• Journal of the Korean Society for Precision Engineering
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• v.17 no.10
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• pp.56-62
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• 2000

A fast and precise technique to make 3-dimensional object which is called direct metal shaping process is processed. It is very useful technique in design and inspection. Using this developed system, a solid object is made. In experiment, test parts are built by varying three factors, laser power, scan path, scan speed. This process used device, which is different from the widely used in rapid prototyping in that powder feeding device is used. Spraying powder directly at the focused laser beam and then three dimensional object is made by the deposit of melted metal powder. The optimum scanning path is found to be zigzag path, which had little thermal affection on base metal. As a result of these experiments, it was found that optimum scanning speed is 15mm/sec laser power is 50W. This constructed 3-dimensional object could be used in mold manufacturing directly.

• Journal of the Korean Ceramic Society
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• v.45 no.12
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• pp.807-814
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• 2008

The Cu-Ni-YSZ cermet anodes for direct use of methane in solid oxide fuel cells have been fabricated by electroplating Cu into the porous Ni-YSZ cermet anode. The uniform distribution of Cu in the Ni-YSZ anode could be obtained via pulse electroplating in the aqueous solution mixture of $CuSO_4{\cdot}5H_{2}O$ and ${H_2}{SO_4}$ for 30 min with 0.05 A of average applied current. The power density ($0.17\;Wcm^{-2}$) of a single cell with a Cu-Ni-YSZ anode was shown to be slightly lower in methane at $700^{\circ}C$, compared with the power density ($0.28\;Wcm^{-2}$) of a single cell with a Ni-YSZ anode. However, the performance of the Ni-YSZ anode-supported single cell was abruptly degraded over 21 h because of carbon deposition, whereas the Cu-Ni-YSZ anode-supported single cell showed the enhanced durability upto 52 h.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1943-1945
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• 1996

In this paper, we developed a modified direct bonding method for the application of vacuum devices. By the proposed method, we successfully bonded the following materials: Si-Si, Si-$SiO_2$-Si, glass-Si, and glass-$SiO_2$-Si. In our experiments, we used corning #7070 wafer type glass and (100) or (110) single crystalline silicon wafers. In order to enhance the initial bonding strength we contacted the materials to be bonded as D. I. water wetted on the surfaces and evaporated the water under the room temperature and atmosphere environment. Finally we realized the glass bonding by simple direct bonding method which has been performed by electrostatic bonding method until now.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.93-99
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• 2010

A nano-stereolithography is the direct patterning process with a nanoscale resolution using twophoton absorption induced by a femtosecond laser. However, in the majority of the works, the fabrication of 3D microstructures have been done only onto transparent glass due to the use of an oil immersion objective lens for achieving a high resolution. In this work, the coaxial illumination and the auto-focusing system are proposed for the direct patterning of nano-precision patterns on an opaque substrate such as a silicon wafer and a metal substrate. Through this work, 3D polymer structures and metallic patterns are fabricated on a silicon wafer using the developed process.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.287-287
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• 2010

We report a new direct patterning method, called liquid bridge-mediated nanotransfer molding (LB-nTM), for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas. LB-nTM is based on the direct transfer of various materials from a mold to a substrate via a liquid bridge between them. This procedure can be adopted for automated direct printing machines that generate patterns of functional materials with a wide range of feature sizes on diverse substrates. Arrays of TIPS-PEN TFTs were fabricated on 4" polyethersulfone (PES) substrates by LB-nTM using PDMS molds. An inverted staggered structure was employed in the TFT device fabrication. A 150 nm-thick indium-tin oxide (ITO) gate electrode and a 200 nm-thick SiO2dielectric layer were formed on a PES substrate by sputter deposition. An array of TIPS-PEN patterns (thickness: 60 nm) as active channel layers was fabricated on the substrate by LB-nTM. The nominal channel length of the TIPS-PEN TFT was 10 mm, while the channel width was 135 mm. Finally, the source and drain electrodes of 200 nm-thick Ag were defined on the substrate by LB-nTM. The TIPS-PEN TFTs can endure strenuous bending and are also transparent in the visible range, and therefore potentially useful for flexible and invisible electronics.

• Bulletin of the Korean Chemical Society
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• v.29 no.4
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• pp.842-846
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• 2008

Layer-by-layer assembled multilayers of poly(ethersulfone)s were deposited on the surface of Nafion membrane for the application of direct methanol fuel cells (DMFC). Aminated poly(ethersulfone) (APES) and sulfonated poly(ethersulfone) (SPES) were used as a polycation and a polyanion for fabrication of the multilayer films. UV/Vis absorption spectroscopy verified a linear build-up of the multilayers of APES and SPES on the surface of Nafion. Thin multilayer films deposited on the Nafion membrane enabled methanol permeability of the membrane to decrease by 78% in comparison with the pristine Nafion. The performance of DMFCs in concentrated methanol was highly enhanced by using the multilayer modified Nafion.

• Korean Journal of Materials Research
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• v.16 no.10
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• pp.652-655
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• 2006

A direct wafer bonding process necessary for GaAs-on-insulator (GOI) fabrication with high thermal annealing temperatures was studied by using PECVD oxides between gallium arsenide and silicon wafers. In order to apply some uniform pressure on initially-bonded wafer pairs, a graphite sample holder was used for wafer bonding. Also, a tool for measuring the tensile forces was fabricated to measure the wafer bonding strengths of both initially-bonded and thermally-annealed samples. GaAs/$SiO_2$/Si wafers with 0.5-$\mu$m-thick PECVD oxides were annealed from $100^{\circ}C\;to\;600^{\circ}C$. Maximum bonding strengths of about 84 N were obtained in the annealing temperature range of $400{\sim}500^{\circ}C$. The bonded wafers were not separated up to $600^{\circ}C$. As a result, the GOI wafers with high annealing temperatures were demonstrated for the first time.

• Transactions of the Korean hydrogen and new energy society
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• v.35 no.2
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• pp.205-215
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• 2024

This study introduced a direct contact heat exchanger to enhance the efficiency of polymer electrolyte membrane fuel cells (PEMFCs) systems. According to previous research, 28% of the operating costs of fuel cell systems are attributed to heat exchanger devices, prompting the design of a direct contact heat exchanger to address this issue. Optimal configurations were determined through computational fluid dynamics analysis and experimental device fabrication, and the enhanced heat exchange performance of the heat exchanger was experimentally confirmed. Through this, the contribution of the direct contact heat exchanger to the heat management and efficiency enhancement of PEMFC systems was established.

• Journal of Wind Energy
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• v.14 no.4
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• pp.50-56
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• 2023

With the abnormal weather phenomena caused by global warming, the frequency and intensity of lightning strikes are increasing, and lightning accidents are becoming one of the biggest causes of failures and accidents in offshore wind turbines. In order to secure generator operation reliability, effective and practical measures are needed to reduce lightning damage. Because offshore wind turbines are tall structures installed at sea, the possibility of direct lightning strikes is very high compared to other structures, and the role of surge protection devices to minimize damage to the electrical and electronic circuits inside the wind turbine is very important. In this study, a varistor, which is a key element for a class 1 surge protection device for direct lightning protection, was developed. The current density was improved by changing the varistor composition, and the distance between the electrode located on the varistor surface and the edge of the varistor was optimized through a simulation program to improve the fabrication process. Considering the combined effects of heat distribution, electric field distribution, and current density on the optimized varistor surface, silver electrodes were formed with a gap of 0.5 mm. The varistor developed in this study was confirmed to have an energy tolerance of 10/350 ㎲, 50kA, which is a representative direct lightning current waveform, and good protection characteristics with a limiting voltage of 2 kV or less.

• Clean Technology
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• v.13 no.4
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• pp.293-299
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• 2007

Direct coating of catalyst layer on the $Nafion^{(R)}$ membrane has been optimized in the process of fabrication of membrane electrode assembly (MEA) to enhance the performance of direct methanol fuel cell (DMFC). In this method, the contact resistance at the interface of the catalyst layer and the membrane was found to be low. The effect of catalyst loading, thickness of membrane and the gas diffusion layer (GDL) with or without the presence of micro-porous layer (MPL) on the performance of the MEA was also investigated. The MEA fabricated by the above-mentioned method exhibited a performance of $147\;mW/cm^2$ and $100\;mW/cm^2$ at $80^{\circ}C$ and $60^{\circ}C$, respectively, with the catalysts loading of $4\;mg/cm^2$.