• Current Photovoltaic Research
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• 제4권3호
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• pp.119-123
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• 2016

We discussed various cover glass substrates available for photovoltaic (PV) modules, and investigated the fabrication methods of light trapping structures for the efficiency enhancement of PV modules: wet and dry etching or laser and direct patternings. We also introduced the analysis of haze at etched glass surfaces as a function of wavelength and also presented a anti-reflection coating technology for PV module.

• 열처리공학회지
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• 제9권4호
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• pp.234-242
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• 1996

The direct reaction method has been used for the fabrication of Al-Mg/$Al_2O_3$ functionally gradient materials. It was found that the reaction layer of the Al-Mg/$Al_2O_3$ powder compact at $900^{\circ}C$ under air atmosphere led to the formation of reaction layers with varying ceramic phase contents. As the results of experiments by using the TGA system, the characteristics and growth behavior of the reaction layers were affected by the reaction temperature, the gas flow rate, the Mg contents and the $Al_2O_3$ contents.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1991년도 추계학술대회 논문집
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• pp.56-59
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• 1991

The polyervstalline $Cu_{0.28}Ag_{0.72}InSe_{4.4}S_{0.6}$ thin films are prepared by vacuum heat treatment of laver, which is deposited by direct resisting vacuum evaporation. From optical absorption spetra, the optical hand gap energy is determined to be 1.5[eV] at room temerature. From electrical method. hole concentration, resistivity and mobility are 9.3*$10^{18}$[$cm^{-3}$], 6*$10^{-2}$[$\Omega$$.$cm], 11.2[$\textrm{cm}^2$/V$.$sec] respectively at room temperature.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1998년도 PROCEEDINGS OF THE 14TH KACG TECHNICAL MEETING AND THE 5TH KOREA-JAPAN EMGS (ELECTRONIC MATERIALS GROWTH SYMPOSIUM)
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• pp.81-86
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• 1998

The light aggregates were fabricated by sintering green bodies made form the fly ash-clay alip. The content of fly ashes in the slip could be increased up to 70wt.% due to controlled rheological behavior of the slip, and the green body of uniform microstructure could be obtained by DCC(Direct Coagulation Casting)method. The apparent density, microstructure and compressive strength for sintered bodies fired at 1100∼1200$^{\circ}C$ were evaluated. The properties of light aggregates fabricated depend on slip density, particle behavior in the slip and sintering conditions. The sintered body prepared by firing a green body made from slip of density 1.60 at 1150$^{\circ}C$/2hr satisfied conditions of a light aggregate as apparent density of 1.49${\pm}$0.02 and compressive strength of 584${\pm}$62kg/$\textrm{cm}^2$.

• Journal of Dental Anesthesia and Pain Medicine
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• 제17권1호
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• pp.55-59
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• 2017

Digital dentistry has influenced many dental procedures, such as three-dimensional (3D) diagnosis and treatment planning, surgical splints, and prosthetic treatments. Patient-specific protective appliances (PSPAs) prevent dental injury during endotracheal intubation. However, the required laboratory work takes time, and there is the possibility of tooth extraction while obtaining the dental impression. In this technical report, we utilized new digital technology for creating PSPAs, using direct intraoral scanners and 3D printers for dental cast fabrication.

• 한국전기전자재료학회논문지
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• 제15권10호
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• pp.838-843
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• 2002

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for deep sub-micron technology. The reverse moat etch process has been used for the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process with conventional low selectivity slurries. Thus, the process became more complex, and the defects were seriously increased. In this paper, we studied the direct STI-CMP process without reverse moat etch step using high selectivity slurry(HSS). As our experimental results show, it was possible to achieve a global planarization without the complicated reverse moat process, the STI-CMP process could be dramatically simplified, and the defect level was reduced. Therefore the throughput, yield, and stability in the ULSI semiconductor device fabrication could be greatly improved.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.241-245
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• 2004

Among the various manufacturing processes of composites, the tape lay-up process of thermoset prepreg has many advantages compared to autoclave or hot press forming. It has a high potential to process automation and continuous fabrication .. Fiber placement developed as a logical combination of filament winding and automated tape placement to overcome some of the limitations of each manufacturing method. Fiber placement uses a compaction device to apply direct contact between the incoming materials in the fiber placement head and Heat is added to the materials at the nip point of the compaction roller. This paper will discuss property of thermoset composite as compaction and heat effect in Automated fiber placement

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1832-1835
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• 2003

This paper suggests the selective ultra precision polishing techniques for micro die and mold parts using magnetic-assisted machining. Fabrication of magnetic abrasive particle and their polishing performance are key technology at ultra precision polishing process of micro parts. Conventional magnetic abrasives have disadvantages. which are missing of abrasive particle and inequality between magnetic particle and abrasive particle. So, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Ferrite and carbonyl iron powder are used as magnetic particle where silicon carbide and Al$_2$O$_3$ are abrasive particle. Developed particles are analyzed using measurement device such as SEM. Possibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 2.927 $\mu\textrm{m}$ Rmax to 0.453 $\mu\textrm{m}$ Rmax.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.219-222
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• 2003

Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecular and bio molecular. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance in selective etching of thin metal film of Self- Assembled Monolayers. In this report, we present the micromachining thin metal film by Mask-Less laser patterning of alknanethiolate Self-Assembled Monolayers.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.280-283
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• 2003

In this paper, there was finding laser beam focal length using the camera at the work with laser preprocess. A process have some similarity that the laser direct writing was condition of unused other light source in order to a partical object of working substrate, so we worked finding focal length using yellow light. As we found focal lengths from three points of substrate edges, The focal length of all substrates was able to be computed by calculating a plane equation using these three point. Also we make a device and software that can automatically perform all of the processes.