• Title/Summary/Keyword: Dielectric loss

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Dielectric Properties of Epoxy/Micro-sized Alumina Composite and of Epoxy/Micro-sized/Nano-sized Alumina Composite

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.6
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    • pp.338-341
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    • 2015
  • Epoxy/micro-sized alumina composite was prepared, and the effects of alumina content on the dielectric properties were investigated in order to develop an insulation material for gas-insulated switchgears (GIS). Nano-sized alumina (average particle size: 30 nm) was also incorporated into the epoxy/micro-sized alumina composite. Dielectric tests were carried out in ASTM D 150, and capacitance (Cp) and dielectric loss (tanδ) were measured. The dielectric constant increased with increasing alumina content in the epoxy/micro-alumina system and the epoxy/micro-alumina/nano-alumina system. As 1,3-diglycidyl glyceryl ether (DGE) content increased, the dielectric constant decreased and dielectric loss increased. This ocurred as a result of the weak electric field enhancement due to homogeneous dispersion of micro- and nano-sized alumina particles in an epoxy composite.

Experimental Investigation on Dielectric and Thermal Characteristics of Nanosized Alumina Filler Added Polyimide Enamel

  • Sugumaran, C. Pugazhendhi
    • Journal of Electrical Engineering and Technology
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    • v.9 no.3
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    • pp.978-983
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    • 2014
  • The polymer nano composite possess good priority recently for engineering applications. Especially the electrical insulating materials attract the high performance of nano composites. In this work the ballmill synthesiation process of nano sized Alumina ($Al_2O_3$), the preparation of new nano composite material with an content of enamel and synthesized Alumina as 1wt%, 3wt% and 5wt%. Experimental investigation has been carried out for the prepared nano composites materials with respect to dielectric parameter measurements such as dielectric loss (tan ${\delta}$), dielectric constant (${\varepsilon}$), dielectric strength under various temperature. The partial discharge level also measured for all the samples and the PD inception voltage is also observed and compared. Weight loss of the material has been analyzed through TGA. It has been experimentally proved that 3wt% of Alumina nano filler added enamel has significant improvement in the dielectric and thermal properties.

A Study on the Dielectric Polarization of $ITO/Alq_3/Al$ Structure Organic Light-emitting Diodes ($ITO/Alq_3/Al$ 구조 유기 발광 소자의 유전분극 현상의 연구)

  • Oh, Yong-Cheul;Shin, Cheol-Gi;Kim, Chung-Hyeak
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.1
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    • pp.73-77
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    • 2008
  • We have investigated dielectric polarization in organic light-emitting diodes using 8-hydroxyquinoline aluminum($Alq_3$) as an electron transport and emissive material. We analyzed the dielectric polarization of organic light-emitting diodes using characteristics of impedance and equivalent circuit of $ITO/Alq_3/Al$. Impedance characteristics was measured complex impedance Z and phase ${\theta}$ in the frequency range of $1{\times}40Hz\;to\;1{\times}10^8Hz$. We obtained complex electrical conductivity, dielectric constant, and loss tangent(tan${\delta}$) of the device at room temperature. And, we obtained the equivalent circuit of $ITO/Alq_3/Al$ through analyzing dielectric constant and dielectric loss tangent. From these analyses, we could interpret a conduction mechanism and dielectric polarization.

Dielectric Properties of Fresh Ginseng Determined by an Open-Ended Coaxial Probe Technique (수삼의 마이크로파 유전특성)

  • Hong, Seok-In;Lee, Boo-Yong;Park, Dong-June;Oh, Seung-Yong
    • Korean Journal of Food Science and Technology
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    • v.28 no.3
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    • pp.470-474
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    • 1996
  • The dielectric properties, dielectric constant (${\varepsilon}‘$) and loss factor (${\varepsilon}’$), of skin and pulp of fresh ginseng were measured from $25^{\circ}C$ to $67^{\circ}C$ using an open-ended coaxial probe technique for 915 MHz and 2450 MHz. Pulp and skin had dielectric constant of $30{\sim}64$ and loss factor between 10 and 20, each variable having a respective frequency dependence typical of materials with high water content. Although the loss factor was nearly constant, the dielectric constant increased as moisture content increased. The dielectric constant of ginseng pulp increased as temperature increased (temperature ${\leq}56^{\circ}C$), but any significant differences were not found in skin dielectric properties. Penetration depth for fresh ginseng were about 2 cm at 91.5 MHz and 1cm at 2450 MHz.

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A study on the Dynamic Mechanical and Dielectric Loss according to Quenched Condition in Low Density Polyethylene fer Power Cable (전력 케이블용 저밀도 폴리에틸렌의 냉각 조건에 따른 기계적 및 유전손실에 관한 연구)

  • 김재환;권병휘;박재준
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.6 no.5
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    • pp.27-37
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    • 1992
  • We studied the dielectric and dynamic mechanical losses according to the quenching condition in low density polyethylene being used to power cables. According to severe quenching condition, characteristics of the temperature in internal friction los peak have decreased the magnitude of loss peak as amorphous region lengthen. From now on, the frequency dependent characteristics of dielectric loss have investigated at room temperature, and the dielectric loss peak due to interface polarization, between crystal and amorphous region, occurs about 30[Hz], and that, the peak due to orientation polarization in correspondence to the loss peak in internal friction has observed at about 3 [MHz]. As quenching velocity increased, the effect on quenching condition about the dielectric loss has decreased the magnitude of the loss peak. Thus, estimation has been carried out on the activation energies nd the degree of crystallinity by means of X-ray diffraction are obtained as follows: room quenching : 26.4 [kal/mole] and 54.73 [%], ice quenching : 25.6 [kcal/mole] and 48.47 [%], liquid nitrogen quenching specimens : 22.56 [kcal/mole] and 40.95 [%].

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Dielectric properties with variation of doped mount $ZrO_2$ of BSCT ceramics ($ZrO_2$첨가량에 따른 BSCT 세라믹의 유전특성)

  • 조현무;이성갑;이영희;배선기
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.153-156
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    • 2001
  • (Ba$_{0.6-x}$Sr$_{0.4}$Ca$_{x}$)TiO$_3$ (x=0.10, 0.15, 0.20) ceramics were fabricated by the mixed-oxide method and their dielectric properties were investigated with variation of composition ratio, doped ZrO$_2$ (0.5, 1.0, 1.5, 2.0, 3.0 wt%) and sintered at 145$0^{\circ}C$. The dielectric constant and loss of the x=0.10 specimen applied field were 19.86 and 0.302 % at 0 V/cm, and 25.937 and 0.339 % at 300 V/cm, respectively. Dielectric constant were increased with increased applied field and decreased with increased frequency, and dielectric loss were within 0.1% at applied 800 MHz, respectively. all specimens showed fairly good applied field. Although, dielectric constant and loss of all specimen showed to tend of nearly the same. same.

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The Dielectric Analysis of Insulators for Home Appliances (가전설비용 절연재의 유전열 분석)

  • Jung, Jin-Soo;Jung, Jong-Wook;Yi, Gun-Ho;Bae, Seok-Myung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.206-207
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    • 2006
  • This paper describes the dielectric analysis of several insulators for home appliances. The dielectric characteristics of ABS(acrylonitrile butadiene styrene) were tested in relative permittivity, dielectric loss($tan{\delta}$) and specific resistance and compared with those of the other 4 insulators of PE(polyethylene) series. As a result, the relative permittivity of only the ABS slightly decreased with temperature. In the case of the tan6, the ABS showed higher dielectric loss than the other insulators but more excellent thermal performance. In addition, its changing pattern in specific resistance was very similar to that in $tan{\delta}$.

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A Study on Properties of C-V Degradation due to Heating in Teflon (테프론의 가열에 의한 C-V 열화 특성에 관한 연구)

  • Lee, Sung Ill
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.11
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    • pp.730-735
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    • 2014
  • In this study, the temperature characteristics of electrostatic capacity and dielectric loss for the sample of Teflon film which is degradated at the $120^{\circ}C{\sim}200^{\circ}C$ temperature range in the oven for 10 hours has been measured in through the applied frequency range of 0.1 kHz~4,800 kHz at temperature of $50^{\circ}C$, $90^{\circ}C$, $130^{\circ}C$, $170^{\circ}C$. Also, in the same conditions, the frequency characteristics of electrostatic capacity and dielectric loss for the sample of Teflon film has been measured in through the applied temperature range of $30^{\circ}C{\sim}70^{\circ}C$ on setting frequency of 0.1 kHz, 1 kHz, 10 kHz, 100 kHz. The results of this study are as follows. When the frequency range of 0.1 kHz~4,800 kHz applied to the sample of Teflon film, the electrostatic capacity has been measured at the temperature of $50^{\circ}C$, $90^{\circ}C$, $130^{\circ}C$, $170^{\circ}C$. Through this measurement, it found that the electrostatic capacity decreased with increasing temperature. Regarding this result, may be it is because the electromagnetic coupling is degraded by thermal degradation. When the sample of Teflon film heated at $280^{\circ}C$ for 10 hours in oven, the dielectric loss has changed from unstable status to stabilizing status with increasing the degradation temperature in the $120^{\circ}C$, $160^{\circ}C$, $200^{\circ}C$ range. In this measurement, the two spectrums of dielectric loss appeared. It considers that this spectrum of dielectric loss appeared in 300 Hz is caused by the molecular motion of the C-F or OH group. Through this study, It found that the electrostatic capacity decreased with increasing frequency and temperature, and there is no change in dielectric loss, although the frequency increases.

Electrical Properties of Plasma Polymerized Hexamethyldisiloxane Thin Film (플라즈마 중합법에 의한 헥사메틸디실록산 박막의 전기적 특성)

  • 이상희;이덕출
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.1
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    • pp.43-47
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    • 2001
  • Plasma polymerized hexamethyldisiloxane thin film was fabricated by employing an inter-electrode capacitively coupled type apparatus under the following conditions : carrier gas flow rate of 11 sccm, reaction pressure of 0.1 torr, discharge frequency of 13.56 MHz and discharge power of 30∼90 W. Polymerization rate of thin film fabricated at the discharge power of 90W is 32.5nm/min. Relative dielectric constant and dielectric loss tangent of thin film shows 3.2∼3.8 and 2.6x10$\^$-3/∼4.51x10$\^$-3/ respectively in the frequency range of 1 kHz∼1 MHz. As the annealing temperature is increased, the relative dielectric constant gradually decreases while the dielectric loss tangent increases. The current density increase gradually with increasing annealing temperature and electric field. The electric conduction of the heaxamethyldisiloxane thin film shows Schottky effect.

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Properties with Annealing Temperature of SCT Ceramic Thin Film (SCT 세라믹 박막의 열처리온도 특성)

  • Kim, J.S.;Cho, C.N.;Oh, Y.C.;Shin, C.G.;Choi, W.S.;Kim, C.H.;Lee, J.U.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.566-569
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    • 2002
  • The $(Sr_{0.9}Ca_{0.1})TiO_3$(SCT) thin films are deposited on Pt-coated electrode (Pt/TiN/$SiO_2$/Si) using RF sputtering method. The maximum dielectric constant of SCT thin film is obtained by annealing at $600[^{\circ}C]$. The temperature properties of the dielectric loss have a value within 0.02 in temperature ranges of $-80{\sim}+90[^{\circ}C]$. The capacitance characteristics had a stable value within ${\pm}4[%]$. The drastic decrease of dielectric constant and increase of dielectric loss in SCT thin films is observed above 200[kHz].

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