• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.2
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• pp.68-72
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• 2003

In this paper, we developed a new thick photoresist fabrication technology for 3-dimensional microstructures. In general, like as AZ photoresist was coated with thin film thickness about 1 $\mu\textrm{m}$ to 30 $\mu\textrm{m}$, but photoresist like SU-8 has thickness of several tens $\mu\textrm{m}$ or more and high aspect ratio. When we fabricate a microstructure using the thick photoresist like SU-8, cracks on the SU-8 thick photoresist are appeared by stress which was caused by sudden cooling down during bake of the thick photoresist spun on wafer. Thus, it was hard to fabricate the microstructure using the thick photoresist for electroplating. In this paper, we developed a new process to produce a 3-dimensional microstructure without the crack by stress through a suitable thick photoresist coating, time control of cool down and time control of PEB (Post Expose Bake).

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.2
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• pp.470-483
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• 1990

Turbulent jet in a crossflow, issuing from a row of holes on a convex surface of 90 .deg. bend duct, is predicted by a 3-dimensional numerical method. The Cartesian coordinate system in adopted in upstream and downstream tangents and the cylindrical polar coordinate system in curved region. The Reynolds stresses and heat fluxes are obtained from a standard k-e model in the core region and van Driest model in the vicinity of the wall. The governing equations are discretized by a finite volume method and solutions are obtained by a locally elliptic calculation procedure. Pressure and convective terms are treated by SIMPLE algorithm and hybrid scheme respectively. A vortex initially induced by the injected jet has been built up due to the interaction with the secondary flow caused by pressure gradient and centrifugal force. The vortex structure has a strong influence on the wall cooling effectiveness. Another vortex like horseshoe is formed in the vicinity of the injection hole and its strength is getting weak as it moves downward.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.10
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• pp.3304-3312
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• 1996

An experimental study on the convective heat transfer characteristics was performed for a two-dimensional wall attaching offset jet(WAOJ). Thermochromic liquid crystal was used to measure the plate wall temperature. The Nusselt number was measured for Reynolds numbers from 6, 500 to 39, 000, and the offset ratios from 0.5 to 15. The maximum Nusselt number point coincides with the time-averaged reattachment point and Nusselt number decreases monotonically after the jet reattaches on the wall. In the recirculation region Nusselt number minimize near the upstream corner and then increases as X/D decreases to vanishes. This suggests the existence of secondary vortices, causing an additional mixing of the flow in the corner. The correlations between the local Nusselt number and Reynolds number, Re, offset ratio, H/D, and streamwise distance, X/D are presented.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.3
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• pp.784-795
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• 1995

This paper represents the results of the experiments of the three-dimensional flow and the aerodynamic loss caused by the three-dimensional flow within the plane bucket blades. To research the secondary flow and the aerodynamic loss, the large-scale plane bucket blade of lst-stage in the low pressure steam turbine is made of FRP. The detailed investigation of the secondary flow and the aerodynamic loss using 5-hole pressure probe within turbine cascade has been carried out in the low speed wind tunnel. The limiting streamlines of the suction and endwall surface have been visualized by the oil film method. The flow visualization of the secondary flow has been performed by the laser light sheet technique and image processing system. By using the method mentioned above, it is possible to observe the evolution of the pitchwise mass-averaged flow deviation angle and total pressure loss coefficient, the secondary flow, and the aerodynamic loss through the cascade.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.211.2-211.2
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• 2014

Epitaxial complex oxide thin film heterostructures have attracted a great attention for their multifunctional properties, such as ferroelectricity, and ferromagnetism. Two dimensional electron gas (2DEG) confined at the interface between two insulating perovskite oxides such as LaAlO3/SrTiO3 interface, provides opportunities to expand various electronic and memory devices in nano-scale. Recently, it was reported that the conductivity of 2DEG could be controlled by external electric field. However, the switched conductivity of 2DEG was not stable with time, resulting in relaxation due to the reaction between charged surface on LaAlO3 layer and atmospheric conditions. In this report, we demonstrated a way to control the conductivity of 2DEG in non-volatile way integrating ferroelectric materials into LAO/STO heterostructure. We fabricated epitaxial Pb(Zr0.2Ti0.8)O3 films on LAO/STO heterostructure by pulsed laser deposition. The conductivity of 2DEG was reproducibly controlled with 3-order magnitude by switching the spontaneous polarization of PZT layer. The controlled conductivity was stable with time without relaxation over 60 hours. This is also consistent with robust polarization state of PZT layer confirmed by piezoresponse force microscopy. This work demonstrates a model system to combine ferroelectric material and 2DEG, which guides a way to realize novel multifunctional electronic devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.3
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• pp.267-272
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• 2006

Optical waveguide based on symmetric and asymmetric Mach-Zehnder interferometer(MZI) type was designed, fabricated and measured the optical characteristics for the application of biosensor. The wavelength of the input optical signal for the device was 1550 nm. And the difference of refractive index was $0.45\;{\Delta}\%$ between core and cladding of the device. The TM(Transverse Magnetic) mode optical properties of the biosensor were analyzed with the refractive index variation of gold thin film deposited for overclad. Nowadays, nano-photonic crystal structures have been paied much attention for its high optical sensitivity. There is a technique to realize the structure, which is called Dip-Pen Nanolithography(DPN) process. The process requires a nano-scale process patterning resolution and high reliability. In this paper, two dimensional nano-photonic crystal array on the surface was proposed for improving the sensitivity of optical biosensor. And the Dip-Pen Nanolithogrphy process was investigated to realize it.

• Journal of Surface Science and Engineering
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• v.43 no.4
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• pp.176-179
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• 2010

The InAs thin films were grown on GaAs(100) substrate with $2^{\circ}C$ tilted toward [$0\bar{1}\bar{1}$] with different As beam equivalent pressure (BEP) by using molecular beam epitaxy. Growth temperature and thickness of the InAs thin films were $480^{\circ}C$ and 0.5 ${\mu}m$, respectively. We studied the relation between the As BEP and the properties of InAs thin films. The properties of InAs thin films were observed by reflection high-energy electron diffraction (RHEED), optical microscope, and Hall effect. The growth, monitored by RHEED, was produced through an initial 2D (2-dimensional) nucleation mode which was followed by a period of 3D (3-dimensional) island growth mode. Then, the 2D growth recovered after a few minutes and the streak RHEED pattern remained clear till the end of growth. The crystal quality of InAs thin films is dependent strongly on the As BEP. When the As BEP is $3.6{\times}10^{-6}$ Torr, the InAs thin film has a high electron mobility of 10,952 $cm^2/Vs$ at room temperature.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.11
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• pp.1998-2003
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• 2007

A flexible but implantable polyimide-based neural implant was fabricated for reliable and stable long-term monitoring of neural activities from brain. The developed neural implant provides 3-dimensional (3D) $3{\times}3$ structure, avoids any hand handling, and makes the insertion more efficient and reliable. Any film curvature caused by residual stress was not observed in the electrode. The 3D flexible polyimide electrode penetrated a dense gel whose stiffness is close to live brain tissue, because a ${\sim}1{\mu}m$ thick nickel was electroplated along the edge of the shank in order to improve the stiffness. The recording sites were positioned at both side of the shank to increase the probability of recording neural signals from a target volume of tissue. Impedance remained stable over 72 hours because of extremely low moisture uptake in the polyimide dielectric layers. At electrical recording test in vitro, the fabricated electrode showed excellent recording performance, suggesting that this electrode has the potential for great recording from neuron firing and long-term implant performance.

• Journal of Surface Science and Engineering
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• v.48 no.1
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• pp.23-26
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• 2015

What causes the transformation of a solar cell is the behavior difference of thermal expansion occurred between the substrate and the layer of semiconductor used in the solar cell. Therefore, the substrate has to possess a behavior of thermal expansion that is similar with that of semiconductor layer. This study employed electroforming to manufacture Fe-Ni alloy materials of different compositions. To verify the result from a finite element analysis, a two-dimensional Mo substrate was calculated and its verification experiment was conducted. The absolute values from the finite element analysis of Mo/substrate structure and its verification experiment showed a difference. However, the size of residual stress of individual substrate compositions had a similar tendency. Two-dimensional CIGS/Mo/$SiO_2$/substrate was modeled. Looking into the residual stress of CIGS layer occurred while the temperature declined from $550^{\circ}C$ to room temperature, the smallest residual stress was found with the use of Fe-52 wt%Ni substrate material.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.425-427
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• 1996

New fabrication technique was developed to make three dimensional silicon microstructure with five fold vertical steps through entire wafer thickness. Each step is pre-defined on multiply stacked thermal oxide and silicon nitride (O/N) layers by photolithographies. Multi-stepped silicon microstructure is formed by anisotropic etch in aqueous KOH solution with the patterned nitride film as masking layer. Fabricated microstructure consists of four $16{\mu}m$ thick flexural spring beams, $290{\mu}m$ thick proof mass, mesas for overrange stop with $10{\mu}m$ height from the surface of the proof mass, and the other mesas and V grooves used for assembling this structure to the packaging frame of pendulous servo accelerometer. Using the numerical finite element method (FEM) simulator: ABAQUS, mechanical characteristics of the fabricated microstructure by the developed technique was compared with those of the same structure processed by one step silicon bulk etch followed by oxidation and patterning the etched region.