• Title/Summary/Keyword: Direct Fabrication

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Electrochemical Detection of Hydrogen Peroxide based on Hemoglobin-DNA/pyterpy Modified Gold Electrode (Hemoglobin-DNA/pyterpy 박막을 이용한 과산화수소의 전기화학적 검출)

  • Lee, Dong-Yun;Choi, Won-Suk;Park, Sang-Hyun;Kwon, Young-Soo
    • Proceedings of the KIEE Conference
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    • 2008.07a
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    • pp.1295-1296
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    • 2008
  • Hydrogen peroxide ($H_2O_2$) biosensor is one of the most developing sensors because this kind of sensors is highly selective and responds quickly to the specific substrate. Hemoglobin (Hb) has been used as ideal biomolecules to construct hydrogen peroxide biosensors because of their high selectivity to $H_2O_2$. The direct electron transfer of Hb has widely investigated for application in the determination of $H_2O_2$ because of its simplicity, high selectivity and intrinsic sensitivity. An electrochemical detection for hydrogen peroxide was investigated based on immobilization of hemoglobin on DNA/Fe(pyterpy)$^{2+}$ modified gold electrode. The pyterpy monolayers were firstly an electron deposition onto the gold electrode surface of the quartz crystal microbalance (QCM). It is offered a template to attach negatively charged DNA. The fabrication process of the electrode was verified by quartz crystal analyzer (QCA). The experimental parameters such as pH, applied potential and amperometric response were evaluated and optimized. Under the optimized conditions, this sensor shows the linear response within the range between $3.0{\times}10^{-6}$ to $9.0{|times}10^{-4}$ M concentrations of $H_2O_2$. The detection limit was determined to be $9{\times}10^{-7}$ M (based on the S/N=3).

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Effects of Beam Pulse Width and Power Density in Silver Nanowire Welding Using Pulsed IR Laser (적외선 레이저 공정을 통한 실버나노와이어 접합에서의 빔 펄스폭과 출력의 영향)

  • Kim, Joohan;Yoon, Sang Woo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.8
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    • pp.893-898
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    • 2014
  • A direct pulsed laser process for welding and networking silver nanowires was developed. The welded nanowire network demonstrated modified electrical properties in a transparent substance. In particular, the welding points on the nanowires were investigated to measure the resistance at the connections. The level of networking in nanowires was explored with respect to various laser pulse widths and average power densities. In particular, the influence of laser beam density was investigated in detail. Selective laser treatment can be advantageous in imparting customized local property changes in transparent conducting materials. Various applications of the process are also discussed in this paper.

Fabrication of Pt-Ru/C Composite Catalyst Electrodes by Electrophoresis Deposition Method for DMFC Fuel Cell and their Characteristics (전기영동법에 의한 직접메탄올 연료전지용 Pt-Ru/C 복합촉매 전극제조 및 특성평가)

  • Kim, Jeonghyun;Song, Minkyeong;Kim, Jinwoo;Yu, Yeontae
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.86.2-86.2
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    • 2011
  • 저온형 연료전지인 직접 메탄올 연료전지(Direct Methanol Fuel Cells, DMFC)는 친환경적인 발전 시스템, 높은 에너지 효율의 장점 때문에 주목을 받고 있으나 연료극의 촉매로 사용되는 금속은 고가의 귀금속인 Pt와 Ru가 요구되어 제조비용이 비싸기 때문에 촉매의 양을 줄이고, 반응 도중 생성되는 CO에 의한 촉매의 피독 문제 등 해결하여야 할 점이 산적해 있어 연료전지 중 촉매의 활성을 높이는 연구들이 활발히 이루어지고 있다. 종래의 MEA의 촉매층 제조공정은 우선 환원석출법에 의해 Pt-Ru/C를 합성하고 Nafion 용액에 혼합하여 Pt-Ru/C 슬러리를 제조한다. 이 방법에서는 carbon sheet에 spray 방법으로 Pt-Ru/C 촉매층이 만들어지기 때문에, Pt-Ru 촉매가 Nafion에 의해 부분적으로 매몰되어 촉매의 전기화학적 활성이 떨어지는 문제점이 있다. 이를 해결하는 방안으로 펄스전류를 이용하여 Pt-Ru 합금입자를 carbon sheet에 전기화학적으로 담지 시켜 Nafion에 매몰되는 것을 방지하는 펄스전해법 연구가 진행되고 있다. 그러나 촉매의 입자크기가 일반적으로 50~70 nm 이상으 크기 때문에 촉매의 낮은 활성이 문제점으로 야기되고 있다. 본 연구에서는 Pt-Ru/C 촉매층 제조 문제점을 해결하고, 촉매의 전기화학적 활성을 증가시키기 위해서 2~4 nm Pt-Ru 콜로이드를 전해액으로 사용하고, 전기영동법을 이용하여 Pt-Ru 나노 입자를 carbon sheet($1{\times}1cm^2$) 에 담지 시켰다. 전기영동법에서 균일한 Pt-Ru 촉매층의 제조를 위해 전류인가 방법으로는 펄스전류를 사용하였고, 실험변수로는 전해액 pH, duty cycle, 담지시간을 선정하였다. 합성된 Pt-Ru 콜로이드를 TEM분석으로 나노입자의 크기와 분산성 분석하였고, 콜로이드 나노입자의 표면전하 상태를 분석하기 위해 zeta-potential을 분석하였다. Pt-Ru/C의 촉매의 전기화학적 활성을 분석하기 위하여 0.5 M H_2SO_4$ 와 1 M $CH_3OH$ 혼합용액에 CV(Cyclic Voltammetry)실시하였고, carbon sheet 전극 상 Pt-Ru의 분산성 확인을 위하여 FE-SEM분석을 수행하였다.

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Vibration Analysis of PCB Manufacturing System Using Maskless Exposure Method (Maskless 방식을 이용한 PCB생산시스템의 진동 해석)

  • Jang, Won-Hyuk;Lee, Jae-Mun;Cho, Myeong-Woo;Kim, Joung-Su;Lee, Chul-Hee
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.19 no.12
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    • pp.1322-1328
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    • 2009
  • This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

Synthesis of Boron Nitride Nanotubes via inductively Coupled thermal Plasma process Catalyzed by Solid-state ammonium Chloride

  • Chang, Mi Se;Nam, Young Gyun;Yang, Sangsun;Kim, Kyung Tae;Yu, Ji Hun;Kim, Yong-Jin;Jeong, Jae Won
    • Journal of Powder Materials
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    • v.25 no.2
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    • pp.120-125
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    • 2018
  • Boron nitride nanotubes (BNNTs) are receiving great attention because of their unusual material properties, such as high thermal conductivity, mechanical strength, and electrical resistance. However, high-throughput and high-efficiency synthesis of BNNTs has been hindered due to the high boiling point of boron (${\sim}4000^{\circ}C$) and weak interaction between boron and nitrogen. Although, hydrogen-catalyzed plasma synthesis has shown potential for scalable synthesis of BNNTs, the direct use of $H_2$ gas as a precursor material is not strongly recommended, as it is extremely flammable. In the present study, BNNTs have been synthesized using radio-frequency inductively coupled thermal plasma (RF-ITP) catalyzed by solid-state ammonium chloride ($NH_4Cl$), a safe catalyst materials for BNNT synthesis. Similar to BNNTs synthesized from h-BN (hexagonal boron nitride) + $H_2$, successful fabrication of BNNTs synthesized from $h-BN+NH_4Cl$ is confirmed by their sheet-like properties, FE-SEM images, and XRD analysis. In addition, improved dispersion properties in aqueous solution are found in BNNTs synthesized from $h-BN+NH_4Cl$.

Fabrication of SOI Structures with Buried Cavities for Microsystems SDB and Electrochemical Etch-stop (SDB와 전기화학적 식각정지에 의한 마이크로 시스템용 매몰 공동을 갖는 SOI 구조의 제조)

  • Chung, Gwiy-Sang;Kang, Kyung-Doo;Choi, Sung-Kyu
    • Journal of Sensor Science and Technology
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    • v.11 no.1
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    • pp.54-59
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    • 2002
  • This paper describes a new process technique for batch process of SOI(Si-on-Insulator) structures with buried cavities for MEMS(Micro Electro Mechanical System) applications by SDB(Si-wafer Direct Bonding) technology and electrochemical etch-stop. A low-cost electrochemical etch-stop method is used to control accurately the thickness of SOI. The cavities were made on the upper handling wafer by Si anisotropic etching. Two wafers are bonded with an intermediate insulating oxide layer. After high-temperature annealing($1000^{\circ}C$, 60 min), the SDB SOI structure with buried cavities was thinned by electrochemical etch-stop. The surface of the fabricated SDB SOI structure have more roughness that of lapping and polishing by mechanical method. This SDB SOI structure with buried cavities will provide a powerful and versatile substrate for novel microsensors arid microactuators.

In2S3 Co-Sensitized PbS Quantum Dot Solar Cells

  • Basit, Muhammad Abdul;Park, Tae Joo
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.273-273
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    • 2014
  • Quantum-dot sensitized solar cells (QDSCs) are an emerging class of solar cells owing to their easy fabrication, low cost and material diversity. Despite of the fact that the maximum conversion efficiency of QDSCs is still far less than that of Dye-Sensitized Solar Cells (>12 %), their unique characteristics like Multiple Exciton Generation (MEG), energy band tune-ability and tendency to incorporate multiple co-sensitizers concurrently has made QDs a suitable alternative to expensive dyes for solar cell application. Lead Sulfide (PbS) Quantum dot sensitized solar cells are theoretically proficient enough to have a photo-current density ($J_{sc}$) of $36mA/cm^2$, but practically there are very few reports on photocurrent enhancement in PbS QDSCs. Recently, $Hg^{2+}$ incorporated PbS quantumdots and Cadmium Sulfide (CdS) co-sensitized PbS solarcells are reported to show an improvement in photo-current density ($J_{sc}$). In this study, we explored the efficacy of $In_2S_3$ as an interfacial layer deposited through SILAR process for PbS QDSCs. $In_2S_3$ was chosen as the interfacial layer in order to avoid the usage of hazardous CdS or Mercury (Hg). Herein, the deposition of $In_2S_3$ interfacial layer on $TiO_2$ prior to PbS QDs exhibited a direct enhancement in the photo-current (Isc). Improved photo-absorption as well as interfacial recombination barrier caused by $In_2S_3$ deposition increased the photo-current density ($J_{sc}$) from $13mA/cm^2$ to $15.5mA/cm^2$ for single cycle of $In_2S_3$ deposition. Increase in the number of cycles of $In_2S_3$ deposition was found to deteriorate the photocurrent, however it increased $V_{oc}$ of the device which reached to an optimum value of 2.25% Photo-conversion Efficiency (PCE) for 2 cycles of $In_2S_3$ deposition. Effect of Heat Treatment, Normalized Current Stability, Open Circuit Voltage Decay and Dark IV Characteristics were further measured to reveal the characteristics of device.

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A Design on High Frequency CMOS VCO for UWB Applications (UWB 응용을 위한 고주파 CMOS VCO 설계 및 제작)

  • Park, Bong-Hyuk;Lee, Seung-Sik;Choi, Sang-Sung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.2 s.117
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    • pp.213-218
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    • 2007
  • In this paper, we propose the design and fabrication on high frequency CMOS VCO for DS-UWB(Direct-Sequence Ultra-WideBand) applications using 0.18 ${\mu}m$ process. The complementary cross-coupled LC oscillator architecture which is composed of PMOS, NMOS symmetrically, is designed for improving the phase noise characteristic. The resistor is used instead of current source that reduce the 1/f noise of current source. The high-speed buffer is needed for measuring the output characteristic of VCO using spectrum analyzer, therefore the high-speed inverter buffer is designed with VCO. A fabricated core VCO size is $340{\mu}m{\times}535{\mu}m$. The VCO is tunable between 7.09 and 7.52 GHz and has a phase noise lower than -107 dBc/Hz at 1-MHz offset over entire tuning range. The measured harmonic suppression is 32 dB. The VCO core circuit draws 2.0 mA from a 1.8 V supply.

Synthesis and Characterization of CZTS film deposited by Chemical Bath Deposition method

  • Arepalli, Vinaya Kumar;Kumar, Challa Kiran;Park, Nam-Kyu;Nang, Lam Van;Kim, Eui-Tae
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.99.1-99.1
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    • 2012
  • The thin-film photovoltaic absorbers (CdTe and $Cu(In,Ga)Se_2$) can achieve solar conversion efficiencies of up to 20% and are now commercially available, but the presence of toxic (Cd,Se) and expensive elemental components (In, Te) is a real issue as the demand for photovoltaics rapidly increases. To overcome these limitations, there has been substantial interest in developing viable alternative materials, such as $Cu_2ZnSnS_4$ (CZTS) is an emerging solar absorber that is structurally similar to CIGS, but contains only earth abundant, non-toxic elements and has a near optimal direct band gap energy of 1.4 - 1.6 eV and a large absorption coefficient of ~104 $cm^{-1}$. The CZTS absorber layers are grown and investigated by various fabrication methods, such as thermal evaporation, e-beam evaporation with a post sulfurization, sputtering, non-vacuum sol-gel, pulsed laser, spray-pyrolysis method and electrodeposition technique. In the present work, we report an alternative aqueous chemical approach based on chemical bath deposition (CBD) method for large area deposition of CZTS thin films. Samples produced by our method were analyzed by scanning electron microscopy, X-ray diffraction, transmission electron microscopy, absorbance and photoluminescence. The results show that this inexpensive and relatively benign process produces thin films of CZTS exhibiting uniform composition, kesterite crystal structure, and some factors like triethanolamine, ammonia, temperature which strongly affect on the morphology of CZTS film.

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Fabrication of Bump-type Probe Card Using Bulk Micromachining (벌크 마이크로머시닝을 이용한 Bump형 Probe Card의 제조)

  • 박창현;최원익;김용대;심준환;이종현
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.3 no.3
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    • pp.661-669
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    • 1999
  • A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.

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