• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.641-641
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• 2013

We report the transparentsilver nanowire electrode fabricated by a direct printing process, liquid-bridge-mediated nanotransfer molding. We fabricated silver nanowire arrays by liquidbridge- mediated nanotransfer molding using the silver nanoparticle ink and PEDOT:PSS polymer. Weinvestigated the formation of silver nanowire arrays by SEM and transmittance of the transparent silver nanowire electrode. We also measured the conductivity to confirm the potential of our approach.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.126-126
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• 2010

대표적인 친환경 차단부로 Vacuum Interrupter(VI)를 에폭시 수지로 성형한 Embedded VI 의 적용이 확대되고 있다. 이러한 Embedded VI의 제작에 있어, 기존에는 대부분 VI의 Ceramic 표면과 에폭시 성형층의 계면에 고무재질의 완충층을 적용하는 방식으로 제작되었다. 본 연구에서는 이러한 완충층 형성시 발생되는 문제를 해결하기 위한 방법으로 VI외부에 추가적인 완충층을 형성하지 않고, 에폭시 수지를 성형하는 Direct Molding 방안을 제시하고. VI표면과 에폭시간에 화학적 결합 메커니즘을 도출하여 Direct Molding 을 적용한 Embedded VI의 제작기술을 개발하였다.

• 한국산학기술학회논문지
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• 제13권12호
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• pp.5709-5715
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• 2012

플라스틱 소재를 사용한 사출성형부품은 차량 경량화뿐만 아니라 충격흡수를 통한 운전자와 보행자 보호, 제품 디자인의 자율성등의 우수한 장점을 가지고 있어 그 사용량이 급속히 증가하고 있다. 유리섬유함유 플라스틱재료를 이용한 레귤레이터 레일의 사출성형시 불량률최소화를 위해 유한요소해석과 실험계획법을 사용하여 성형공정중의 휨변형량(warpage)과 수축변형를 최소화할 수 있는 최적의 성형조건을 제시하고자 한다. 또한 유리섬유의 유동성과 냉각효율의 확보를 위해 최적의 게이트 및 런너방식을 설정한다. 사출금형을 제작하여 제품을 성형제작한 후 휨변형등의 성능확인을 통해 해석방법의 유효성과 최적화의 실효성을 확인하고자 한다.

• 한국기계가공학회지
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• 제15권2호
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• 제어로봇시스템학회논문지
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• 제9권10호
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• pp.768-773
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• 2003

Injection molding has been widely used for the mass production of a plastic product. With the development of the relative technique, various injection molding techniques have been developed and we could get more precise plastic product. The temperature of a melting resin is an important factor in the injection molding and this temperature has direct influence on the quality of a plastic product. In the present injection molding machine, the deriation of a temperature controlled by PID control method is within 2$^{\circ}C$ in the injection molding machine but PID control method takes too much time to stabilize after preheating and its overshoot is so big. We applied fuzzy control to alleriate the problem. In this research, we experimented the fuzzy temperature control with the usage of PC based PLC.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.372-372
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• 2012

We have studied a fabrication of Poly (3,4-ethylenedioxythiophene) (PEDOT) wire arrays and structures with various feature sizes from hundreds micrometers to tens nanometers. PEDOT is well-known as a conducting material, can be grown by a vapor pressure polymerization (VPP) method. The VPP technique is a bottom-up processing method that utilizes the organic arrangement of macromolecules to easily produce ordered aggregates. Also, liquid-bridge-mediated nanotransfer molding (LB-nTM), which was reported as a new direct patterning method recently, is based on the direct transfer of various materials from a mould to a substrate through a liquid bridge between them. The PEDOT nanowires grown by VPP method and transferred on a substrate to use LB-nTM method have been investigated by Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Selected Area Electron Diffraction (SAED), X-Ray Diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS), and electrical properties.

• 품질경영학회지
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• 제29권3호
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• pp.86-96
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• 2001

The objective of this research is to develop a robust design methodology for plastic injection molded parts wherein warpage will be minimized by a complex method which is a kind of a simple direct search method. The design space considered for optimization is divided Into two sub-design space : mold and process conditions. Warpage is quantified using the Moldflow injection molding simulation software. The design methodology was applied to an actual part of a fax machine, the Guide-ASF model, through two different design policies. The significance of this study is the synthesis of a computer simulation of injection molding process and optimization technique to determine the optimal robust design solution.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.317-318
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.609-610
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• 2012

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.214-219
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• 2005

Pressure distribution in the cavity during injection molding affects part quality. In this study pressure distributions in the runner, near gate in the cavity, and end of ail in the cavity have been measured using direct pressure sensors for various molding conditions. Molding conditions were injection speed, injection pressure, packing time from filing stage, and packing pressure. Through experiments it was realized that the packing time from filling stage and packing pressure are the dominant factors on the part quality such as part shrinkage. Experimental results have been compared with computer simulations.