• Journal of IKEEE
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• v.23 no.2
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• pp.614-621
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• 2019

In this paper, we presents the integral equation-fast Fourier transform(IE-FFT) and block matrix preconditioner (BMP) to solve electromagnetic scattering problems of penetrable structures composed of dielectric or magnetic materials. IE-FFT can significantly improve the amount of calculation to solve the matrix equation constructed from the moment method(MoM). Moreover, the iterative method in conjunction with BMP can be significantly reduce the number of iterations required to solve the matrix equations which are constructed from electrically large structures. Numerical results show that IE-FFT and block matrix preconditioner can solve electromagnetic scattering problems for penetrable objects quickly and accurately.

• Composites Research
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• v.32 no.5
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• pp.211-215
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• 2019

The cell culture process under in vitro condition is much different from the actual human body environment. Therefore, in order to precisely simulate the human body environment, a dynamic cell culture device capable of delivering mechanical stimulation to cells is essential. However, conventional dynamic cell culture devices require relatively complicated devices such as tubes, pumps, and motors, and the mechanical stimuli delivered is also simple. In this study, an electro-active polymer actuator as a driving component is introduced to design simply driven dynamic cell culture device without complicated components. The device is capable of delivering relatively complex mechanical stimuli to the cells.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.3
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• pp.246-254
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• 2022

Localized heat can be generated using electrically conductive word-lines built into a 3D NAND flash memory string. The heat anneals the gate dielectric layer and improves the endurance and retention characteristics of memory cells. However, even though the electro-thermal annealing can improve the memory operation, studies to investigate material failures resulting from electro-thermal stress have not been reported yet. In this context, this paper investigated how applying electro-thermal annealing of 3D NAND affected mechanical stability. Hot-spots, which are expected to be mechanically damaged during the electro-thermal annealing, can be determined based on understanding material characteristics such as thermal expansion, thermal conductivity, and electrical conductivity. Finally, several guidelines for improving mechanical stability are provided in terms of bias configuration as well as alternative materials.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.6
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• pp.576-580
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• 2022

Semiconductor devices have evolved from 2D planar FETs to 3D bulk FinFETs, with aggressive device scaling. Bulk FinFETs make it possible to suppress short-channel effects. In addition, the use of low-k dielectric materials as a vacuum gate spacer have been suggested to improve the AC characteristics of the bulk FinFET. However, although the vacuum gate spacer is effective, correlation between the vacuum gate spacer and the short-channel-effects have not yet been compared or discussed. Using a 3D TCAD simulator, this paper demonstrates how to optimize bulk FinFETs including a vacuum gate spacer and to suppress short-channel effects.

• Korean Journal of Materials Research
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• v.2 no.4
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• pp.285-292
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• 1992

Ultrathin(8nm) oxynitride (SiOxNy) film have been formed on Si(100) by rapid thermal processing(RTP) in $O_2$and $N_2$O as reactants. Compared with conventional furnace $O_2$ oxide, the oxynitride dielectrics shows better characteristics of I-V and TDDB, and less flat-band voltage shift. The oxynitride has a behavior of Fowler-Nordheim tunneling in the region of V 〉${\varphi}_0$ simialr to pure Si$O_2$oxide. The relative dielectric constant of oxynitride is higher than that of conventional pure oxide. Excellent diffusion harrier property to dopant(B$F_2$) is also observed. Nitrogen depth profiles by SIMS, AES, and XPS show nitrogen pile - up at Si$O_2$/Si interface, which can explain the improved properties of oxynitride dielectrics.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.142.2-142.2
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• 2015

Plasma etch endpoint detection (EPD) of SiO2 and PR layer is demonstrated by plasma impedance monitoring in this work. Plasma etching process is the core process for making fine pattern devices in semiconductor fabrication, and the etching endpoint detection is one of the essential FDC (Fault Detection and Classification) for yield management and mass production. In general, Optical emission spectrocopy (OES) has been used to detect endpoint because OES can be a simple, non-invasive and real-time plasma monitoring tool. In OES, the trend of a few sensitive wavelengths is traced. However, in case of small-open area etch endpoint detection (ex. contact etch), it is at the boundary of the detection limit because of weak signal intensities of reaction reactants and products. Furthemore, the various materials covering the wafer such as photoresist (PR), dielectric materials, and metals make the analysis of OES signals complicated. In this study, full spectra of optical emission signals were collected and the data were analyzed by a data-mining approach, modified K-means cluster analysis. The K-means cluster analysis is modified suitably to analyze a thousand of wavelength variables from OES. This technique can improve the sensitivity of EPD for small area oxide layer etching processes: about 1.0 % oxide area. This technique is expected to be applied to various plasma monitoring applications including fault detections as well as EPD.

• Journal of the Korean Magnetics Society
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• v.20 no.4
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• pp.143-148
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• 2010

This study examined the effects of sheet thickness on electromagnetic wave absorption characteristics and internal microstructure in 92.6%Fe-6.5%Si-0.9%Cr (wt%) alloy flakes/polymer composite sheets available for quasi-microwave band. The composite sheets with the thickness of 0.3, 0.4 and 0.5 mm were prepared by tape casting. A significant decrease in transmission parameter $S_{21}$ and a large increase in power loss were observed for the thick composite sheet in the frequency range of 1~5 GHz. However the permeability properties were not affected by thickness variation, while the imaginary part of complex permittivity increased with the increase of sheet thickness at 1~5 GHz. The enhanced electromagnetic wave absorption characteristics in the thicker composite sheets was attributed to the changed microstructure and the higher dielectric loss.

• Korean Journal of Materials Research
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• v.7 no.10
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• pp.871-871
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• 1997

(1-x)CaTiO/sub 3/-xLa(Zn/sub 1/2/Ti/sub 1/2/)O/sub 3/의 마이크로 유전특성을 조사하였다. x가 증가함에 따라 비유전율과 공진주파수의 온도계수는 감소하였으며, Qㆍf/sub 0/는 증가하였다. 그 결과 x=0.5인 (Ca/sub 0.5/La/sub 0.5/)(Ti/sub 0.75/Zn/sub 0.25/)O/sub 3/의 조성에서 ε/sub r/=51, Qㆍf/sub 0/=38,000 (at 7 GHz), τ/sub f/=+5ppm/℃의 유전특성이 나타났다. (Ca/sub 0.5/La/sub 0.5/)(Ti/sub 0.75/Zn/sub 0.25/) O/sub 3/조성의 소결온도를 저하시키기 위하여 Bi/sub 2/O/sub 3/를 주조성으로한 소결체를 첨가하여 소결 및 유전특성을 조사하였다. 1wt% 0.76Bi/sub 2/O/sub 3/-0.24NiO가 첨가된 경우 소결온도는 150℃ 낮아졌으며, 비유전율 (ε/sub r/), 공진주파수의 온도계수(τ/sub f), Qㆍf/sub 0/가 각각 50+5ppm/℃, 35,000인 마이크로파 유전특성이 얻어졌다. 또한 3wt%의 0.76Bi/sub 2/O/sub 3/-0.24NiO가 첨가된 경우 소결온도는 200℃ 저하되었고, 비유전율 (ε/sub r/)과 공진주파수의 온도계수 (τ/sub f)는 변하기 않았으나, Qㆍf/sub 0/값이 38,000에서 25,000으로 저하되었다.

• Korean Journal of Materials Research
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• v.2 no.1
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• pp.76-82
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• 1992

Deposition of $TEOS-O_3$ oxide film as inter-metal dielectric layer shows the substrate dependency according to the substrate material and pattern density and pitch size. To minimize substrate and Pattern dependency, TEOS-base and $SiH_4-base$ Plasma oxide were predeposited as underlying material on the substrate. The substrate dependency of $TEOS-O_3$ oxide film was more significant on TEOS-base plasma oxide than on $SiH_4-base$ plasma oxide. The dependency of $TEOS-O_3$ oxide film was remarkably reduced, or nearly eliminated, by $N_2$plasma treatment on TEOS-base plasma oxide, which appears to be caused by the O-Si-N structure, observed on the the surface of TEOS-base plasma oxide.