• Title/Summary/Keyword: Dielectric materials

Search Result 2,107, Processing Time 0.032 seconds

Improvement of High Permittivity Pads for Areas with Generally Low Signal Sensitivity at 7T MRI (7T MRI에서 일반적으로 신호 감도가 낮은 영역에 대한 고유전율 패드 개선)

  • Yong-Tae, Kim;Hyeon-Man, Baek
    • Journal of the Korean Society of Radiology
    • /
    • v.16 no.6
    • /
    • pp.761-769
    • /
    • 2022
  • Pads with high dielectric materials have been used in a variety of applications to locally improve the field sensitivity and homogeneity of RF pulses in clinical MRI studies. In this study, we aimed to improve such pads in consideration of the practical problems associated with the application of actual clinical images. A high permittivity pad to increase the attenuated B1 field strength was fabricated and tested in 7T MRI. Sim4Life simulation and experimental results show stronger and relatively uniform B1 near field. In order to improve the image quality in the whole cerebellum, known as a region with low sensitivity, a guide was made to reduce the mechanical change of the pad. In order to improve the wearing comfort, the pad was designed by dividing it into upper and lower parts. The facial pad showed an overall signal increase effect in areas such as the turbinate in the nasal cavity. Signal increase was expected in areas such as the frontal lobe and eyes, but the effect was either insignificant or it was difficult to see the effect in the imaging protocol. In conclusion, this paper showed a cerebellar-optimized pad with an improved nasal signal while maintaining its effectiveness.

High quality topological insulator Bi2Se3 grown on h-BN using molecular beam epitaxy

  • Park, Joon Young;Lee, Gil-Ho;Jo, Janghyun;Cheng, Austin K.;Yoon, Hosang;Watanabe, Kenji;Taniguchi, Takashi;Kim, Miyoung;Kim, Philip;Yi, Gyu-Chul
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2016.02a
    • /
    • pp.284-284
    • /
    • 2016
  • Topological insulator (TI) is a bulk-insulating material with topologically protected Dirac surface states in the band gap. In particular, $Bi_2Se_3$ attracted great attention as a model three-dimensional TI due to its simple electronic structure of the surface states in a relatively large band gap (~0.3 eV). However, experimental efforts using $Bi_2Se_3$ have been difficult due to the abundance of structural defects, which frequently results in the bulk conduction being dominant over the surface conduction in transport due to the bulk doping effects of the defect sites. One promising approach in avoiding this problem is to reduce the structural defects by heteroepitaxially grow $Bi_2Se_3$ on a substrate with a compatible lattice structure, while also preventing surface degradation by encapsulating the pristine interface between $Bi_2Se_3$ and the substrate in a clean growth environment. A particularly promising choice of substrate for the heteroepitaxial growth is hexagonal boron nitride (h-BN), which has the same two-dimensional (2D) van der Waals (vdW) layered structure and hexagonal lattice symmetry as $Bi_2Se_3$. Moreover, since h-BN is a dielectric insulator with a large bandgap energy of 5.97 eV and chemically inert surfaces, it is well suited as a substrate for high mobility electronic transport studies of vdW material systems. Here we report the heteroepitaxial growth and characterization of high quality topological insulator $Bi_2Se_3$ thin films prepared on h-BN layers. Especially, we used molecular beam epitaxy to achieve high quality TI thin films with extremely low defect concentrations and an ideal interface between the films and substrates. To optimize the morphology and microstructural quality of the films, a two-step growth was performed on h-BN layers transferred on transmission electron microscopy (TEM) compatible substrates. The resulting $Bi_2Se_3$ thin films were highly crystalline with atomically smooth terraces over a large area, and the $Bi_2Se_3$ and h-BN exhibited a clear heteroepitaxial relationship with an atomically abrupt and clean interface, as examined by high-resolution TEM. Magnetotransport characterizations revealed that this interface supports a high quality topological surface state devoid of bulk contribution, as evidenced by Hall, Shubnikov-de Haas, and weak anti-localization measurements. We believe that the experimental scheme demonstrated in this talk can serve as a promising method for the preparation of high quality TI thin films as well as many other heterostructures based on 2D vdW layered materials.

  • PDF

대기압 유전체 배리어 방전을 이용한 폴리머 박막의 증착과 특성 분석에 대한 연구

  • Kim, Gi-Taek;Suzaki, Yoshifumi;Kim, Yun-Gi
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2011.10a
    • /
    • pp.38.2-38.2
    • /
    • 2011
  • 폴리머 박막은 그 고유한 특성으로 인해 여러 산업적으로 널리 사용되고 있는 재료이다 예로 의약품이나 식품 포장지의 배리어, 전자부품의 절연체, 반도체 공정에서의 사용, 혹은 부식방지를 위해 사용 되어지기도 한다. 이 폴리머 박막을 증착 하기 위한 방법으로 이전부터 CVD (Chemical Vapor Deposition) 방법이 많이 사용되었고 지금까지도 가장 많이 사용되는 방법이다. CVD를 사용하여 $SiO_2$-like 필름의 증착은 전구체(precursor)로 Silane ($SiH_4$)을 사용하였으며, 플라즈마 발생 소스(source)로 열 혹은 전기장 등을 사용 하며 공정 시 압력 또한 대부분 저압 하에서 실시 하였다. 이와 같은 이전 CVD 방법의 문제는 사용되는 Silane 자체가 인체에 해로울 정도로 독성이 있으며 폭발성도 같이 가지고 있어 작업환경의 위험성이 높으며 열을 사용한 CVD의 경우 높은 공정 온도로 인해 증착 할 수 있는 대상이 제한 되어 지며 높은 열의 발생을 위해 많은 에너지의 소비가 필요하다. 저압 플라즈마를 사용한 CVD 는 공정상 높은 열의 발생이 일어나지 않아 기판 운용상 문제가 되지 않지만 저압 환경에서 해당 공정이 이루어기 때문에 인해 필수적으로 고가의 진공 챔버가 필수적이며 저압을 유지할 고가의 진공 펌프나 추가 장비들이 필요하게 된다, 또한 챔버 내에서 이루어지는 공정으로 인해 공정의 연속성이 떨어져 시잔비용 또한 많이 잡아 먹는다. 이러한 열 혹은 저압 플라즈마등을 사용한 공정의 단점을 해결하기 위해 여러 연구자들이 다양한 방법을 통해 연구를 하였다. 대기압 유전체 배리어 방전(AP-DBD: Atmospheric Pressure-Dielectric Barrier Discharge)을 사용한 폴리머 박막의 증착은 이전 전통적인 방법에 비해 낮은 장비 가격과 낮은 공정 온도 그리고 연속적인 공정 등의 장점이 있는 폴리머 박막 증착 방법 이다. 대기압 유전체 배리어 방전 공정 변수로 공급 전압 및 주파수 그리고 공급 전압의 영향, 전구체를 유전체 배리어 방전 전극으로 이동 시키기 위해 사용된 캐리어 가스의 종류 및 유량, 화학양론적 계수를 맞추기 위해 같이 포함되는 산소 가스의 유량, DBD 전극의 형태에 따른 증착 박막의 균일성 등 이 존재하며 이런 많은 변수 들에 대한 연구가 진행 되었지만 아직 이 대기압 DBD를 이용한 폴리머 박막의 증착에 대한 명확한 이해는 아직 완전 하다 할 수 없다. 본 연구에서는 이러한 대기압 DBD를 이용하여 폴리머 박막의 증착시 영향을 미치는 많은 공정 변수 등이 박막생성에 미치는 영향과 증착된 박막의 성질에 대한 연구를 진행 하였다.

  • PDF

A Study on the Agglomeration of BaTiO3 Nanoparticles with Differential Synthesis Route (나노입자 합성방법에 따른 타이타늄산바륨 나노입자뭉침 현상 연구)

  • Han, W.-J.;Yoo, B.-Y.;Park, H.-H.
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.22 no.2
    • /
    • pp.33-39
    • /
    • 2015
  • $BaTiO_3$ is typical ferromagnetic materials with dielectric constant of above 200. $BaTiO_3$ nanoparticles applications are available for multiple purposes such as nanocapacitors, ferroelectric random access memories, and so on. Applications are is diverse from the dispersion of nanoparticles depending on the route of synthesis. In this study, $BaTiO_3$ nanoparticles were synthesized by two different methods such as oxalate method and sol-gel process (ambient condition sol method). Particle size and dispersion condition were studied according to the preparation method and capping agent. Poly vinyl pyrrolidone (PVP) was used as a capping agent in oxalate method and tetrabutylammonium hydroxide (TBAH) used as a capping agent in sol-gel process each. Cubic crystal structure of $BaTiO_3$ phase could be confirmed by X-ray diffraction analysis. Fourier transform-infrared spectroscopy was employed for the confirmation of the capping agent and $BaTiO_3$ nanoparticles. The particle size and distribution analysis was also performed by particles size analyzer and scanning electron microscope.

Reliability Improvement of Cu/Low K Flip-chip Packaging Using Underfill Materials (언더필 재료를 사용하는 Cu/Low-K 플립 칩 패키지 공정에서 신뢰성 향상 연구)

  • Hong, Seok-Yoon;Jin, Se-Min;Yi, Jae-Won;Cho, Seong-Hwan;Doh, Jae-Cheon;Lee, Hai-Young
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.18 no.4
    • /
    • pp.19-25
    • /
    • 2011
  • The size reduction of the semiconductor chip and the improvement of the electrical performance have been enabled through the introduction of the Cu/Low-K process in modern electronic industries. However, Cu/Low-K has a disadvantage of the physical properties that is weaker than materials used for existing semiconductor manufacture process. It causes many problems in chip manufacturing and package processes. Especially, the delamination between the Cu layer and the low-K dielectric layer is a main defect after the temperature cycles. Since the Cu/Low-K layer is located on the top of the pad of the flip chip, the stress on the flip chip affects the Cu/Low-K layer directly. Therefore, it is needed to improve the underfill process or materials. Especially, it becomes very important to select the underfill to decrease the stress at the flip-chip and to protect the solder bump. We have solved the delamination problem in a 90 nm Cu/Low-K flip-chip package after the temperature cycle by selecting an appropriate underfill.

Low Temperature Sintering and Microwave Properties in (Mg0.93Ca0.07)TiO3 Ceramics ((Mg0.93Ca0.07)TiO3 세라믹스의 저온소결과 마이크로파 유전특성)

  • Shin, Dong-Soon;Choi, Young-Jin;Park, Jae-Gwan;Park, Jae-Hwan;Nahm, Sahn
    • Journal of the Korean Ceramic Society
    • /
    • v.39 no.6
    • /
    • pp.598-603
    • /
    • 2002
  • The effects of alumine borosilicate glass composition on the densification and the microwave properties of (M $g_{0.93}$C $a_{0.07}$)Ti $O_3$ ceramics were studied. As the amount of glass increase, the density of ceramics increases and grain growth enhances. When 20 ~30 wt% of glass added, it was densified to over 95% of (M $g_{0.93}$C $a_{0.07}$)Ti $O_3$ theoretical density. (M $g_{0.93}$C $a_{0.07}$)Ti $O_3$ ceramic sintered at 95$0^{\circ}C$ exhibits dielectric constants of 15~16, quality factor of 8000 and temperature coefficient of resonant frequency of -45 ppm/$^{\circ}C$ by adding 20 wt% alumine borosilicate glass.

Electrical Properties of $Ba_{1-x}(Bi_{0.5}K_{0.5})TiO_3$ according to $(Bi_{0.5}K_{0.5})TiO_3$ for Pb-free PTC (Pb-free PTC에 있어서 $(Bi_{0.5}K_{0.5})TiO_3$ 첨가에 따른 $Ba_{1-x}(Bi_{0.5}K_{0.5})TiO_3$의 전기적특성)

  • Lee, Mi-Jai;Choi, Byung-Hyun;Paik, Jong-Hoo;Kim, Bip-Nam;Lee, Woo-Yong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.11a
    • /
    • pp.35-36
    • /
    • 2008
  • PTC thermistor are characterized by an increase in the electrical resistance with temperature. The PTC materials of middle Curie point were produced or that of high Curie point (above $200^{\circ}C$), it was determined that compositional modifications of $Pb^{2+}$ for $Ba^{2+}$ produce change sin the Curie point to higher temperature. PTC ceramic materials with the Curie point above $120^{\circ}C$ were prepared by adding $PbTiO_3$, PbO or $Pb_3O_4$ into $BaTiO_3$. Thereby, adding $Pb^{2+}$ into $BaTiO_3$-based PTC material to improve Tc was studied broadly, however, weal know that PbO was poisonous and prone to volatilize, then to pollute the circumstance and hurt to people, so we should dope other innocuous additives instead of lead to increase Tc of composite PTC material. In order to prepare lead-free $BaTiO_3$-based PTC with middle Curie point, the incorporation on $Bi_{1/2}K_{1/2}TiO_3$ into $BaTiO_3$-based ceramics was investigated on samples containing 0, 1, 2, 3, 4, and 50mol% of $Bi_{1/2}K_{1/2}TiO_3$. $Bi_{1/2}K_{1/2}TiO_3$ was compounded as standby material by conventional solid-state reaction technique. The starting materials were $Bi_2O_3$, $K_2CO_3$, $BaCO_3$ and $TiO_2$ powder, and using solid-state reaction method, too. The microstructures of samples were investigated by SEM, DSC, XRD and dielectric properties. Phase composition and lattice parameters were investigated by X-ray diffraction.

  • PDF

Photoluminescence Behavior of $Al^{3+}$, $Pr^{3+}$ Doped Perovskite-type $La_{2/3}TiO_{3}and Pyrochlore-type $La_{2}Ti_{2}O_{7}$ ($Al^{3+}$, $Pr^{3+}$가 첨가된 Perovskite $La_{2/3}TiO_{3}와 Pyrochlore $La_{2}Ti_{2}O_{7}$의 발광 특성)

  • Park, Sang-Mi;Park, Joung-Kyu;Kim, Chang-Hae;Park, Hee-Dong;Jang, Ho-Gyeom
    • Journal of the Korean Ceramic Society
    • /
    • v.38 no.9
    • /
    • pp.806-810
    • /
    • 2001
  • $La_{2/3}TiO_3$, $La_2Ti_2O_7$ are used in various parts by dielectric properties. The purpose of the present study is to understand the photoluminescence properties of $Al^{3+}\;and\;Pr^{3+}$ doped perovskite-type $La_{2/3}TiO_3$ and pyrochlore-type $La_2Ti_2O_7$ phosphor, which characterized by the red emission $(^1D_2{\rightarrow}^3H_4)\;of\;Pr^{3+}$ of $Pr^{3+}$ ion. The explanation for the energy transfer and the corresponding critical distance were proposed on the role of Al^3+ ions as energy transfer mediates in perovskite-type $La_{2/3}TiO_3$:Pr phosphor. In order to clarify the distinction of photoluminescence propoerties between the perovskite-type $La_{2/3}TiO_3$ and the pyrochlore $La_2Ti_2O_7$, the trap-involved process and the charge transfer band have been investigated.

  • PDF

Effect of $BaTiO_3$ according to $(Bi_{0.5}Na_{0.5})TiO_3$ for Pb-free PTC (Pb-free PTC에 있어서 $(Bi_{0.5}Na_{0.5})TiO_3$ 첨가에 따른 $BaTiO_3$ 효과)

  • Lee, Mi-Jai;Paik, Jong-Hoo;Kim, Sei-Ki;Kim, Bip-Nam;Lee, Woo-Yong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2008.06a
    • /
    • pp.57-58
    • /
    • 2008
  • PTC thermistor are characterized by an increase in the electrical resistance with temperature. The PTC materials of middle Curie point were produced or that of high Curie point (above $200^{\circ}C$), it was determined that compositional modifications of $Pb^{2+}$ for $Ba^{2+}$ produce change sin the Curie point to higher temperature. PTC ceramic materials with the Curie point above $120^{\circ}C$ were prepared by adding $PbTiO_3$, PbO or $Pb_3O_4$ into $BaTiO_3$. Thereby, adding $Pb^{2+}$ into $BaTiO_3$-based PTC material to improve Tc was studied broadly, however, weal know that PbO was poisonous and prone to volatilize, then to pollute the circumstance and hurt to people, so we should dope other innocuous additives instead of lead to increase Tc of composite PTC material. In order to prepare lead-free $BaTiO_3$-based PTC with middle Curie point, the incorporation on $Bi_{1/2}Na_{1/2}TiO_3$ into $BaTiO_3$-based ceramics was investigated on samples containing 0, 1, 2, 3, 4, and 50mol% of $Bi_{1/2}Na_{1/2}TiO_3$. $Bi_{1/2}Na_{1/2}TiO_3$ was compounded as standby material by conventional solid-state reaction technique. The starting materials were $Bi_{1/2}Na_{1/2}TiO_3$, $BaCO_3$, $TiO_2$ and $Y_2O_3$ powder, and using solid-state reaction method, too. The microstructures of samples were investigated by SEM, DSC, XRD and dielectric properties. Phase composition and lattice parameters were investigated by X-ray diffraction.

  • PDF

Surface Modification of Ba0.6Sr0.4TiO3 by Trimethylsilyl Chloride as a Silylation Agent (Trimethylsilyl Chloride를 Silylation Agent로 사용한 Ba0.6Sr0.4TiO3 나노입자의 표면개질 연구)

  • Lee, Chan;Han, Wooje;Park, Hyung-Ho
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.26 no.4
    • /
    • pp.127-132
    • /
    • 2019
  • In this study, barium strontium titanate (BSTO) with high dielectric perovskite structure was synthesized by liquid-solid solution synthesis and the surface was modified using trimethylsilyl chloride (TMCS) as a silylation agent. Silylation surface modification is a method of reacting -OH ligand on the surface of BSTO nanoparticles with Cl in TMCS to generate HCl and replacing the ligand on the surface of nanoparticles with -Si, -CH3. Silylation was optimized by varying the concentration of TMCS, and the structure of the silicon network was confirmed by Fourier-transform infrared spectroscopy. In addition, the crystallinity of BSTO nanoparticles was confirmed by X-ray diffractometer and the size of the nanoparticles was calculated using Scherrer equation. The field emission scanning electron microscopic image observed the change of the surface-modified BSTO particle size, and the contact angle measurement confirmed the hydrophobic property of the contact angle of 120.9° in the optimized nanoparticles. Finally, the surface-modified BSTO dispersion experiment in de-ionized water confirmed the hydrophobic degree of the nanoparticles.