• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.12
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• pp.961-968
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• 2012

In this study, we have investigated the effects of Mn and Co co-doping on defects, J-E curves and grain boundary characteristics of ZnO-$Bi_2O_3$ (ZB) varistor. Admittance spectra and dielectric functions show two bulk defects of $Zn_i^{{\cdot}{\cdot}}$ (0.17~0.18 eV) and $V_o^{\cdot}$ (0.30~0.33 eV). From J-E characteristics the nonlinear coefficient (${\alpha}$) and resistivity (${\rho}_{gb}$) of pre-breakdown region decreased as 30 to 24 and 5.1 to 0.08 $G{\Omega}cm$ with sintering temperature, respectively. The double Schottky barrier of grain boundaries in ZB(MCo) ($ZnO-Bi_2O_3-Mn_3O_4-Co_3O_4$) could be electrochemically single type. However, its thermal stability was slightly disturbed by ambient oxygen because the apparent activation energy of grain boundaries was changed from 0.64 eV at lower temperature to 1.06 eV at higher temperature. It was revealed that a co-doping of Mn and Co in ZB reduced the heterogeneity of the barrier in grain boundaries and stabilized the barrier against an ambient temperature (${\alpha}$-factor= 0.136).

• Korean Journal of Materials Research
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• v.25 no.3
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• pp.138-143
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• 2015

Aluminum nitride, a compound semiconductor, has a Wurtzite structure; good material properties such as high thermal conductivity, great electric conductivity, high dielectric breakdown strength, a wide energy band gap (6.2eV), a fast elastic wave speed; and excellent in thermal and chemical stability. Furthermore, the thermal expansion coefficient of the aluminum nitride is similar to those of Si and GaAs. Due to these characteristics, aluminum nitride can be applied to electric packaging components, dielectric materials, SAW (surface acoustic wave) devices, and photoelectric devices. In this study, we surveyed the crystallization and preferred orientation of AlN thin films with an X-ray diffractometer. To fabricate the AlN thin film, we used the magnetron sputtering method with $N_2$, NH3 and Ar. According to an increase in the partial pressures of $N_2$ and $NH_3$, Al was nitrified and deposited onto a substrate in a molecular form. When AlN was fabricated with $N_2$, it showed a c-axis orientation and tended toward a high orientation with an increase in the temperature. On the other hand, when AlN was fabricated with $NH_3$, it showed a-axis orientation. This result is coincident with the proposed mechanism. We fabricated AlN thin films with an a-axis orientation by controlling the sputtering electric power, $NH_3$ pressure, deposition speed, and substrate temperature. According to the proposed mechanism, we also fabricated AlN thin films which demonstrated high a-axis and c-axis orientations.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1909-1911
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• 2004

It is caused that insulation paper, which had got a lot of thermal stress by over-load after installation, should have been deteriorated in electrical and mechanical characteristics. Beside, insulation material is decreased the insulating property and accelerated aging of them in case of dielectric loss when transformers are manufactured with some moisture or transformers would have been them because of moisture-permeation, Therefore, in this study we experienced the influence of moisture content in case of the thermal aged insulation paper. we have measured tan ${\delta}$ and breakdown voltage in the ratio of paper' moisture content before the aging and then taken the same tests again after insulation paper thermally accelerating-aged. There is a purpose to gain data for a life-design and to establish aging mechanism in order to continuously study life expectancy of the insulation paper.

• Journal of the Korean Ceramic Society
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• v.32 no.3
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• pp.371-377
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• 1995

Silicon oxide films were grown on single-crystal silicon substrates at low temperatures (25~205$^{\circ}C$) in a low pressure electron cyclotron resonance (ECR) oxygen plasma. The growth rate of the silicon oxide film increased as the temperature increased or the pressure decreased. Also, the thickness of the silicon oxide film increased at negative bias voltage, but not changed at positive bias voltage. The growth law of the silicon oxide film was approximated to the parabolic form. Capacitance-voltage (C-V) and current density-electric field (J-E) characteristics were studied using Al/SiO2/p-Si MOS structures. For a 10.2 nm thick silicon oxide film, the leakage current density at the electric field of 1 MVcm-1 was less than 1.0$\times$10-8Acm-2 and the breakdown field was higher than 10 MVcm-1. The flat band voltage of Al/SiO2/p-Si MOS capacitor was varied in the range of -2~-3 V and the effective dielectric constant was 3.85. These results indicate that high quality oxide films with properties that are similar to those of thermal oxide film can be fastly grown at low temperature using the ECR oxygen plasma.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.19-22
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• 2003

In the response to increasing the demands for electrical energy, much effort aimed to develop and commercialize 1MVA HTS power equipments that is supported by a grant from center for Applied Superconductivity Technology of the 21st Century Frontier R&D Program funded by the Ministry of Science and Technology is going on in Korea. For the development, the cryogenic insulation and winding insulation of it in this paper are discussed. In the first many types of dielectric insulating tests were carried out. In detail Breakdown characteristics of $LN_2$, FRP and turn insulating films, flashover characteristics along the FRP surface in $LN_2$ were verified after distinguishing insulation components in HIS windings. And then model windings were designed and insulation test was conducted. These included a AC withstand voltage test of 50kV rms and a lightning impulse test of 150kV at peak.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1361-1363
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• 1997

Zinc oxide-based MOV was fabricated with $SiO_2$ additive ranging from 0.5 to 4.0 mol%, and the microstructure and electrical characteristics were investigated. $Zn_2SiO_4$ phase formed by $SiO_2$ additive was distributed at ZnO grains, grain boundaries, and multiple grain junctions. As the content of $SiO_2$ additive increases, average grain size decreased from 40.6 to $26.9{\mu}m$ due to the Pinning effect by $Zn_2SiO_4$ at grain boundaries Breakdown voltage and nonlinear exponent increased, and leakage current decreased in the range of $11.2{\sim}6.14{\mu}A$ with an increasing $SiO_2$. Donor concentration and interface state density decreased, and barrier height increased in the range of $0.71{\sim}1.04eV$ with an increasing $SiO_2$. While, as the content of $SiO_2$ additive, apparent dielectric constant decreased, peak frequency of dissipation factor decreased in the range of $6.45{\times}10^5{\sim}3.00{\times}10^5Hz$, and dissipation peak was $0.31{\sim}0.22$ at Peak frequency.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.81-85
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• 2007

Embedded capacitor technology can improve electrical perfomance and reduce assembly cost compared with traditional discrete capacitor technology. To improve the capacitance density of the $Al_2O_3$ based embedded capacitor on Cu cladded fiber reinforced plastics (FR-4), the specific surface area of the $Al_2O_3$ thin films was enlarged and their surface morphologies were controlled by anodization process parameters. From I-V characteristics, it was found that breakdown voltage and leakage current were 23 V and $1{\times}10^{-6}A/cm^2$ at 3.3 V, respectively. We have also measured C-V characteristics of $Pt/Al_2O_3/Al/Ti$ structure on CU/FR4. The capacitance density was $300nF/cm^2$ and the dielectric loss was 0.04. This nano-porous $Al_2O_3$ is a good material candidate for the embedded capacitor application for electronic products.

• Journal of Surface Science and Engineering
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• v.49 no.2
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• pp.119-124
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• 2016

Plasma electrolytic oxidation (PEO) is a promising coating process to produce ceramic oxide on valve metals such as Al, Mg and Ti. The PEO coating is carried out with a dilute alkaline electrolyte solution using a similar technique to conventional anodizing. The coating process involves multiple process parameters which can influence the surface properties of the resultant coating, including power mode, electrolyte solution, substrate, and process time. In this study, ceramic oxide coatings were prepared on commercial Al alloy in electrolytes with different KOH concentrations (0.5 ~ 4 g/L) by plasma electrolytic oxidation. Microstructural and electrochemical characterization were conducted to investigate the effects of electrolyte concentration on the microstructure and electrochemical characteristics of PEO coating. It was revealed that KOH concentration exert a great influence not only on voltage-time responses during PEO process but also on surface morphology of the coating. In the voltage-time response, the dielectric breakdown voltage tended to decrease with increasing KOH concentration, possibly due to difference in solution conductivity. The surface morphology was pancake-like with lower KOH concentration, while a mixed form of reticulate and pancake structures was observed for higher KOH concentration. The KOH concentration was found to have little effect on the electrochemical characteristics of coating, although PEO treatment improved the corrosion resistance of the substrate material significantly.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.8
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• pp.63-69
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• 2015

This paper presents the surface flashover characteristics to simulate the poor contact between an anode and a solid dielectric in a $N_2/O_2$ mixture gas (8/2) under a non-uniform field. The surface flashover voltage of the $N_2/O_2$ mixture gas revealed the irregular tendency that was not in accordance with the Paschen's law with an increasing gap of the poor contact. In addition, the insulation performance of the $N_2/O_2$ mixture gas at 0.6MPa was comparable to that of $SF_6$ gas of 0.1MPa based on the insulation performance on the poor contact. These results are able to apply the insulation design of eco-friendly gas insulation switchgear considering the internal faults.

• Transactions on Electrical and Electronic Materials
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• v.14 no.4
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• pp.193-198
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• 2013

The effects of additives (Cr, Nb, Dy, and Bi) on microstructure, electrical properties, dielectric characteristics, and aging behavior of $ZnO-V_2O_5-MnO_2-Co_3O_4-La_2O_3$ (ZVMCL) ceramics were systematically investigated. The phase formed in common for all ZVMCL ceramics modified with various additives consisted of ZnO grain as a main phase, and $Zn_3(VO_4)_2$ and $ZnV_2O_4$ as the secondary phases. The sintered density and average grain size were in the range of $5.4-5.54g/cm^3$ and $3.7-5.1{\mu}m$, respectively. The ZVMCL ceramics modified with Cr exhibited the highest breakdown field (6,386 V/cm) and the ZVMCL ceramics modified with Nb exhibited the lowest breakdown field (3,517 V/cm). All additives enhanced the nonlinear coefficient (${\alpha}$), by a small or large margin, in particular, additives such as Bi and Nb noticeably increased the nonlinear coefficient, with ${\alpha}=25.5$ and ${\alpha}=23$, respectively. However, on the whole, all additives did not improve the stability against a DC stress, compared with ZVMCL ceramics.