• 한국정밀공학회지
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• 제23권9호
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• pp.164-173
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• 2006

The cooling capacity of a micro-heat pipe is mainly governed by the magnitude of capillary pressure induced in the wick structure. For microchannel wicks, a higher capillary pressure is achievable for narrower and deeper channels. In this study, a metallic micro-heat pipe adopting high-aspect-ratio microchannel wicks is fabricated. Micromachining of high-aspect-ratio microchannels is done using the laser-induced wet etching technique in which a focused laser beam irradiates the workpiece placed in a liquid etchant along a desired channel pattern. Because of the direct writing characteristic of the laser-induced wet etching method, no mask is necessary and the fabrication procedure is relatively simple. Deep microchannels of an aspect ratio close to 10 can be readily fabricated with little heat damage of the workpiece. The laser-induced wet etching process for the fabrication of high-aspect-ratio microchannels in 0.5mm thick stainless steel foil is presented in detail. The shape and size variations of microchannels with respect to the process variables, such as laser power, scanning speed, number of scans, and etchant concentration are closely examined. Also, the fabrication of a flat micro-heat pipe based on the high-aspect-ratio microchannels is demonstrated.

• 한국실내디자인학회논문집
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• 제17권2호
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• pp.150-161
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• 2008

It requires more close cooperation process and mediator for smooth communication in this industry structure where design and engineers are separated. The database of design integrates separate system and helps connection between organizations. The application category is utilized variously from formation to operation. Architectures addressed in this content as Frank Gehry and Nox are making differentiated design on the base of 3d digital methodology and using it widely from generation to fabrication. Especially they got to be free from the generative limit as it became available to analyse, digital surface organization, and realize the complex system form. Now more integrated and delicate works got to be affordable owing to various kinds of improved CNC, RP(rapid-prototype) machines, and architecture hardwares. With a linkage of software now at their disposal, architects can create a digital model of a building and all of its design elements, and in turn use this 3d information to construct actual building components using machines driven by CNC and other advanced manufacturing techniques. Digital technologies are enabling a direct correlation between what design and construction, thus bringing to the forefront the issue of the significance of information, the production, communication, application, and control of digital information in the industrial system. The central requirement is the clear, reliable, and consistent exchange of information among all parties involved in creating a given project.

• 한국산학기술학회논문지
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• 제3권2호
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• pp.126-130
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• 2002

본 논문은 쾌속제작법을 이용한 임의형상을 가공하는 새로운 방법의 개념을 소개하고 있다. 본 시스템은 레이저 절단, 이송. 적층, 소결의 단계를 통하여 세라믹재료로 된 임의형상을 가공할 수 있다. 시스템을 구성하는 주요장비로는 레이저 발생장치, X-Y테이블, 이송시스템, 그리고 전기로 등이 있다. 이 시스템을 사용하면 표면의 거칠기가 매끄러운 형상을 상대적으로 짧은 시간에 제작할 수 있는 장점이 있다. 또, 2차 공정을 거치지 않고, 바로 물체를 제작할 수 있어 효율성이 높다고 할 수 있다. 제작된 모형은 바로 조립되어 사용될 수 있기 때문에 응용분야가 다양하다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.199-199
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• 2009

Recently, polymeric microlens arrays have become important elements in many applications. Microlens arrays have been used to enhance luminance efficiency and luminance power efficiency of light-emitting diodes (LEDs) and organic LEDs. Many processes for fabrication of microlens array are studied. Though the MLA has been fabricated by electroformed mold, LIGA process and reflow method, these methods were required masks, multiple process steps and post processing. In this paper, we proposed rapid and direct UV laser direct fabrication process using colorless liquid photopolymer, NOA60 for polarization activated microlens. The microlens arrays are formed on the NOA60 on glass, after the focused laser energy was irradiated to the material. The diameter of MLA was varied from 42 to 88 ${\mu}m$, and the height from 0.9 to 1.6 ${\mu}m$. The MLA fabricated using NOA60 shows more then 85% transmittance as well as good hardness for optical module.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.65-69
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• 2004

스크린 프린팅법은 고분자 전해질 연료전지의 전극 촉매층 제조의 편리함과 적용성의 면에서 가장 일반적인 방법 중에 하나이다. 본 논문은 기존의 방법과 비교하여 매우 낮은 백금 함침량을 가지기 때문에 경쟁적이고, 부가적인 공정 없이 swelling 문제를 간단하게 억제시켜 개선된 스크린 프린팅 법을 제안하였다. 특히, 가스켓 일체형 MEA는 고분자 전해질 연료전지의 작동 중에 가스 침투의 영향을 방지하여 고전류 영역에서 기존의 방법으로 제조된 MEA보다 높은 성능을 가지게 제작하였다. 이와 같은 방법들은 보다 간단하고 빠른 제조의 기회를 준다.

• 한국정밀공학회지
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• 제24권5호
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• pp.97-103
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• 2007

A novel selective metallization process to fabricate the fine conductive line based on inkjet printing has been investigated. Recently, Inkjet printing has been widely used in flat panel display, electronic circuits, biochips and bioMEMS because direct inkjet printing is an alternative and cost-effective technology for patterning and fabricating objects directly from design without masks. The photosensitive etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity at ambient temperature. A piezoelectric-driven inkjet printhead is used to dispense 20-30 ${\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. Repeatability of circuitry fabrication is closely related to the formation of steady droplets, adhesion between etching resist and copper substrate. Therefore, the ability to form small and stable droplets and surface topography of the copper surface and chemical attack must be taken into consideration for fine and precise patterns. In this study, factors affecting the pattern formation such as adhesion strength, etching mechanism, UV curing have been investigated. As a result, microscale copper patterns with tens of urn high have been fabricated.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.391-394
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• 2003

Laser direct writing process is developed 3rd harmonic Diode Pumped Solid State Laser with the near visible wavelength of 355 m sensitive polymer is irradiated by UV laser and developed using polymer solvent to obtain quasi-3D. It is important to reduce line width for image mode waveguides, so some investigations will be carried out in various conditions of process parameters such as laser power, writing speed, laser focus and optical properties of polymer. This process could be to fabricate a single mode waveguide without expensive mask projection method. Experimentally, the patterns of trapezoidal shape were manufactured into dimension of 8.4 mm width and 7.5 mm height. Propagation loss of straight waveguide measured 3 dB/cm at 1,550 nm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.503-507
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• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.47-51
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• 2000

A modified direct bonding technique employing a wet chemical deposition of $SiO_2$ film on a wafer surface to be bonded is proposed for the fabrication of Si-$SiO_2$-Si structures. Structural and electrical quality of the bonded wafers is studied. Satisfied insulating properties of interfacial $SiO_2$ layers are demonstrated. Elastic strain caused by surface morphology is investigated. The diminution of strain in the grooved structures is semi-quantitatively interpreted by a model considering the virtual defects distributed over the interfacial region.

• Transactions on Electrical and Electronic Materials
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• 제12권5호
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• pp.197-199
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• 2011

In this paper, the bottom-gate thin-film transistors (TFTs) were fabricated with an amorphous/microcrystalline Si double layer (DL) as an active layer and the variations of the electrical characteristics were investigated according to the DC bias stresses. Since the fabrication process of DL TFTs was identical to that of the conventional amorphous Si (a-Si) TFTs, it creates no additional manufacturing cost. Moreover, the amorphous/microcrystalline Si DL could possibly improve stability and mass production efficiency. Although the field effect mobility of the typical DL TFTs is similar to that of a-Si TFTs, the DL TFTs had a higher reliability with respect to the direct current (DC) bias stresses.