The characteristics of TiN as a barrier for the diffusion of Cu (TiN의 Cu 확산 방지막 특성)

• 이승윤;라사균;이원준;김동원;천성순;박종욱
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1995.11a
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  • pp.37-37
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  • 1995
• PDF

Thermal Stability of Molybdenum Nitride Thin Film as a Copper Diffusion Barrier (구리확산방지막으로서 Molybdenum Nitride 박막의 열적안정성 연구)

• 이정엽;이재석;박종완;오경희
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1995.11a
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  • pp.41-41
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  • 1995
• PDF

Diffusion barrier properties of CVD-TiN films in Cu metallization (Cu 배선공정에서 CVD-TiN 박막의 확산방지막 특성)

• 정득석;박기철;송병창;김기범
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1996.11a
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  • pp.73-73
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  • 1996
• PDF

Tungsten Nitride Film Growth by MOCD for Cu Diffusion Barrier

• Lee, Brad H.;Yong, Ki-Jung
• • Proceedings of the Korean Vacuum Society Conference
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  • 2003.08a
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  • pp.146-146
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  • 2003
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A study on the effect of TiN stuffing for Cu diffusion barrier (Cu 확산 방지용 TiN의 stuffing 효과에 관한 연구)

• 황용섭;이승윤;박종욱;라사균;김동원
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1997.10a
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  • pp.31-31
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  • 1997
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Effect of Diffusion Barrier in the Thermally Annealed IrMn/CoFe Electrode in Magnetic Tunnel Junctions

• 여준한;이지현;정희돈;임동현;윤종승;김창경
• • Proceedings of the Korean Magnestics Society Conference
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  • 2002.04a
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  • pp.48-49
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  • 2002
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Improvement of CVD-TiN diffusion barrier performance in Cu metallization by a thin Al interlayer between Cu and TiN (Cu 배선 공정에서 Al 중간층을 이용한 CVD-TiN 확산 방지막의 성능 향상)

• 김경호;김기범
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1999.05a
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  • pp.104-104
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  • 1999
• PDF

The effect of Microstructure of Ta on the diffusion barrier property for Cu penetration deposited by IBAD (이온선 보조증착에 의한 Ta의 미세구조가 Cu의 확산 방지 특성에 미치는 영향)

• 윤동수;강병선;이성만;백홍구
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1996.05a
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  • pp.67-67
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  • 1996
• PDF

Limiting Current-Type Sensor using the Same Layers as Ceramic Diffusion Barrier and Electrolyte (세라믹 확산장벽과 전해질을 동일한 물질로 사용한 제한전류형 센서)

• 이종흔;김호인;이교열;김병기
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1996.05a
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  • pp.119-119
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  • 1996
• PDF

Study on the thermal stability of interposed Ta/Cr bilayer diffusion barrier between Cu and Si (Cu와 Si사이에 도입된 Ta/Cr이중층 확산방지막의 열적안정성에 관한 연구)

• 윤동수;강병선;이성만;백홍구
• • Proceedings of the Materials Research Society of Korea Conference
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  • 1996.05a
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  • pp.121-121
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  • 1996
• PDF

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