Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2008.11a
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- Pages.412-412
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- 2008
Studies for ENIG surface behavior of FCBGA through the time by using water dip test method
- Shin, An-Seob (Samsung Electro-Mechanics) ;
- Kim, Jeom-Sik (Samsung Electro-Mechanics) ;
- Ok, Dae-Yool (Samsung Electro-Mechanics) ;
- Jeong, Gi-Ho (Samsung Electro-Mechanics) ;
- Park, Chang-Sik (Samsung Electro-Mechanics) ;
- Heo, Cheol-Ho (Samsung Electro-Mechanics) ;
- Lee, Kum-Ro (Samsung Electro-Mechanics)
- Published : 2008.11.06
Abstract
ENIG(Electroless Nickel Immersion Gold)is a surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. ENIG has good diffusion barrier of Ni against solder and good wettability due to Au finish. But when the discoloration occurred on the Au finish of ENIG, some key characteristics related to the quality and reliability of PCB such as bondability, solderability and electrical flowing of packaging process could be deteriorated. In this paper, we have performed the water dip test (