• The KIPS Transactions:PartA
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• v.17A no.3
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• pp.145-152
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• 2010

Most wearable system for mobile healthcare applications consists of three parts. The first part is the sensing elements based on bio-signal, the second is the circuit module for control, data acquisition and wireless communication and control and the third is garment with a built-in electrodes and circuits. The existing healthcare garment systems have to find a solution to signal-wire and uncomfortable and inappropriate electrode to long-term attachment. Even if the wireless communication is used for healthcare garment system, the interface between sensors and circuits have to use wires. To solve these problems, this paper use electrode using PEDOT coated PVDF nanoweb for ECG signal and PVDF film sensor for respiratory signal. And, we constructed garment network using digital yarn of 10um, and transmitted ECG and respiratory signal to mobile phone through the integrated circuit with bluetooth called station To evaluate feasibility of the proposed mobile healthcare garment system, we experimented with transmission and measurement of ECG and respiratory signal using nanoweb electrode and digital yarn. We got a successful result without noise and attenuation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.2 s.344
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• pp.42-50
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• 2006

Owing to the development of semiconductor processing technology, high density complex circuits can be integrated in a System-on-Chip (SoC). However, increasing energy consumption becomes one of the most important limiting factors. Power estimation at the early stage of design is essential, since design changes at lower levels may significantly lengthen the design period and increase the cost. In this paper, logic level circuits ire levelized and several levels are selected to build power model tables for efficient power estimation. The proposed techniques are applied to a set of ISCAS'85 benchmark circuits to illustrate their effectiveness. Experimental results show that significant improvement in estimation accuracy and slight improvement in efficiency are achieved when compared to those of a well-known existing method. The average estimation error has been reduced from $9.49\%\;to\;3.84\%$.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.11
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• pp.167-174
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• 2012

In this paper a ultrasonic oil level meter for measuring oil levels of vehicle transmissions is designed and its effectiveness is shown by experiments. On a FPGA(Field Programmable Gate Array) project IDE(Integrated Development Environment), all digital circuits for the meter is designed using a FPGA, which enables simplicity and high performance of the meter as well as short developing time. Also, power supplying circuit and analog circuits to process low voltage ultrasonic echo signal are designed and simulated. Under experiments, the designed level meter is verified to provide accuracy to within 1mm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.8
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• pp.36-46
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• 2010

In multi-GHz RF ICs and high-speed digital interfaces, ESD protection devices introduce considerable parasitic capacitance and resistance to inputs and outputs, thereby degrading the RF performance, such as input/output matching, gain, and noise figure. In this paper, the impact of ESD protection devices on the performance of RF ICs is investigated and design methodologies to minimize this impact are discussed. With RF and ESD test results, the 'RF/ESD co-design' method is discussed and compared to the conventional RF ESD protection method which focuses on minimizing the device size.

• Journal of The Korean Astronomical Society
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• v.29 no.spc1
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• pp.389-390
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• 1996

The CCDs are widely used in astronomical observations either in direct imaging use or spectroscopic mode. However, the areas of available sensors are too small for large imaging format. One possibility to obtain large detection area is to assemble mosaics of CCD, and drive them simultaneously. Parallel driving of many CCDs together rules out the possibility of individual tuning; however, such optimisation is very important, when the ultimate low light level performance is required, particularly for new, or mixed devices. In this work, a new concept is explored for an entirely novel approach, where the drive waveforms are multiplexed and interleaved. This simultaneously reduces the number of leadout connections and permits individual optimisation efficiently. The digital controller can be designed within a single EPLD (Erasable Programmable Logic Device) chip produced by a CAD software package, where most of the digital controller circuits are integrated. This method can minimise the component. count., and improve the system efficiency greatly, based on earlier works by Han et a1. (1996, 1994). The system software has an open architecture to permit convenient modification by the user, to fit their specific purposes. Some variable system control parameters can be selected by a user with a wider range of choice. The digital controller design concept allows great flexibility of system parameters by the software, specifically for the compatibility to deal with any number of mixed CCDs, and in any format, within the practical limit.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.234-238
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• 2003

In this work, we have designed a fully integrated 2.4GHz LC-tuned voltage-controlled oscillator (VCO) with multiple tuning inputs for a $0.25-{\mu}m$ standard CMOS Process. The design of voltage-controlled oscillator is based on an LC-resonator with a spiral inductor of octagonal type and pMOS-varactors. Only two metal layer have been used in the designed inductor. The frequency tuning is achieved by using parallel pMOS transistors as varactors and back-gate tuned pMOS transistors in an active region. Coarse tuning is achieved by using 3-bit pMOS-varactors and fine tuning is performed by using back-gate tuned pMOS transistors in the active region. When 3-bit digital and analog inputs are applied to the designed circuits, voltage-controlled oscillator shows the tuning feature of frequency range between 2.3 GHz and 2.64 GHz. At the power supply voltage of 2.5 V, phase noise is -128dBc/Hz at 3MHz offset from the carrier, Total power dissipation is 7.5 mW.

• Journal of Practical Engineering Education
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• v.6 no.2
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• pp.91-97
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• 2014

Education equipment for field programmable gate array (FPGA) based multimedia player design is introduced. Using the education equipment, an example of hardware design for color detection and augment reality (AR) game is described, and an example of syllabus for "Digital system design using FPGA" course is introduced. Using the education equipment, students can develop the ability to design some hardware, and to train the ability for the creative capstone design through conceptual, partial-level, and detail designs. By controlling audio codec, system-on-chip (SOC) design skills combining a NIOS II soft microprocessor and digital hardware in one FPGA chip are improved. The ability to apply wireless communication and LabView to FPGA-based digital design is also increased.

• Journal of IKEEE
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• v.13 no.4
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• pp.9-14
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• 2009

This paper describes measurement of an on-ship power supply noise in mixed-signal integrated circuits. To measure the on-chip power supply noise, we can check the effects of analog circuits and compensate it. This circuit consists of two independent measurement channels, each consisting of a sample and hold circuit and a frequency to digital converter which has a buffer and voltage controlled oscillator(VCO). The time-based voltage information and frequency-based power spectrum density(PSD) can be achieved by a simple analog to digital conversion scheme. The buffer works like a unit-gain buffer with a wide bandwidth and VCO has a high gain to improve resolution. This circuit was fabricated in a 0.18um CMOS technology and has 2.06mV/count. The noise measurement circuit consumes 15mW and occupies $0.768mm^2$.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.