• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.2
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• pp.144-150
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• 2008

Recently, there has been growing interest in low loss and low dielectric constant material for LTCC application, as the frequency range for electronic devices increases. This study was designed to evaluate the effect of cordierite filler for low dielectric constant LTCC material. From the previous experiments, two glass compositions of B-Si-Al-Zn-Ba-Ca-O and B-Si-Al-Sr-Ca-O system, were chosen. Each powder of two glass compositions was sintered respectively with commercial cordierite powder in temperature range from $800^{\circ}C\;to\;900^{\circ}C$. Crystalline cordierite and glass peaks were affected only with two factors of composition and sintering temperature among various factors. With the optimized condition of two cordierite/glass compositions, obtained dielectric constant was below 5.5 and quality factor was above 1,000. Closed pore of sintered body was controled by sintering temperature and sintering time. When cordierite/glass composite with ratio of 5.5:4.5 was sintered at $900^{\circ}C$, densification was sufficient with good dielectric characteristics of ${\epsilon}_r<5.1,\;Q{\ge}1,000$. Residual fine closed pores could be reduced with control of sintering temperature and time. 3 point bending strength and chemical durability were evaluated to obtain feasibility for substrate material.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.935-940
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• 2009

In this research, the composites (100-x)LCP-xBNT (x = 0, 10, 20, 30, 40 vol.%) were fabricated with thermoplastic LCP(Liquid Crystal Polymer) and BNT($BaNd_2Ti_4O_{12}$) which is a high frequency dielectric material. Their dielectric properties, mechanical strength and microstructure were investigated by Impedance analyser, Instron and SEM. In order to fabricate LCP-BNT composites, LCP resin was put into the twin screw type mixer($310^{\circ}C$), melted by keeping for 10 min. After that, BNT filler was dispersed with melted LCP resin for 15 min. in the mixer. For measuring the dielectric properties and mechanical strength, Composite specimens were made by pressing composite granule (LCP-BNT) with 7 ton in the mold at $310^{\circ}C$. With increasing the BNT content (0~40 vol.%) of the composite, Its dielectric constant increased, dielectric loss and flexural strength decreased. The dielectric constant and flexural strength of composites with 20~30 vol.% of BNT filler are 4.1~6.0 and 35~55 MPa respectively. BNT/LCP composite is the potential substrate material for the high frequency application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.119-122
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• 2003

This paper describes characteristics for insertion losses of Isolator have an effect on material parameter. One purpose of the paper is to present insertion loss on this resonator for magnetic loss, dielectric loss, magnetic field and saturation magnetization. Another is to study the effect of propeller resonator on response characteristics. In this paper, the analysis and measurement of the response characteristics were carried out for the isolator prototype. The measurement results agreed on the simulation results and acquire insertion loss $0.18\;{\sim}\;0.24dB$, return loss 27dB, isolation 27dB and bandwidth 500MHz on this condition saturation magnetization 550G, dielectric loss 0.0004, magnetic loss 20 and dielectric constant 14.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.90-90
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• 2009

The $Sr_{0.7}Bi_{2.3}Nb_2O_9$(SBN) thin films are deposited on Pt-coated electrode($Pt/Ti.SiO_2/Si$) using RF sputtering method. The dielectric constant of SBN thin films were increased with the increase of annealing temperature. The maximum dielectric constant of SBN thin film is obtained by annealing at 700[$^{\circ}C$]. The dielectric constant and dielectric loss had a stable value within -5~+5[V].

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1092-1095
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• 2005

The effect of the dielectric constant (${\varepsilon}$) of bonding materials in screen-printed carbon nanotube cathode on field enhancement factor was investigated using the ANSYS software for high-efficient CNT-cathodes. The field enhancement factor increased with decreasing the dielectric constant and reaching a maximum value when the dielectric constant is 1, the value for a vacuum. This indicates that the best bonding materials for screen-printing CNT cathodes should have a low dielectric constant and this can be used as criteria for selecting bonding materials for use in CNT pastes for high-efficient CNT-cathodes

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.1038-1042
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• 2005

We have investigated dielectric properties depending on bias voltage in organic light-emitting diodes using 8-hydroxyquinoline aluminum $(Alq_3)$ as an electron transport and emissive material. We analyzed the dielectric properties of organic light-emitting diodes using impedance of characteristics. Impedance characteristics was measured complex impedance Z and phase $\theta$ in the frequency range of 40 Hz to $10^8$ Hz. We obtained complex electrical conductivity, dielectric constant, and loss tangent $(tan\delta)$ of the device at room temperature. From these analyses, we are able to interpret a conduction mechanism and dielectric properties contributed by an interfacial and orientational polarization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.159-159
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• 2007

In order to reduce a signal delay in ULSI, low resistive metal and intermetal dielectric material of low dielectric constant are required. Ordered mesoporous silica film is proper to intermetal dielectric due to its low dielectric constant and superior mechanical properties. In this study, ordered mesoporous silica films was synthesized using TEOS (tetraethoxysilane) / MTES (methyltriethoxysilane) mixed silica precursor and Brij-$76^{(R)}$ surfactant. These films had the porosity of 40% and dielectric constant of 2.5. To lower dielectric constant, the ordered mesoporous silica films were surface-modified by HMDS (hexamethyldisilazane) treatment. HMDS substituted -OH groups on the surface of silica wall for -Si$(CH_3)_3$ groups. After the HMDS treatment, ordered mesoporous silica films were calcined at various calcination temperatures. Through the investigation, it was concluded that the proper calcination temperature is necessary as aspects of structural, electrical, and mechanical properties.

• Transactions on Electrical and Electronic Materials
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• v.16 no.6
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• pp.338-341
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• 2015

Epoxy/micro-sized alumina composite was prepared, and the effects of alumina content on the dielectric properties were investigated in order to develop an insulation material for gas-insulated switchgears (GIS). Nano-sized alumina (average particle size: 30 nm) was also incorporated into the epoxy/micro-sized alumina composite. Dielectric tests were carried out in ASTM D 150, and capacitance (Cp) and dielectric loss (tanδ) were measured. The dielectric constant increased with increasing alumina content in the epoxy/micro-alumina system and the epoxy/micro-alumina/nano-alumina system. As 1,3-diglycidyl glyceryl ether (DGE) content increased, the dielectric constant decreased and dielectric loss increased. This ocurred as a result of the weak electric field enhancement due to homogeneous dispersion of micro- and nano-sized alumina particles in an epoxy composite.

• Journal of Electrical Engineering and Technology
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• v.9 no.3
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• pp.978-983
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• 2014

The polymer nano composite possess good priority recently for engineering applications. Especially the electrical insulating materials attract the high performance of nano composites. In this work the ballmill synthesiation process of nano sized Alumina ($Al_2O_3$), the preparation of new nano composite material with an content of enamel and synthesized Alumina as 1wt%, 3wt% and 5wt%. Experimental investigation has been carried out for the prepared nano composites materials with respect to dielectric parameter measurements such as dielectric loss (tan ${\delta}$), dielectric constant (${\varepsilon}$), dielectric strength under various temperature. The partial discharge level also measured for all the samples and the PD inception voltage is also observed and compared. Weight loss of the material has been analyzed through TGA. It has been experimentally proved that 3wt% of Alumina nano filler added enamel has significant improvement in the dielectric and thermal properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.560-564
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• 1999

In general, the main dielectric materials for EHV electric appliances were epoxy, EPDM and Silicone rubber. The Silicone rubber has been rosed so many among them in EHV appliances in the worldwide, especially in Europe and North America. The reason why it is very stable in the thermal, mechanical and electrical environment. Therefore it is still becoming increasingly widespread in the application of the EHV appliances as a main dielectric material. On this study, investigated about real appliances and tested on basic properties of the Silicone rubber compared to organic dielectric material that is EPDM. At the result, the Silicone rubber is more dominant as main dielectric material for EHV appliances than any other organic polymers.