• 한국정밀공학회지
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• 제24권6호
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• pp.113-120
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• 2007

Chemical vapor deposition (CVD) is one of the various synthesis methods that have been employed for carbon nanotube (CNT) growth. In particular, Ren et al reported that large areas of vertically aligned multi-wall carbon nanotubes could be grown using a direct current (dc) PECVD system. The synthesis of CNT requires a metal catalyst layer, etchant gas, and a carbon source. In this work, the substrates consists of Si wafers with Ni-deposited film. Ammonia $NH_3$) and acetylene ($C_2H_2$) were used as the etchant gases and carbon source, respectively. Pretreated conditions had an influence on vertical growth and density of CNTs. And patterned growth of CNTs could be achieved by lithographical defining the Ni catalyst prior to growth. The length of single CNT was increased as niclel dot size increased, but the growth rate was reduced when nickel dot size was more than 200 nm due to the synthesis of several CNTs on single Ni dot. The morphology of the carbon nanotubes by TEM showed that vertical CNTs were multi-wall and tip-type growth mode structure in which a Ni cap was at the end of the CNT.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.657-662
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• 2005

In this study, the deposition of micrometer-scale metallic interconnects on LCD glass for the repair of open-circuit type defects is investigated. Although there had been a few studies Since 1980 s for the deposition of metallic interconnects by laser-induced chemical vapor deposition, those studies mostly used continuous wave lasers. In this work, a third harmonic Nd:YLF laser (351nm) of high repetition rates, up to 10 KHz, was used as the illumination source and $W(CO)_6$ was selected as the precursor. General characteristics of the metal deposit (tungsten) such as height, width, morphology as well as electrical properties were examined for various process conditions. Height of the deposited tungsten lines ranged from 35 to 500 nm depending on laser power and scan speed while the width was controlled between $3\~50{\mu}$ using a slit placed in the beam path. The resistivity of the deposited tungsten lines was measured to be below 1 $O\cdot{\mu}m$, which is an acceptable value according to the manufacturing standard. The tungsten lines produced at high scan speed had good surface morphology with little particles around the patterns. Experimental results demonstrated that it is likely that the deposit forms through a hybrid process, namely through the combination of photolytic and pyrolytic mechanisms.

• 전기화학회지
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• 제11권4호
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• pp.262-267
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• 2008

직접개미산 연료전지의 전극 촉매로 사용되는 귀금속 백금-루테늄 촉매를 정전분무법을 이용하여 효율적으로 분산하여 보았다. 전극에 도포된 촉매 양은 분사 시간에 따라 증가하였으나, 분사시간이 80분을 넘는 경우 촉매 응집으로 인하여 연료전지 성능은 감소하는 경향을 보였다. 상용 핸드스프레이로 전극 촉매를 $3.0\;mg/cm^2$ 분산한 경우 얻은 최대 출력밀도 $74\;mW/cm^2$와 비교하여 정전분무법은 적은 양인 $1.85\;mg/cm^2$의 촉매를 분산하고도 $72\;mW/cm^2$의 최대 출력밀도를 얻을 수 있었다.

• 한국산학기술학회논문지
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• 제19권10호
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• pp.346-351
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• 2018

금속 3D 프린팅 기술은 레이저 빔의 초점에 금속분말을 주입하는 방식에 따라 대표적으로 PBF(Powder Bed Fusion)방식과 DED(Direct Energy Deposition)방식으로 나뉜다. DED 방식은 금속 분말 도포와 동시에 레이저를 조사하여 3차원 구조물을 제작하는 금속 3D 프린팅 기술이고, PBF 방식은 일정 높이로 3차원 그래픽을 슬라이싱 한 후 한 층씩 금속 분말을 적층하여 레이저를 이용해 3차원 구조물을 제조하는 방식이다. DED 방식을 사용하면 레이저 클래딩, 금속 용접 등에는 강점을 가지지만 3D 형상을 제작할 경우 밀도가 낮아지는 문제점이 발생한다. DED 방식에서의 구조체 밀도 문제를 해결하기 위해 PBF 방식을 도입하면 상대적으로 밀도가 높은 3차원 구조물을 제작하는데 용이하다. 본 논문에서는 갈바노 스캐너와 광섬유로 전송되는 Nd:YAG 레이저 빔을 이용한 약 $30{\mu}m$ 크기의 스테인리스 강 분말을 이용하는 PBF 방식의 3차원 프린터를 제작하고, 이를 이용하여 얇은 금속 구조물을 제작하였다. 또한 레이저의 조사 횟수, 출력, 초점 크기, 스캐닝 속도에 따른 선폭의 최적조건을 찾았으며, 그 결과 최적 조건은 레이저 조사 횟수 2회, 출력 30 W, 초점 크기 $28.7{\mu}m$, 스캐닝 속도 200 mm/s에서 최소 선폭은 약 $85.3{\mu}m$로 측정되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.375-375
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• 2012

Graphene is a sp2-hybridized carbon sheet with an atomic-level thickness and a wide range of graphene applications has been intensely investigated due to its unique electrical, optical, and mechanical properties. In particular, hybrid graphene structures combined with various nanomaterials have been studied in energy- and sensor-based applications due to the high conductivity, large surface area and enhanced reactivity of the nanostructures. Conventional metal-catalytic growth method, however, makes useful applications difficult since a transfer process, used to separate graphene from the metal substrate, should be required. Recently several papers have been published on direct graphene growth on the two dimensional planar substrates, but it is necessary to explore a direct growth of hierarchical nanostructures for the future graphene applications. In this study, uniform graphene layers were successfully synthesized on highly dense dielectric nanowires (NWs) without any external catalysts. We also demonstrated that the graphene morphology on NWs can be controlled by the growth parameters, such as temperature or partial pressure in chemical vapor deposition (CVD) system. This direct growth method can be readily applied to the fabrication of nanoscale graphene electrode with designed structures because a wide range of nanostructured template is available. In addition, we believe that the direct growth growth approach and morphological control of graphene are promising for the advanced graphene applications such as super capacitors or bio-sensors.

• Journal of Electrical Engineering and Technology
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• 제7권3호
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• pp.396-400
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• 2012

Novel fabrication method of nanobridge array of various materials was proposed using suspended silicon nanowire array as a sacrificial template structure. Nanobridges of various materials can be simply fabricated by direct deposition with thermal evaporation on the top of prefabricated suspended silicon nanobridge arrays, which are used as a sacrificial structure. Since silicon nanowire can be easily removed by selective dry etching, nanobridge arrays of an intended material are finally obtained. In this paper, metal nanobridges of Ti/Au, around 50-200 nm in thickness and width, 5-20 ${\mu}m$ in length were fabricated to prove the advantages of the proposed nanowire or nanobridge fabrication method. The nanobridges of Ti/Au after complete removal of sacrificial silicon nanowire template were well-established and bending of nanobridge caused by the tensile stress was observed after silicon removing. Up to 50 nm and 10 ${\mu}m$ of silicon nanowire in diameter and length respectively was also very useful for nanowire templates.

• 드라이브 ㆍ 컨트롤
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• 제16권3호
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• pp.42-50
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• 2019

3D printing AM processes have advantages in complex shapes, customized fabrication and prototype development stage. However, due to various parameters based on both the machine and the material, the AM process can produce finished output after several trials and errors in the initial stage. As such, minimizing or optimizing negative factors for various parameters of the 3D printing AM process could be a solution to reduce the trial-and-error failures in the early stages of such an AM process. In addition, this can be largely solved through software simulation in the preprocessing process of 3D printing AM process. Therefore, the objective of this study was to investigate a simulation technology for the AM software, especially Ansys Inc. The metal 3D printing AM process, the AM process simulation software, and the AM process simulation processor were examined. Through this study, it will be helpful to understand 3D printing AM process and AM process simulation processor.

• 드라이브 ㆍ 컨트롤
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• 제16권3호
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• pp.51-58
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• 2019

The objective of this study was to investigate a simulation technology for the AM field based on ANSYS Inc.. The introduction of metal 3D printing AM process, and the examining of the present status of AM process simulation software, and the AM process simulation processor were done in the previous study (part 1). This present study (part 2) examined the use of the AM process simulation processor, presented in Part 1, through direct execution of Topology Optimization, Ansys Workbench, Additive Print and Additive Science. Topology Optimization can optimize additive geometry to reduce mass while maintaining strength for AM products. This can reduce the amount of material required for additive and significantly reduce additive build time. Ansys Workbench and Additive Print simulate the build process in the AM process and optimize various process variables (printing parameters and supporter composition), which will enable the AM to predict the problems that may occur during the build process, and can also be used to predict and correct deformations in geometry. Additive Science can simulate the material to find the material characteristic before the AM process simulation or build-up. This can be done by combining specimen preparation, measurement, and simulation for material measurements to find the exact material characteristics. This study will enable the understanding of the general process of AM simulation more easily. Furthermore, it will be of great help to a reader who wants to experience and appreciate AM simulation for the first time.

• 대한금속재료학회지
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• 제50권2호
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• pp.107-115
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• 2012

Direct laser melting (DLM) is a powder-based additive manufacturing process to produce parts by layer-by-layer laser melting. As the properties of the manufactured parts depend strongly on the deposited laser-melted bead, deposited layers obtained by the DLM process were characterized in this study. This investigation used a 200 W fiber laser to produce single-line beads under a variety of different energy distributions. In order to obtain a feasible range for the two main process parameters (i.e. laser power and scan rate), bead shapes of single track deposition were intensively investigated. The effects of the processing parameters, such as powder layer thickness and scan spacing, on geometries of the deposited layers have also been analyzed. As a result, minimum energy criteria that can achieve a complete melting have been suggested at the given powder layer thickness. The surface roughnesses of the deposited beads were strongly dependent on the overlap ratio of adjacent beads and on the energy distributions of laser power. Through microstructural analysis and hardness measurement, the morphological and mechanical properties of the deposited layers at various overlapped beads have also been characterized.

• 한국산학기술학회논문지
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• 제18권5호
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• pp.475-480
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• 2017

본 논문에서는 레이저 유도증착 공정을 사용하여 절연기판위에 미세패턴의 전도성 향상시켰다. 기존의 레이저 유도증착의 공정에서 발생하는 높은 레이저빔 에너지로 인하여, 미세패턴의 낮은 증착밀도, 산화와 같은 문제점이 있다. 이러한 문제점을 폴리머 코팅층을 사용하여 증착정밀도와 전도성 향상하였다. 실리콘 웨이퍼 위에 미세패턴 증착을 위해서 크롬, 구리를 사용하였다. 본 연구에서는 다중펄스 방식의 레이저 빔을 금속박막에 조사하여 절연기판(insulating substrate: $SiO_2$) 위에 시드 층을 형성하고, 형성된 시드 층위에 무전해 도금을 적용하여 미세패턴 및 구조물을 제작하는 복합공정기술을 개발하였다. 레이저빔의 다중 스캔방식으로 조사함으로서 레이저빔의 에너지가 증착 층의 증착밀도와 표면품위를 향상시키고, 미세전극 패턴으로 사용가능한 전기 전도성을 갖게 되었음 알 수 있었다. 레이저 직접묘화법과 무전해 도금을 적용한 복합공정을 이용하여 미세전극을 증착 한 후 비저항을 측정한 결과 도금 전 저항이 $6.4{\Omega}$, 도금 후의 저항이 $2.6{\Omega}$으로 미세전극 패턴의 표면조직이 균일하고 증착되었다. 표면조직이 균일하고 치밀하게 증착되었기 때문에 전기 전도도가 약 3배정도 향상되었다.