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http://dx.doi.org/10.5695/JKISE.2015.48.1.023

Study on Thermal behavior of Flexible CIGS Thin Film Solar Cell on Fe-Ni Alloy Substrates using Finite Element Analysis  

Han, Yun-Ho (Korea Institute of Industrial Technology (KITECH))
Lee, Min-Su (Korea Institute of Industrial Technology (KITECH))
Kim, Dong-Hwan (Department of Materials Science and Engineering, Korea University)
Yim, Tai-Hong (Korea Institute of Industrial Technology (KITECH))
Publication Information
Journal of the Korean institute of surface engineering / v.48, no.1, 2015 , pp. 23-26 More about this Journal
Abstract
What causes the transformation of a solar cell is the behavior difference of thermal expansion occurred between the substrate and the layer of semiconductor used in the solar cell. Therefore, the substrate has to possess a behavior of thermal expansion that is similar with that of semiconductor layer. This study employed electroforming to manufacture Fe-Ni alloy materials of different compositions. To verify the result from a finite element analysis, a two-dimensional Mo substrate was calculated and its verification experiment was conducted. The absolute values from the finite element analysis of Mo/substrate structure and its verification experiment showed a difference. However, the size of residual stress of individual substrate compositions had a similar tendency. Two-dimensional CIGS/Mo/$SiO_2$/substrate was modeled. Looking into the residual stress of CIGS layer occurred while the temperature declined from $550^{\circ}C$ to room temperature, the smallest residual stress was found with the use of Fe-52 wt%Ni substrate material.
Keywords
CIGS Solar Cell; Fe-Ni alloy; Thermal Behavior; Flexible Solar Cell;
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