Mega mineral trioxide aggregate [MM-MTA], Biodentine [BD], and EndoSequence Root Repair Material [ESRRM] putty) over time after subcutaneous implantation into rats. Materials and Methods: Forty-five silicon tubes containing the tested materials and 15 empty tubes (serving as a control group) were subcutaneously implanted into the backs of 15 Wistar rats. At 1, 4, and 8 weeks after implantation, the animals were euthanized (n = 5 animals/group), and the silicon tubes were removed with the surrounding tissues. Histopathological tissue sections were stained with von Kossa stain to assess mineralization. Scanning electron microscopy and energy-dispersive X-ray spectroscopy (SEM/EDX) were also used to assess the chemical components of the surface precipitates deposited on the implant and the pattern of calcium and phosphorus distribution at the material-tissue interface. The calcium-to-phosphorus ratios were compared using the non-parametric Kruskal-Wallis test at a significance level of 5%. Results: The von Kossa staining showed that both BD and ESRRM putty induced mineralization starting at week 1; this mineralization increased further until the end of the study. In contrast, MM-MTA induced dystrophic calcification later, from 4 weeks onward. SEM/EDX showed no statistically significant differences in the calcium- and phosphorus-rich areas among the 3 materials at any time point (p > 0.05). Conclusions: After subcutaneous implantation, biomineralization of the 3-calcium silicate-based cements started early and increased over time, and all 3 tested cements generated calcium- and phosphorus-containing surface precipitates.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.80-80
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• 2010

전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.