• 폴리머
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• 제24권2호
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• pp.237-244
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• 2000

탄화 매트릭스의 전구체로 사용된 페놀수지에 세라믹 분말인 이규화몰리브덴 (MoSi$_2$)을 0, 4, 12, 20%의 중량비로 각각 고르게 분산시켜, 여기에 PAN계 탄소섬유를 함침하여 프리프레그법을 이용하여 일방향 탄소섬유/페놀수지 복합재료를 제조하였으며, 이를 다시 탄화(110$0^{\circ}C$) 시켜서 일방향 탄소/탄소 복합재료를 제작하였다. 본 연구에서는 난소/탄소 복합재료에 산화 억제제로 사용된 MoSi$_2$의 첨가량에 따른 복합재료의 산화거동을 산화분위기 하 600-100$0^{\circ}C$의 온도범위에서 조사하였다. 그 결과, MoSi$_2$를 함유한 탄소/탄소 복합재료는 복합재료 내치 기공 감소와 산소에 대한 유동 확산 방지막의 형성으로 인하여 카본 활성종이 방해를 받아 MoSi$_2$를 함유하지 않은 것에 비해 산화속도가 감소되어 내산화성이 향상되었다. 이는 산소의 공격에 대한 보호층을 형성하는 MoSi$_2$ 고유의 특성에 따른 영향이라 사료된다.

• 한국진공학회지
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• 제9권2호
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• pp.162-166
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• 2000

플라즈마 화학증착법(Plasma Enhanced Chemical Vapor Deposition, PECVD)을 이용하여 양질의 $Si_3N_4$ 금속-유전막-금속(Metal-Insulator-Metal, MIM) 커패시터를 구현하였다. 유전체인 $Si_3N_4$와 전극인 Al의 계면반응을 억제시키기 위해 티타늄 나이트라이드(TiN)를 확산 장벽으로 사용한 결과 MIM 커패시터의 전극과 유전체 사이의 계면에서는 어떠한 hillock이나 석출물도 관찰되지 않았다. 커패시턴스와 전류전압 특성분석으로부터 양질의 MIM 커패시터 특성을 보이는 $Si_3N_4$의 최소 두께는 500 $\AA$이며, 그 두께 미만에서는 대부분의 커패시터가 전기적으로 단락되어 웨이퍼 수율이 낮아진다는 사실을 알 수 있었다. 투과전자현미경(transmission Electron Microscope, TEM)을 이용한 단면 미세구조 관찰을 통해 $Si_3N_4$층의 두께가 500 $\AA$ 미만인 커패시터의 경우에 TiN과 $Si_3N_4$의 계면에서 형성되는 슬릿형 공동(slit-like void)01 의해 커패시터의 유전특성이 파괴된다는 사실을 알게 되었으며, 열 유기 잔류 응력(thermally-induced residual stress) 계산에 기초하여 공동의 형성 기구를 규명하였다.

• 한국재료학회지
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• 제10권1호
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• pp.90-96
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• 2000

Underlayer의 종류 및 두께가 Al 박막의 배향성 및 면저항 변화에 미치는 영향을 연구하였다. Al의 underlayer로서 sputtering 방식으로 증착되는 Ti와 TiN이 적층된 구조인 Ti/TiN이 사용되었으며, 각각에 대해 두께를 변화시키면서 Al 박막의 배향성, 면저항을 조사하였고, $400^{\circ}C,\;N_2$ 분위기에서 열처리하면서 면저항의 변화를 조사하였다. Ti만을 Al의 underlayer로 사용한 경우, Ti두께가 10nm 이상이면 우수한 Al <111> 배향성을 나타냈으며 Al-Ti 반응 때문에 열처리 후 Al 배선의 면저항이 크게 상승하였다. Ti와 Al사이에 TiN을 적용함에 의해 Al <111> 배향성은 나빠지나 Al-Ti 반응에 의한 면저항의 증가는 억제할 수 있었다. Ti/TiN underlayer의 경우, 우수한 Al <111> 배향성을 확보하기 위한 Ti의 최소두께는 20nm이었고, Al-Ti 반응을 억제하기 위한 TiN의 최소두께는 20nm이었다.

• KSBB Journal
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• 제28권5호
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• pp.319-326
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• 2013

This study was carried out to investigate the in vitro and in vivo moisturizing properties and percutaneous absorption of PEG-impregnated Aloe vera gel. The PEG-i-Aloe gel was obtained from dewatering and impregnation by soaking (DIS) of Aloe vera leaf slice. The moisturizing property of the obtained sample was evaluated by moisture determination using gravimetric method in desiccator under different RH% and by water sorption-desorption test on human skin. The transdermal penetration characteristics of PEG-i-Aloe gel was investigated by Franz diffusion cell in vitro transdermal absorption method. PEG-i-Aloe gel had high moisture retention ability and could significantly lead the enhancing skin hydration status as well as reducing the skin water loss due to the film formation as a skin barrier. The skin penetration rate of PEGi- Aloe gel at steady state was 9.76 ${\mu}g/(h{\cdot}cm^2)$ and the quantity of the transdermal absorption was 144 ${\mu}g/cm^2$ in 9 hr. The penetration mechanism was well fitted with Higuchi model ($R^2$ = 0.974-0.994). The results show that PEG-i-Aloe gel has the significant moisturizing effect and strong penetration of the animal skin. It could be used as the moisturizing additive in cosmetic skin products.

• 한국전기전자재료학회논문지
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• 제17권12호
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• pp.1356-1361
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• 2004

High temperature superconducting coated conductor has a structure of ///. The buffer layer consists of multi-layer, this study reports the deposition method and optimal deposition conditions of YSZ(Yttria-stabilized zirconia) layer which plays a important part in preventing the elements of substrate from diffusing into the superconducting layer. YSZ layer was deposited by DC reactive sputtering technique using water vapor for oxidizing deposited elements on substrate. To investigate optimal thickness of YSZ film, four YSZ/CeO$_2$/Ni samples with different YSZ thickness(130 nm, 260 nm, 390 nm, and 650 nm) were prepared. The SEM image showed that the surface of YSZ layer was getting to be rougher as YSZ layer was getting thicker and the growth mode of YSZ layer was columnar grain growth. After CeO$_2$ layer was deposited with the same thickness of 18.3 nm on each four samples, YBCO layer was deposited by PLD method with the thickness of 300 nm. The critical currents of four samples were 0, 6 A, 7.5 A, and 5 A respectively. This shows that as YSZ layer is getting thicker, YSZ layer plays a good role as a diffusion barrier but the surface of YSZ layer is getting rougher.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 춘계학술대회 논문집
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• pp.39-43
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• 1993

Electricial characteristics of gate dielectrics prepared by reoxidation of thermal $SiO_2$ in nitrous oxide gas have been investigated. 10 and 19nm-thick oxides were reoxidized at temperatures of $900-1000^{\circ}C$ for 10-60 min in $N_2O$ ambient. As reoxidation proceeds, it is shown that nitrogen concentration at $Si/SiO_2$ interface increases gradually through the AES analysis. Nitrogen pile-up at $Si/SiO_2$ interface acts as a oxidant diffusion barrier that reduces the oxidation rate significantly. And it not only strengthen oxynitride structure at the interface but improve the gate dielectric qualities. Reliabilities of oxynitride films are conformed by the breakdown distributions and constant current stress technique. Therefore, the oxynitride films made by this process show a good promise for future ULSI applications.

• 한국전기전자재료학회논문지
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• 제22권4호
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• pp.342-349
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• 2009

This study investigated the growth characteristics of carbon nanotubes (CNTs) by changing a period of annealing time and a $C_{2}H_{2}/H_2$ flow ratio at temperature as low as $450^{\circ}C$ with inductively coupled plasma chemical vapor deposition. The 1-nm-thick Fe-Ni-Co alloy thin film served as a catalyst layer for the growth of CNTs, which was thermally evaporated on the 15-nm-thick Al underlayer deposited on the 50-nm-thick Ti diffusion barrier. The annealing at low temperature of $450^{\circ}C$ brought about almost no granulation of the catalyst layer, and the CNT growth was not affected by a period of annealing time. A study of changing the flow rate of $C_{2}H_{2}$ and $H_2$ showed that as the ratio of the $C_{2}H_{2}$ flow rate to the $H_2$ flow rate was lowered, the CNTs were grown to be longer With further decreasing the flow ratio, the length of CNTs reached the maximum and then became shorter. Under the optimized gas flow rates, we successfully synthesized CNTs with a uniform length over a 4-inch Si wafer at $450^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.412-412
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• 2008

ENIG(Electroless Nickel Immersion Gold)is a surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. ENIG has good diffusion barrier of Ni against solder and good wettability due to Au finish. But when the discoloration occurred on the Au finish of ENIG, some key characteristics related to the quality and reliability of PCB such as bondability, solderability and electrical flowing of packaging process could be deteriorated. In this paper, we have performed the water dip test ($88^{\circ}C$ purified water) which accelerates the galvanic corrosion of Ni diffused from the Ni-P layer. That is, the excessive oxidation of the Ni layer could result in non-wetting of the solder because the flux may not be able to remove excessive oxides. Though Au discoloration have been reported to be caused by Ni oxides in many literature, it is still open to verify and discuss The microstructures and chemical compositions have been investigated using FE-SEM, TEM, FIB, EDS and XPS. As a result, authors have found that the Au discoloration in ENIG type is severely caused by the oxidation of the Ni and the mechanism of Au discoloration can be confirmed through the experiment result of water dip test.

• 마이크로전자및패키징학회지
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• 제6권3호
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• pp.9-18
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• 1999

본 연구에서는 융점 이상에서의 유지시간에 따른 Sn-3.5Ag 및 Sn-37Pb 공정솔더볼과 Au/Ni/Cu 기판 사이의 야금학적 특성을 고찰하였다. 현재 상용되는 리플로 솔더링 장비를 사용하여, 최고 솔더링 온도와 Conveyor 속도를 변화시킴으로써 융점이상에서의 유지시간을 측정하였다. 결과로서 접합부 계면에서 스캘럽 형태의 $Ni_3Sn_4$금속간화합물이 형성되었고, Cu-Sn계 화합물은 관찰되지 않았다. Ni층이 Cu의 확산 장벽으로 작용하였다. 최고 솔더링 온도가 증가함에 따라 금속간화합물 층의 두께가 최고 2.2$\mu\textrm{m}$까지 성장하였다. 스캘럽의 형상은 반구형에서 지름이 더 작은 볼록한 형상으로 변하게 된다. 접합부의 미세경도값은 Sn-3.5Ag와 Sn-37Pb의 공정조직이 성장함에 따라 감소하였다.

• 한국환경보건학회지
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• 제39권4호
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• pp.360-368
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• 2013

Objectives: Phthalates are used in a large variety of products including as coatings of pharmaceutical tablets, film formers, stabilizers, dispersants, emulsifying agents, and suspending agents. They have been the subject of great public concern in recent years. The extensive uses of this material have attracted attention and issues regarding its safety have been raised. Methods: In this study, three types of phthalate skin permeation were studied using matrixes such as ointments, creams and lotions in vitro. The absorption of phthalate diesters [Dimethyl phthalate (DMP), Di-n-propyl phthalate (DPP) and Di-n-pentyl phthalate (DNPP)] using film former has been measured in vitro through rat skin. Epidermal membranes were set up in Franz diffusion cells and their permeability to PBS measured in order to establish the integrity of the skin before the phthalates were applied to the epidermal surface. Results: Absorption rates for each phthalate ester were determined and permeability assessment made to quantify any irreversible alterations in barrier function due to contact with the esters. Types of phthalate in vitro experimental results quickly appeared in the following order DMP > DPP ${\geq}$ DNPP. Conclusions: In the experimental results, lotion> cream> ointment, and the permeation rate of lotion with a great amount of moisture was the fastest. Skin permeation rate is generally influenced by the chemical characteristics of a given chemical, such as molecular weight and lipophilicity. As the esters became more lipophilic and less hydrophilic, the rate of absorption decreased.