• 제목/요약/키워드: Dielectric resistance

검색결과 330건 처리시간 0.024초

전송선로에 적용한 Low-k 고분자 복합 잉크 개발 (Low-k Polymer Composite Ink Applied to Transmission Line)

  • 남현진;정재웅;서덕진;김지수;유종인;박세훈
    • 마이크로전자및패키징학회지
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    • 제29권2호
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    • pp.99-105
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    • 2022
  • 칩사이즈가 작아짐에 따라 선폭 또한 미세화되면서 인터커넥션의 밀집정도가 증가하고 있다. 그로 인해 캐패시터 층과 전기전도층의 저항 차이로 인해 RC delay가 문제되고 있다. 이를 해결하기 위해서는 높은 전기전도도의 전극과 낮은 유전율의 유전체 개발이 요구된다. 본 연구에서는 PCB (Print Circuit Board)의 회로를 외부요인으로부터 보호하는 상용 PSR (photo solder resist)과 우수한 내열 및 저유전 특성을 보유한 PI (polyimide)를 혼합하여 저유전체 잉크 개발을 진행하였다. 그 결과 PSR과 PI를 10:3으로 혼합한 잉크가 가장 우수한 결과를 보였으며 20 GHz와 28 GHz에서 각각 유전 상수 약 2.6, 2.37을 보였고, 유전손실은 약 0.022, 0.016으로 측정되었다. 차후 어플리케이션 적용 가능성 검증을 위해 테프론에 제작된 다양한 선폭의 전송선로에 평가하였으며 그 결과, PSR만 사용했을 때보다 PI와 혼합한 저유전체 잉크를 사용한 전송선로의 손실이 S21에서 평균 0.12 dB 덜 감소한 결과를 보였다.

A1-1%Si 박막배선에서 엘렉트로마이그레이션 현상에 미치는 절연보호막 효과 (Dielectric passivation effects on the electromigration phenomena in Al-1%Si thin film interconnections)

  • 김경수;김진영
    • 한국진공학회지
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    • 제10권1호
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    • pp.27-30
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    • 2001
  • 절연보호막 처리된 Al-1%Si 박막배선에서 DC와 PDC 조건하에서의 Electromigration 현상에 관하여 조사하였다. $SiO_2$와 PSG/$SiO_2$ 절연보호막 층을 갖는 박막배선은 표준 사진식각 공정으로 제작되었고, 테스트라인 길이는 100, 400, 800, 1200, 1600 $\mu\textrm{m}$이다. Al-l%Si 박막배선에 고정된 전류밀도 $1.19\times10^7\textrm{A/cm}^2$의 DC와 duty factor가 0.5인 1Hz의 주파수에 고정된 전류밀도 $1.19\times10^7\textrm{A/cm}^2$의 PDC를 인가하였다. Electromigration 테스트에서 PSG/$SiO_2$ 절연보호막 시편의 Electromigration 저항성이 $SiO_2$ 절연보호막 시편보다 우수함을 알 수 있었다. PDC 에서 박막 배선의 수명이 DC 보다 2-4배 정도 길게 나타났으며, 박막 배선의 길이가 증가 할 수록 수명이 감소하다가 임계길이 이상에서 포화되는 경향을 보인다. Electromigration에 의한 결함 형태로는 전기적 개방을 야기시키는 보이드와 전기적 단락을 야기시키는 힐록이 지배적이다.

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Cr을 첨가한 ZnO의 결함과 입계 특성 (Defects and Grain Boundary Properties of Cr-doped ZnO)

  • 홍연우;신효순;여동훈;김종희;김진호
    • 한국전기전자재료학회논문지
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    • 제22권11호
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    • pp.949-955
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    • 2009
  • In this study, we investigated the effects of Cr dopant (1.0 at% $Cr_2O_3$ sintered at $1000^{\circ}C$ for 1 h in air) on the bulk trap (i.e. defect) and interface state levels of ZnO using dielectric functions ($Z^*$, $M^*$, $Y^*$, $\varepsilon^*$, and $tan{\delta}$), admittance spectroscopy (AS), and impedance-modulus spectroscopy (IS & MS). For the identification of the bulk trap levels, we examine the zero-biased admittance spectroscopy and dielectric functions as a function of frequency and temperature. Impedance and electric modulus spectroscopy is a powerful technique to characterize grain boundaries of electronic ceramic materials as well. As a result, three kinds of bulk defect trap levels were found below the conduction band edge of ZnO in 1.0 at% Cr-doped ZnO (Cr-ZnO) as 0.11 eV, 0.21 eV, and 0.31 eV. The overlapped defect levels ($Zn^{..}_i$ and $V^{\cdot}_0$) in admittance spectra were successfully separated by the combination of dielectric function such as $M^*$, $\varepsilon^*$, and $tan{\delta}$. In Cr-ZnO, the interfacial state level was about 1.17 eV by IS and MS. Also we measured the resistance ($R_{gb}$) and capacitance ($C_{gb}$) of grain boundaries with temperature using impedance-modulus spectroscopy. It have discussed about the stability and homogeneity of grain boundaries using distribution parameter ($\alpha$) simulated with the Z"-logf plots with temperature.

유전함수를 이용한 ZnO-Bi2O3-Mn3O4 바리스터의 a.c. 특성 분석 (Analysis of a.c. Characteristics in ZnO-Bi2O3-Mn3O4 Varistor Using Dielectric Functions)

  • 홍연우;신효순;여동훈;김진호
    • 한국전기전자재료학회논문지
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    • 제23권12호
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    • pp.936-941
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    • 2010
  • In this study, we have investigated the effects of Mn dopant on the bulk trap levels and grain boundary characteristics of $Bi_2O_3$-based ZnO (ZB) varistor using admittance spectroscopy and dielectric functions (such as $Z^*,\;Y^*,\;M^*,\;\varepsilon^*$, and $tan\delta$). Admittance spectra and dielectric functions show two bulk traps of $Zn_i^{..}$ (0.20 eV) and $V^{\bullet}_o$ (0.29~0.33 eV) in ZnO-$Bi_2O_3-Mn_3O_4$ (ZBM). The barrier of grain boundaries in ZBM could be electrochemically single type. However, its thermal stability was slightly disturbed by ambient oxygen because the apparent activation energy of grain boundaries was changed from 0.79 eV at lower temperature to 1.08 eV at higher temperature. The grain boundary capacitance $C_{gb}$ was decreased slightly with temperature as 1.3~1.8 nF but resistance $R_{gb}$ decreased exponentially. The relaxation time distribution can result from the heterogeneity of the barriers constituting the varistor. It is revealed that Mn dopant in ZB reduced the heterogeneity of the barrier in grain boundaries and stabilized the barrier against the ambient temperature.

고온초전도 박막이 설치된 유전체부하 공진기의 주파수 조절 가능한 High-Q 공진기 제작 및 대면적 고온초전도 박막의 특성평가에의 응용 (Application of Dielectric-loaded Cavity Resonators with HTS Endplates for Tunable High-Q Resonators and Characterization Tools for Large HTS Films)

  • 권형준;박종운;강훈;허정;이상영
    • 한국초전도학회:학술대회논문집
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    • 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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    • pp.75-82
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    • 1999
  • TE$_{01\;{\delta}}$ mode Cavity Resonators with a low loss dielectric rod and YBa$_2Cu_3O_{7-{\delta}}$ (YBCO) endplates were prepared and their microwave properties were studied at temperatures above 30 K. Both sapphire and rutile were used as the dielectrics. The TE$_{01\;{\delta}}$ mode Q$_0$ of the resonator, designed to work as a tunable resonator with variations in the gap distance (s) between the dielectric rod and the top YBCO, was more than 1000000 at s = 0 mm and at 30 K and .the resonant frequency of 19.56GHz when a sapphire rod was used for the dielectric. The TE$_2Cu_3O_{7-{\delta}}$ mode resonant frequency (f$_0$) appeared to decrease as the temperature is raised. Meanwhile, the temperature dependence of the TE$_2Cu_3O_{7-{\delta}}$ mode f$_0$ of the rutile-loaded resonator appeared different with f$_0$ increasing according to the temperature and Q$_0$ more than 300000 at 30 K and f$_0$ = 8.56 CHz. Comparisons were made between the microwave properties of the sapphire-loaded and the rutile-loaded resonators. Also, applications of the TE$_2Cu_3O_{7-{\delta}}$ mode cavity resonator for a tunable resonator with a very high Q$_0$ as · well as a characterization tool for surface resistance measurements of HTS films are described.

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Evaluation and Comparison of Nanocomposite Gate Insulator for Flexible Thin Film Transistor

  • 김진수;조성원;김도일;황병웅;이내응
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.278.1-278.1
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    • 2014
  • Organic materials have been explored as the gate dielectric layers in thin film transistors (TFTs) of backplane devices for flexible display because of their inherent mechanical flexibility. However, those materials possess some disadvantages like low dielectric constant and thermal resistance, which might lead to high power consumption and instability. On the other hand, inorganic gate dielectrics show high dielectric constant despite their brittle property. In order to maintain advantages of both materials, it is essential to develop the alternative materials. In this work, we manufactured nanocomposite gate dielectrics composed of organic material and inorganic nanoparticle and integrated them into organic TFTs. For synthesis of nanocomposite gate dielectrics, polyimide (PI) was explored as the organic materials due to its superior thermal stability. Candidate nanoprticles (NPs) of halfnium oxide, titanium oxide and aluminium oxide were considered. In order to realize NP concentration dependent electrical characteristics, furthermore, we have synthesized the different types of nanocomposite gate dielectrics with varying ratio of each inorganic NPs. To analyze gate dielectric properties like the capacitance, metal-Insulator-metal (MIM) structures were prepared together with organic TFTs. The output and transfer characteristics of organic TFTs were monitored by using the semiconductor parameter analyzer (HP4145B), and capacitance and leakage current of MIM structures were measured by the LCR meter (B1500, Agilent). Effects of mechanical cyclic bending of 200,000 times and thermally heating at $400^{\circ}C$ for 1 hour were investigated to analyze mechanical and thermal stability of nanocomposite gate dielectrics. The results will be discussed in detail.

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Advanced Low-k Materials for Cu/Low-k Chips

  • Choi, Chi-Kyu
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.71-71
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    • 2012
  • As the critical dimensions of integrated circuits are scaled down, the line width and spacing between the metal interconnects are made smaller. The dielectric film used as insulation between the metal lines contributes to the resistance-capacitance (RC) time constant that governs the device speed. If the RC time delay, cross talk and lowering the power dissipation are to be reduced, the intermetal dielectric (IMD) films should have a low dielectric constant. The introduction of Cu and low-k dielectrics has incrementally improved the situation as compared to the conventional $Al/SiO_2$ technology by reducing both the resistivity and the capacitance between interconnects. Some of the potential candidate materials to be used as an ILD are organic and inorganic precursors such as hydrogensilsequioxane (HSQ), silsesquioxane (SSQ), methylsilsisequioxane (MSQ) and carbon doped silicon oxide (SiOCH), It has been shown that organic functional groups can dramatically decrease dielectric constant by increasing the free volume of films. Recently, various inorganic precursors have been used to prepare the SiOCH films. The k value of the material depends on the number of $CH_3$ groups built into the structure since they lower both polarity and density of the material by steric hindrance, which the replacement of Si-O bonds with Si-$CH_3$ (methyl group) bonds causes bulk porosity due to the formation of nano-sized voids within the silicon oxide matrix. In this talk, we will be introduce some properties of SiOC(-H) thin films deposited with the dimethyldimethoxysilane (DMDMS: $C_4H_{12}O_2Si$) and oxygen as precursors by using plasma-enhanced chemical vapor deposition with and without ultraviolet (UV) irradiation.

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$[BaTiO_3]_{0.9}+[BaZrO_3, SnO_2, La_2O_3, ZrO_2]_{0.1}$의 Dielectric Properties 및 Temperature Characteristics에 미치는 $Bi_2O_3$의 영향 (Effect of $Bi_2O_3$ on Dielectric Properties and Temperature Characteristics of $[BaTiO_3]_{0.9}+[BaZrO_3, SnO_2, La_2O_3, ZrO_2]_{0.1}$)

  • 이병하;이경희;윤영호;손상철;유광수
    • 한국세라믹학회지
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    • 제30권5호
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    • pp.397-403
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    • 1993
  • Widely used dielectrics, barium titanate was promising material for ceramic capacitor. It was produced by specific formulation with various dopants-La2O3, ZrO2, SnO2, CaZrO3, CaTiO3, CaSnO3, Bi2O3, and etc.-according to demanded properties of capacitor. In this study, we would examinate the study of dielectric properties and temperatuer characteristics (T.C.) with the amount of Bi2O3. The sample was prepared with [BaTiO3]10+[BaZrO3, SnO2, La2O3, ZrO2]10 and Bi2O3 varied from 1.0, 1.5, 2.0, 2.5 to 3.0wt%. After milling and mixing for 15hrs, each sample was dried and then pressed at 700kg/$\textrm{cm}^2$ into pellets. Pellets were fired at 131$0^{\circ}C$, for 3hrs in air. As the result of measurements, dielectric constant, break down voltage, and insulation resistance were increased with the amount of Bi2O3, and the resonant frequency was shifted from high frequency to low frequency range. In the case of temperature characteristics, capacitance change rate was symmetrically changed at -$25^{\circ}C$ and +85$^{\circ}C$ respectively. Therefore, it is recognized that the temperature characteristics can be moderated with doping Bi2O3 in our study.

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PMN-PT 단결정의 압전 및 유전 특성 평가에 미치는 측정 방법의 영향 (Effect of Measuring Method on the Evaluation of Piezoelectric and Dielectric Properties of PMN-PT Single Crystal)

  • 김용수;박재환;이정호;이상구
    • 마이크로전자및패키징학회지
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    • 제26권4호
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    • pp.69-74
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    • 2019
  • PMN-PT 단결정 시편의 유전 및 압전 특성의 측정 결과에 미치는 측정 기구물의 영향을 고찰하였다. 샘플에 교류 전기신호를 인가하는 지그핀의 압력이 감소할수록 공진저항은 낮게 측정되고 기계적 품질계수는 높게 계산되었다. 지그핀의 스프링 텐션이 20 grf인 경우 기계적 품질계수는 418으로 측정되었고, 스프링 텐션이 200 grf인 경우 품질계수 값은 절반으로 감소하였다. 4-프로브 방식의 픽스쳐는 압전특성 측정에는 부적합하지만 유전손실 값의 측정에는 가장 적합하였다. 정확한 PMN-PT의 압전특성 평가를 위하여 지그핀의 스프링 텐션을 최대한 낮추는 것이 필요하며, 정확한 유전특성의 평가를 위하여 4-프로브 방식이 적합함을 알 수 있다.

FGMM을 이용한 2중 유전체층 사이의 저항띠 격자구조에 의한 TM 산란 해 (Solution of E-polarized Scattering by a Resistive Strip Grating Between a Double Dielectric Layer Using FGMM)

  • 윤의중
    • 문화기술의 융합
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    • 제9권3호
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    • pp.641-646
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    • 2023
  • 본 논문에서는 2중 유전체층 사이의 저항띠 격자구조에 의한 TM(transverse magnetic) 산란 문제를 전자파 수치해석 방법으로 알려진 FGMM(fourier galerkin moment method)를 이용하여 해석하였다. 경계조건들은 미지의 계수를 구하기 위하여 이용하였고, 산란 전자계는 Floquet 모드 함수의 급수로 전개하였고, 저항띠의 해석을 위해 저항 경계조건을 적용하였다. 전반적으로, 저항띠의 균일저항율이 증가하면 저항띠에 유도되는 전류밀도의 크기는 감소하였고 반사 전력은 감소하였으며, 상대적으로 투과전력은 증가하였다. 또한 유전체 층의 두께가 증가할수록 반사전력은 증가하였고 상대적으로 투과전력은 상대적으로 감소하였다. 본 논문에서 제안된 구조에 대한 수치결과들은 기존 논문의 수치해석 방법인 PMM의 결과들과 비교하여 매우 잘 일치하였다.