• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.266.1-266.1
• /
• 2013

Large-scale single-crystal organic nanowire arrays were generated using a direct printing method (liquidbridge- mediated nanotransfer molding) that enables the simultaneous synthesis, alignment and patterning of nanowires from molecular ink solutions. Using this method, single-crystal organic nanowires can easily be synthesized by self-assembly and crystallization of organic molecules within the nanoscale channels of molds, and these nanowires can then be directly transferred to specific positions on substrates to generate nanowire arrays by a direct printing process. Repeated application of the direct printing process can be used to produce organic nanowire-integrated electronics with two- or three-dimensional complex structures on large-area flexible substrates. This efficient manufacturing method is used to fabricate all-organic nanowire field-effect transistors that are integrated into device arrays and inverters on flexible plastic substrates.

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.11
• /
• pp.1256-1263
• /
• 2012

The present study covers the ultrasonic patterning process to replicate micro-patterns on a polymer substrate. The ultrasonic patterning process uses ultrasonic waves to generate frictional heat between an ultrasonic horn and the polymer substrate, from which the surface region of the polymer substrate is softened sufficiently for the replication of micro-patterns. The ultrasonic patterning process can divided into two categories according to the direction of vibration transmission: direct patterning and indirect patterning. The direct patterning uses a patterned horn, and the ultrasonic vibration is transferred directly from the patterned horn to the substrate. On the contrary, the indirect patterning process uses a plain horn, and the micro-patterns are engraved on a mold that is located below the substrate. Thus, the micro-patterns are replicated as an indirect manner. In this study, these direct and indirect patterning processes are compared in terms of the replication characteristics. Additionally, the possibility of double-side patterning is also discussed in comparison with the conventional single-side patterning process.

• Journal of Sensor Science and Technology
• /
• v.24 no.4
• /
• pp.215-218
• /
• 2015

As several innovative technologies for flexible electric devices are being realized, demand for in-situ strain monitoring for flexible electric devices is being emphasized. Because flexible devices are commonly influenced by substrate strain, suitable strain sensors for flexible devices are essential for the sophisticated maneuvering of flexible devices. In this study, a flexible strain sensor based on an Ag electrode is prepared on a polyimide substrate using the LDW (laser direct writing) process. In this process, first, the Ag nanoparticles are coated on the substrate and selectively sintered using a focused laser. Because of the advantages of the LDW process (such as being mask-less, using low temperatures, and having non-vacuum characteristics), the entire fabrication process has been dramatically simplified; as a final outcome, a highly reliable strain sensor has been fabricated. Using this strain sensor, various strain conditions that arise from different bending radii can be detected by measuring real-time electrical signals.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.16 no.9
• /
• pp.1788-1795
• /
• 1992

Numerical simulations have been performed to investigate various spectral estimators used in LDV signal processing. In order to simulate a particle arrival time statistics known as the doubly stochastic poisson process, an autoregressive vector model was adopted to construct a primary velocity field. The conditional Poisson process with a random rate parameter was generated through the rescaling time process using the mean value function. The direct transform based on random sampling sequences and the standard periodogram using periodically resampled data by the sample and hold interpolation were applied to obtain power spectral density functions. For low turbulent intensity flows, the direct transform with a constant Poisson intensity is in good agreement with the theoretical spectrum. The periodogram using the sample and hold sequences is better than the direct transform in the view of the stability and the weighting of the velocity bias for high data density flows. The high Reynolds stress and high fluctuation of the transverse velocity component affects the velocity bias which increases the distortion of spectral components in the direct transform.

• Transactions of Materials Processing
• /
• v.20 no.2
• /
• pp.118-123
• /
• 2011

Manufacturing of the bipolar plate of a direct methanol fuel cell (DMFC) by direct laser melting technology (DLM) was attempted. The DLM technology is highly influenced by process parameters such as laser power, scan rate and layering height. Therefore, an analysis of the DLM technology was performed under various conditions. The bipolar plates were fabricated using the DLM process with 316L stainless steel (STS 316L) plates and powder. Powder melting trials at various energy density were performed in order to select a feasible melting range for a given laser power. The melting line height increases and eventually saturates when the energy density increases, but decreases when the laser power increases at a given energy density. For the estimation of the potential performance of the bipolar plate, the surface roughness and contact resistance of the DLM layer were also analyzed. The changes of line height and thickness are useful information to report when manufacturing bipolar plate of fuel cell through the DLM process.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.13 no.2
• /
• pp.8-14
• /
• 2014

Many kinds of robots and machines have been developed to replace human laborin industrial and medical fields, as well as domestic life. In these applications, the device sneed to obtain environmental data using diverse sensors. Among such sensors, the tactile sensor is important because of its ability to get information regarding surface texture and force through the use of mechanical contact. In this research, a simple tactile sensor was developed using the direct writing of pressure sensitive material and layered fabrication of photocurable material. The body of the sensor was fabricated using layered fabrication, and pressure sensitive materials were dispensed between the layers using direct writing. We examined the line fabrication characteristics of the pressure sensitive material according to nozzle dispensing conditions. A simple $4{\times}4$ array flexible tactile sensor was successfully fabricated using the proposed process.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.22 no.5
• /
• pp.328-335
• /
• 2010

The purpose of this study is to make an analysis of influence on the cooling capacity and COP of a desiccant cooling system with a regenerative evaporative cooler when a direct evaporative cooler was applied to the inlet of regeneration process of this system. We used cycle simulation in order to analyze the performance of this system. From the cycle simulation, we knew that the optimal rotation time of desiccant rotor was between 160s and 220s and hardly ever affected cooling capacity of desiccant cooling system when this system was operated at the outdoor air condition of $35^{\circ}$ and 40% RH and low regeneration temperature of $60^{\circ}$. Also there was optimal area ratio of regeneration to dehumidification between 0.7 and 1.0. Our results showed that it had a small effect on the system’s cooling capacity to install direct evaporative cooler at the inlet of regeneration process.

• Transactions of Materials Processing
• /
• v.25 no.3
• /
• pp.195-202
• /
• 2016

Direct laser melting(DLM) is an additive manufacturing process that can produce parts by solidification of molten metallic powder layer by layer. The properties of the fabricated parts strongly depend on characteristics of the metallic powder. Atomized powders having spherical morphology have commonly been used for DLM. Mechanical ball-milling is a powder processing technique that can provide non-spherical solid powders without melting. The aim of the current study was to investigate the effect of powder morphologies on the deposition quality in DLM. To characterize the morphological effect, the performances of spherical and non-spherical powders were compared using both single- and multi-track DLM experiments. DLM experiments were performed with various laser process parameters such as laser power and scan rate, and the deposition quality was evaluated. The surface roughness, cross-section bead shape and process defects such as balling or non-filled area were compared and discussed in this study.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.7
• /
• pp.681-686
• /
• 2009

Direct laser metal forming technology was applied to restore the damaged mold surface. In order to estimate melting characteristics of the $20{\mu}m$ Fe-Cr-Ni powder, single layer experiments were performed at various levels of heat input. The process window of the $20{\mu}m$ Fe-Cr-Ni powder provided feasible process parameters for the smooth regular surface. The cross hatching scanning strategy on the multiple layer experiment was performed to reduce the thickness non-uniformity of edge portions compared with the one direction scanning. To estimate the coherence between the melted powder and the basematal, the tendency of hardness distribution has been observed. The hardness of the melted and the remelted zone was distributed from 400HV to 600HV. It is over 2 times compared of the hardness of the basemetal. Experimental results show that the mold restoring process using direct laser metal forming can be successfully applied in the mold repair industry.

• Journal of the Korea Society for Simulation
• /
• v.15 no.2
• /
• pp.51-57
• /
• 2006

Production environment of semiconductor industry is shifting from 200mm wafer process to 300mm wafer process. In the new era of semiconductor industry, FAB (fabrication) Line Automation is a key issue that semiconductor industry is facing in shifting from 200mm wafer fabrication to 300mm wafer fabrication. In addition, since the semiconductor manufacturing technologies are being widely spread and market competitions are being stiffened, cost-down techniques became basis of growth. Most companies are trying to reduce average cycle time to increase productivity and delivery time. In this paper, we simulated 300mm wafer fabrication semiconductor manufacturing process by laying great emphasis on reduce average cycle time.