• Journal of Industrial and Engineering Chemistry
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• v.68
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• pp.399-405
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• 2018

We report the fabrication of organic field-effect transistors (OFETs) via spray coating of electrochemically exfoliated graphene (EEG) and conducting polymer hybrid as electrodes. To reduce the roughness and sheet resistance of the EEG electrodes, subsequent coating of conducting polymer (poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS)) and acid treatment was performed. After that, active channel layer was developed by spin coating of semiconducting poly(3-hexylthiophene) on the hybrid electrodes to define the bottom gate bottom contact configuration. The OFET devices with the EEG/PEDOT:PSS hybrid electrodes showed a reasonable electrical performances (field effect mobility = $0.15cm^2V^{-1}\;s^{-1}$, on/off current ratio = $10^2$, and threshold voltage = -1.57V). Furthermore, the flexible OFET devices based on the Polydimethlsiloxane (PDMS) substrate and ion gel dielectric layer exhibited higher electrical performances (field effect mobility = $6.32cm^2V^{-1}\;s^{-1}$, on/off current ratio = $10^3$, and threshold voltage = -1.06V) and excellent electrical stability until 1000 cycles of bending test, which means that the hybrid electrode is applicable to various organic electronic devices, such as flexible OFETs, supercapacitors, organic sensors, and actuators.

• Journal of the Korean institute of surface engineering
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• v.54 no.1
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• pp.30-36
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• 2021

In this study, double-layered anodizing films were formed on Al 5052 and Al 6061 alloys consecutively first in sulfuric acid and then in oxalic acid, and hardness, withstand voltage, surface roughness and acid resistance of the anodizing films were compared with single-layered anodizing films in sulfuric acid and oxalic acid electrolytes. Hardness of the double-layered anodizing film decreased with increasing ratio of inner layer to outer layer for both Al 5052 and Al 6061 alloys, suggesting that outer anodizing film formed in sulfuric acid electrolyte is damaged during the second anodizing in oxalic acid electrolyte. Withstand voltage of the double-layered anodizing films increased with increasing the thickness ratio of inner layer to outer layer. Surface roughness of the double-layered anodizing films were comparable with that of single-layered anodizing film formed in sulfuric acid but higher than that of single layer anodizing film formed in oxalic acid electrolyte. In acid resistance test, all of the double-layered and single-layered anodizing films showed good acid resistance more than 3 h without any visible gas evolution, which is attributable to sealing of pores. Based on the experimental results obtained in this work, it is possible to design a double-layered anodizing film with cost-effectiveness and improved physical and electrical properties by combining two consecutive anodizing processes of sulfuric acid anodizing and oxalic acid anodizing methods.

• Progress in Superconductivity and Cryogenics
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• v.12 no.3
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• pp.21-24
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• 2010

A cryogenic insulation technique for a high voltage and a large current capacity of a conductor are now two big issues in a field of recent R&D projects of superconducting power devices, especially a superconducting power transformer. For the large rated currents of the power transformer, it is well known that lots of 2nd generation superconducting conductor, so called coated conductor, should be stacked together with transpositions in order to get an even distributions of the currents. We had come up with an idea of a CTCC (Continuously Transposed Coated Conductor) as a conductor for a large power superconducting transformer, and keep trying to verify the usefulness of the conductor. As one of the efforts of verifying, we prepared and tested a sample CTCC with insulations for high voltage, which includes the epoxy coating and Nomex$^{(R)}$ wrapping. This paper contains the insulation process and dielectric breakdown test results. We expect the results obtained from this experiment to improve an insulation technique for high voltages in various cryogenic environments[1,2].

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.618-629
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• 2001

This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure modes and failure mechanisms were studied in two ways in order to estimate component life and failure rate. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective root cause failure analysis. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal cycling test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which might cause electrical short in underlying circuitry, can occur during curing or thermal cycle. The results can be conveniently used to quickly identify defective lots, determine $B_{10}$ life estimation each lot at the level of inspection, and detect major changes in the vendors processes. Also, the condition for dielectric breakdown was investigated for the estimation of failure rate with load-strength interference model.

• Journal of Korean Society of Environmental Engineers
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• v.39 no.4
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• pp.186-193
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• 2017

Microwave (MW) is an effective method for solubilizing organic solids because it has thermal, non-thermal and ionic conduction effects by dielectric heating and high energy efficiency. In this study, we evaluated the application of MW to the solubilization of cattle manure and investigated the solubilization ratio of cattle manure by solid concentration, MW power and target temperature. And $H_2SO_4$ and NaCl were added to investigated the effects on the MW-assisted solubilization. Also, we evaluated the solubilization efficiency by biochemical methane potential(BMP) test according to the solubilization conditions. Maximum SCOD increment per energy supply was 70.5 mg $SCOD_{increased}/kJ$ at 12% of the solid concentration, MW power of 800 W and the target temperature of $40^{\circ}C$. And SCOD concentration went up 153.2% compared to the initial concentration. In the MW-assisted solubilization with $H_2SO_4$ and NaCl as chemical catalysts, SCOD concentration was increased by 36% and 22.7%, respectively, compared to the result of MW. The methane production was increased by 13.3% and 11.3% with the addition of $H_2SO_4$ and NaCl. Therefore, MW is an effective method for solubilization of cattle manure, and it is necessary to use chemical catalysts to increase the solubilzation efficiency.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.12 no.2
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• pp.99-107
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• 1998

This dissertationhas confirmed the non-flam mability of cast mold transformer that is increasingly used lately. As a research progress, the investigation has been performed on the installation status and each line of the subway system which have the most mold transformer accidents, and the impediment status of the transformer for rectifier and the high-voltage distribution transformer per each manufacturer. Then, a high voltage mold of the actual mold transformer has been installed in the horiwntal heating furnace and the heat has been applied by the standard heating temperature curve of KSF 2257(Fireproof testing meth od of the construction structures: 1993). Accordingly, the combustibility of the mold transformer based on the test results has been found that 78 minutes has been required for the complete burning per the KSF 2257 combustion test curve and that, after stopping the heat application of the horizontal furnace after ignition, the flame progress has not been made but shown as the self-extinguishing characteristics when the flame progress has been checked. Thus, the non-flammability and self-extinguishability of the mold transformer have been confirmed. The result of this dissertation has indicated that the accident involving mold transformer has been progressed and expanded by the dielectric breakdown or void due to the crack in the mold rather than a fire accident caused by a short-circuit or an overload.r an overload.

• Korean Journal of Materials Research
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• v.8 no.10
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• pp.961-968
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• 1998

In order to investigate the effects of substrate bias voltage on the formation of$ZnS-SiO_2$ protective film in phase change optical disk by R.F. magnetron sputtering method, thin dielectric film was formed on Si wafer and Corning glass by using ZnS(80mol%)-$SiO_2$(20mol%)t arget under argon gas. In this study, the Taguchi experimental method was applied in order to obtain optimum conditions with reduced number of experiments and to control numerous variables effectively. At the same time this method can assure the reproducibility of experiments. Optimum conditions for film formation obtained by above method were target RF power of 200 W. substrate RF power of 20 W, Ar pressure of 5 mTorr. sputtering time of 20 min.. respectively. The phase of specimen was determined by using XRD and TEM. The compositional analysis of specimen was performed by XPS test. In order to measure the thermal resistivity of deposited specimen, annealing test was carried out at $300^{\circ}C$ and $600^{\circ}C$. For the account of void fraction in thin film, the Bruggeman EMA(Effective Medium Approximation) method was applied using the optical data obtained by Spectroscopic Ellipsometry. According to the results of this work, the existence of strong interaction between bias voltage and sputtering time was confirmed for refractive index value. According to XRD and TEM analysis of specimen, the film structure formed in bias voltage resulted in more refined structures than that formed without bias voltage. But excess bias voltage resulted in grain growth in thin film. It was confirmed that the application of optimum bias voltage increased film density by reduction of void fraction of about 3.7%.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.63-67
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• 2016

In this paper, we present an indirect method of elastic modulus measurement for various lamination layers formed on polymer-based compliant substrates. Although the elastic modulus of every component is crucial for mechanically reliable microelectronic devices, it is difficult to accurately measure the film properties because the lamination layers are hardly detached from the substrate. In order to resolve the problem, 3-point bending test is conducted with a film-substrate specimen and area transformation rule is applied to the cross-sectional area of the film region. With known substrate modulus, a modulus ratio between the film and the substrate is calculated using bending stiffness of the multilayered specimen obtained from the 3-point bending test. This method is verified using electroplated copper specimens with two types of film-substrate structure; double-sided film and single sided film. Also, common dielectric layers, prepreg (PPG) and dry film solder resist (DF SR), are measured with the double-sided specimen type. The results of copper (110.3 GPa), PPG (22.3 GPa), DF SR (5.0 GPa) were measured with high precision.

• Journal of the Society of Disaster Information
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• v.18 no.3
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• pp.566-573
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• 2022

Purpose: This study attempted to verify the effectiveness of the application of air sterilizers in elementary schools at risk of group infection among vulnerable groups in order to address fears of new infectious diseases that have increased since the outbreak of Middle East Respiratory Syndrome (MERS) and Coronavirus infection-19 (COVID-19). Method: One air sterilizer was installed in each classroom, cafeteria, and bathroom of an elementary school in Seoul, and surface and air samples were collected at a distance of 2m from the air sterilizer, and the bacterial reduction effect was analyzed compared to the uninstalled control group. Result: The sterilization effect on the surface was less than 2log CFU/cm² in both the control group and the test group, and the test group showed 54 to 87% less general bacterial colony formation than the control group. In addition, the sterilization effect in the air differed depending on the location of the air sterilizer, and the wall installation showed a reduction effect of up to 91% compared to the control group, and the central installation showed a reduction effect of up to 93%. Conclusion: As a result of the study, it is expected that the prevention of infectious diseases can be increased by maintaining the current quarantine program in elementary schools that conduct regular disinfection while applying air sterilizers. In addition, it is considered desirable to facilitate the inflow of air into the air sterilizer.