• 한국초전도학회:학술대회논문집
• /
• v.15
• /
• pp.25-25
• /
• 2005

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.5
• /
• pp.430-435
• /
• 2007

This paper describes the results of electrical characteristics assessment for organic insulations of polyethylene(PE) series insulations and acrylonitrile butadiene styrene copolymer(ABS). In the experiment, 4 kinds of specimens by composition density were tested in relative permittivity, specific resistance and tracking duration. A WinDETA system and a tracking test set manufactured for this assessment were used to measure the dielectric parameters and tracking duration, respectively. In measuring the tracking duration, the time from testing voltage application to testing circuit breaking due to the tracking current was measured. As a result, dielectric dispersion was observed in measuring the relative permittivity of ABS. It was confirmed that the relative permittivity decreased with the density of the PE series insulations and it depends rather on the temperature than frequency. In most specimens, specific resistance exponentially decreased with frequency and the result for each specimen was almost similar. By the way, in the tracking test, all the PE series insulations showed more excellent performance than ABS and especially in the case of HDPE, its tracking withstand performance was the best.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.04b
• /
• pp.9-12
• /
• 2004

This paper investigated the stability of Ta-Mo alloy on thin gate dielectric. Ta-Mo alloy was deposited by using co-sputtering process after thermal growing of 3.4nm and 4.2nm silicon dioxide. When the sputtering power of Ta and Mo were 100W and 70W, respectively, the suitable work function for NMOS gate electrode, 4.2eV, could obtain. To prove interface thermal stability of thin film gate dielectric and Ta-Mo alloy, rapid thermal annealing was performed at $600^{\circ}C$ and $700^{\circ}C$ for 10sec in Ar ambient. The results of interface reaction were surveyed by change of silicon dioxide thickness and work function after annealing process. Also, the reliability of alloy gate and gate dielectric could be confirmed by quantity of leakage current. Ta-Mo alloy was showed low sheet resistance and thermal stability, namely, little change of gate dielectric and work function, after $700^{\circ}C$ annealing process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.326-326
• /
• 2007

Influence of $Nd_2O_3$ addition to $ZnO-B_2O_3$-based glass on the water leaching resistance of the glass was first investigated. The optimized $Nd_2O_3-ZnO-B_2O_3$ (NZB) glass was ball milled for varying time, mixing with followed by $Al_2O_3$ crystalline phase to form $Al_2O_3$-NZB glass composites at $875^{\circ}C$ for 1h. Microwave dielectric properties of the composites were investigated as a function of the ball milling time of the NZB glass. Dielectric constant and quality factor were 5.70 and 9497 GHz, respectively, when the NZB glass was ball milled for 6h prior to mixing with $Al_2O_3$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.5
• /
• pp.440-446
• /
• 2008

To manufacture the MLCC with X7R for high voltage stability, $BaTiO_3-MgO-MnO_2-Y_2O_3$ with $(Ba_{0.4}Ca_{0.6})SiO_3$ glass frit was formulated. Based on this composition, the addition of $Er_2O_3$ showed that TCC(Temperature Coefficient Capacitance) at $85^{\circ}C$ was improved from 5 % to ${\sim}0\;%$, but the dielectric constant and IR (Insulation Resistance) were decreased. The glass frit improved the dielectric constant and IR, so the appropriate contents of $Er_2O_3$ and glass frit were 0.6 mol% and 1 wt%, respectively. It showed that the dielectric constant and RC constant were 2,550 and 2,000 (${\Omega}F$), respectively in the sintering condition at $1250^{\circ}C$ in PO2 $10^{-7}$ Mpa. The MLCC with $3.2{\times}1.6$ (mm) size and $1\;{\mu}F$ was also suited for X7R with the above composition.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.64 no.12
• /
• pp.1724-1729
• /
• 2015

Chlorosulfonated polyethylene (CSPE) was not flooded seawater and flooded seawater & freshwater for 5 days, respectively, and these samples are referred to as BSF(before seawater flooding) and ASFF(after seawater & freshwater flooding), respectively. The apparent density, dissipation factor, relative permittivity, melting temperature, dielectric breakdown time and increased time of applied voltage are higher than those of BSF, but the insulating resistance, dielectric strength, percent elongation and glass transition temperature of ASFF are lower than those of BSF. The differential temperature of those is $0.026{\sim}0.028(^{\circ}C)$ after AC and DC voltage is applied to ASFF, respectively, and the differential temperature of those is $0.013{\sim}0.037(^{\circ}C)$ after AC and DC voltage is applied to BSF, respectively. In the case AC and DC voltage is applied to ASFF as well as BSF, the variations in temperature of AC voltage are higher than those of DC voltage. It is investigated that dielectric loss due to dissipation factor ($tan{\delta}$) is related to electric dipole conduction current. It is certain that the ionic (electron or hole) leakage current was increased by conducting ions such as $Na^+$, $Cl^-$, $Mg^{2+}$, $SO_4^{2-}$, $Ca^{2+}$ and $K^+$, those are related to cured atoms of O and S that relatively increased after seawater flooding.

• Journal of the Korean Vacuum Society
• /
• v.7 no.3
• /
• pp.267-267
• /
• 1998

The fluorine doped silicon oxide (SiOF) intermetal dielectric (IMD) films have been of interest due to their lower dielectric constant and compatibility with existing process tools. However instability issues related to bond and increasing dielectric constant to water absorption when the SiOF films was exposured to atmospheric ambient. Therefore, the purpose of this research is to study the effect of post oxygen plasma treatment on the resistance of moisture absorption and reliability of SiOF film. Improvement of moisture absorption resistance of SiOF film is due to the forming of thin SiO₂layer at the SiOF film surface. It is thought that the main effect of the improvement of moisture absorption resistance was densification of the top layer and reduction in the number of Si-F bonds that tend to associate with OH bonds. However, the dielectric constant was increased when plasma treatment time is above 5 min. In this study, therefore, it is thought that the proper plasma treatment time is 3 min when plasma treatment condition is 700 W of microwave power, 3 mTorr of process pressure and 300℃ of substrate temperature.

• Progress in Superconductivity
• /
• v.13 no.2
• /
• pp.97-104
• /
• 2011

In the dielectric resonator method, which has been widely used for measuring the microwave surface resistance of superconductors, accuracies in the geometrical factors (G-factors) affect the uncertainty in the measured surface resistance. We compare the G-factors of short-ended sapphire resonator as obtained by using field analysis with those by using computer simulations: The former is obtained by using the analytic expressions for the electric and the magnetic field components inside the resonator, and the latter by using computer software. The G-factors as obtained by using the latter appear to be closer to those obtained by using the former as the resonator space is divided into larger number of sub-space, i.e., a tighter mesh, with a difference of ~8 % observed for a mesh of 14400 sub-spaces reduced to ~2 % for 114996 sub-spaces. Variations in the relative uncertainty in the surface resistance of typical $YBa_2Cu_3O_{7-\delta}$ superconductor films with those in the G-factors are studied, which provides an upper limit of the relative uncertainty in the G-factors required for realizing the target uncertainty in the surface resistance. These results could be useful in estimating the optimum number of meshes for obtaining the G-factors through computer simulations.

• Progress in Superconductivity
• /
• v.11 no.2
• /
• pp.106-111
• /
• 2010

Sapphire resonators with $YBa_2Cu_3O_{7-\delta}$ (YBCO) endplates have provided a way to realize extremely high quality factor due to the extremely low dielectric loss of sapphire and conductive loss of YBCO films, which enables to measure the low surface resistance of superconductor films at microwave frequencies. We present microwave properties of HTS sapphire resonators designed for measuring the surface resistance of HTS films at millimeter-wave frequencies by using the two-resonance mode dielectric resonator method. Despite enhanced surface resistance ($R_S$) of YBCO films due to the quadratic frequency dependence of the $R_S$, the unloaded quality factor ($Q_0$) of the $TE_{021}$ mode sapphire resonator still appears to be well above $1\;{\times}\;10^6$ at a mm-wave frequency of 38 GHz at 10 K. However, it appears that the $TE_{012}$ mode $Q_0$ is unexpectedly low despite that the corresponding resonance peak looks uncoupled with parasitic modes. We discuss possible reasons for the unexpected results using the surface resistance at the $TE_{021}$, $TE_{012}$, and $TE_{011}$ mode frequencies.

• Proceedings of the Korea Concrete Institute Conference
• /
• 1995.04a
• /
• pp.118-123
• /
• 1995

Evaluating the moisture content for sand is useful for quality cotnrol of concrete. If water content of evaluate instantly and apply for mix proportion sand of concrete, in mixing propertion of concrete, it can makes to improve of concrete quality. In this study, the evaluating method for moisture content of sand, using the electric velocity and dielectric constant was proposed as a study of quality control of concrete. The obtained results are summarized as follow. The resistance ratio was decreased as the increase of moisture content The dielectric constant was decreased as the sand of the moisture content increase.