• Design & Manufacturing
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• v.14 no.4
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• pp.58-64
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• 2020

Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of ㎛. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.

• The monthly packaging world
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• s.241
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• pp.42-45
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• 2013

우리나라 금형산업이 2012년 생산 10조원 시대를 맞이하였다. 1960년대 가내수공업 수준에 머물던 국내 금형산업은 불과 반세기만에 금형 생산 10조원을 넘어서 세계 5위 금형생산국의 입지를 굳건히 하는 한편, 세계 1위 금형강국으로 도약하기 위한 발판을 마련하였다. 한국금형공업협동조합은 매년 통계청 '광업 제조업조사보고서' 자료를 분석하여 금형생산 통계를 발표하고 있다. 최근 2011년 금형생산 통계를 집계한 결과 종업원 10인 이상의 기업을 기준으로 국내에 금형업체는 1,341개사, 생산실적은 7조126억원으로 조사되었다. 또한 조합자체 분석결과 10인 미만의 금형업체는 전국에 약 2,300개사가 존재하고 있으며, 이들 업체의 생산량과 일반 제조업체의 내제화된 금형, 그리고 2012년 추정성장률까지 모두 합산한 경우 2012년 10조원을 넘어선 것으로 전망된다. 이같은 금형산업의 성장이 더욱 뜻깊은 이유는 국가전반의 경제성장에 커다란 파급효과를 남기고 있기 때문이다. 지난해 금형수출이 25.1억 달러와 무역수지 흑자규모 23.6억 달러를 기록해 국가경상수지 개선에 금형이 한몫을 톡톡히 했다. 무엇보다 국가뿌리산업이라고 불리우는 금형은 자동차, 핸드폰, 가전 등 주력산업의 경쟁력을 뒷받침해 이들 제품이 세계 일류상품 반열에 올라서게한 일등공신으로 평가되고 있다. 본 고에서는 한국금형공업협동조합이 발표한 통계자료를 바탕으로 금형 업계 동향을 살펴보도록 한다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.231-238
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• 2002

미세 절삭에 의한 마이크로 형상가공 및 이를 이용한 미세금형 가공기술개발을 위하여 절삭 공구를 이용한 기계적 미세 가공법에 대한 고찰과 더불어 shaping, end-milling, drilling 등의 가공이 가능한 기계적 미세 가공시스템을 구성하고 이를 이용한 미세 치형 그루브와 미세 격벽 등 미세 형상 구조의 금형 개발을 위한 가공실험을 수행하였다. 본 실험에서는 먼저 shaping 방식으로 세 종류의 다이아몬드 바이트를 사용하여 알루미늄, PMMA, Nickel, 황동 등의 소재에 pitch $150{\mu}m$, 높이 $8{\mu}m$ 내외의 미세 치형의 금형 코어를 가공하였고, 다음으로 Z축에 air spindle을 설치하여 $\phi0.2mm$의 end-mill(WC)을 사용하여 황동 소재에 깊이 $200{\mu}m$, 폭 $200{\mu}m,\;100{\mu}m,\;50{\mu}m,\;30{\mu}m$의 두께 변화를 주어 미세 격벽에 대한 가공실험을 하였다. 미세 구멍가공실험으로는 drilling 전용장비를 구성하여 $\phi0.6\~0.15mm$의 drill공구로 SM45C와 세라믹$(Si_3N_4-BN)$ 소재에 스텝이송방식에 의한 미세 구멍 가공 실험을 실시하였다.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.45-50
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• 2008

In previous study, it showed that the MAP was greatly effective polishing process for magnesium plate. But it had lower efficiency than magnetic materials such as SM45C. It was very difficult to cut non-magnetic materials using the MAP process because the process was fundamentally possible by help of a magnetic force. This study aimed to verify analytically formation of the magnetic field in a case of the non-magnetic materials especially focused on magnesium plate. So, In this study, the magnetic density flux was predicted using simulation program. As a result, the magnetic density flux was lower at the center of pole on inductor than outside. It had same result on the experimental verification. And magnetic force was lower according to increase of working gap. So, to improve the magnetic force, permanent magnet was installed under the workpiece. In that case, the magnetic density flux not only at center but also at outside of pole was increased. Therefore, the efficiency of magnetic abrasive polishing was also increased. A design of experimental method was adopted for assessment of parameters' effect on the MAP results of magnesium plate for improving the magnetic force.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Design & Manufacturing
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• v.17 no.1
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• pp.20-26
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• 2023

Lab-on-a-disc is a circular disc shape of cartridge that can be used for blood-based liquid biopsy to diagnose an early stage of cancer. Currently, liquid biopsies are regarded as a time-consuming process, and require sophisticated skills to precisely separate cell-free DNA (cfDNA) and circulating tumor cells (CTCs) floating in the bloodstream for accurate diagnosis. However, by applying the lab-on-a-disc to liquid biopsy, the entire process can be operated automatically. To do so, the lab-on-a-disc should be designed to prevent blood leakage during the centrifugation, transport, and dilution of blood inside the lab-on-a-disc in the process of liquid biopsy. In this study, the main components of lab-on-a-disc for liquid biopsy are fabricated by injection molding for mass production, and ultrasonic welding is employed to ensure the bonding strength between the components. To guarantee accurate ultrasonic welding, the flatness of the components is optimized numerically by using the response surface methodology with four main injection molding processing parameters, including the mold & resin temperatures, the injection speed, and the packing pressure. The 27 times finite element analyses using Moldflow® reveal that the injection time and the packing pressure are the critical factors affecting the flatness of the components with an optimal set of values for all four processing parameters. To further improve the flatness of the lab-on-a-disc components for stable mass production, a quarter-disc shape of lab-on-a-disc with a radius of 75 mm is used instead of a full circular shape of the disc, and this significantly decreases the standard deviation of flatness to 30% due to the reduced overall length of the injection molded components by one-half. Moreover, it is also beneficial to use a quarter disc shape to manage the deviation of flatness under 3 sigma limits.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.3
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• pp.320-326
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• 2017

Multistage deep-drawing technology is used widely in the production of mobile phone battery cases to improve productivity and economy. To ensure adequate capacity and rigidity, such cases are fabricated as a rectangular cup with a high slender ratio. The multistage deep-drawing of a rectangular cup entails a high slender ratio, and the heights of the product sides may be non-uniform because of the complicated deformation mechanisms. This causes problems in product assembly that affects the surface quality of the case. This study examined a blank shape that minimizes the height variations of the product to resolve the aforementioned problems. Optimization design and analysis were performed to identify the shape that yields the least variation. The long and short sides of an oval blank were set as the design variables. The objective function was set to yield the lowest height difference, and the thickness reduction rate of the product was set to the target range. In addition, the height of the final shape was set as a constraint. The height difference was minimized successfully using the optimized design. The design process of the initial blank for all rectangular shapes can be automated in the future.

• Design & Manufacturing
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• v.16 no.4
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• pp.52-59
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• 2022

Currently, Korea is an aging society and is expected to become a super-aged society in about four years. X-ray devices are widely used for early diagnosis in hospitals, and many X-ray technologies are being developed. The development of X-ray device technology is important, but it is also important to increase the reliability of the device through accurate data management. Sensor nodes such as temperature, voltage, and current of the diagnosis device may malfunction or transmit inaccurate data due to various causes such as failure or power outage. Therefore, in this study, the temperature, tube voltage, and tube current data related to each sensor and detection circuit of the diagnostic X-ray imaging device were measured and analyzed. Based on QC data, device failure prediction and diagnosis algorithms were designed and performed. The fault diagnosis algorithm can configure a simulator capable of setting user parameter values, displaying sensor output graphs, and displaying signs of sensor abnormalities, and can check the detection results when each sensor is operating normally and when the sensor is abnormal. It is judged that efficient device management and diagnosis is possible because it monitors abnormal data values (temperature, voltage, current) in real time and automatically diagnoses failures by feeding back the abnormal values detected at each stage. Although this algorithm cannot predict all failures related to temperature, voltage, and current of diagnostic X-ray imaging devices, it can detect temperature rise, bouncing values, device physical limits, input/output values, and radiation-related anomalies. exposure. If a value exceeding the maximum variation value of each data occurs, it is judged that it will be possible to check and respond in preparation for device failure. If a device's sensor fails, unexpected accidents may occur, increasing costs and risks, and regular maintenance cannot cope with all errors or failures. Therefore, since real-time maintenance through continuous data monitoring is possible, reliability improvement, maintenance cost reduction, and efficient management of equipment are expected to be possible.

• Design & Manufacturing
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• v.17 no.2
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• pp.55-61
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• 2023

With femtosecond (fs) laser pulse irradiation on metals, various types of nano- and micro-scale structures can be naturally induced at the surface through laser-matter interaction. Two notable structures are laser-induced periodic surface structures (LIPSSs) and cone/spike structures, which are known to significantly modify the optical and physical properties of metal surfaces. In this work, we irradiate fs laser pulses onto various types of metals, cold-rolled steel, pickled & oiled steel, Fe-18Cr-8Ni alloy, Zn-Mg-Al alloy coated steel, and pure Cu which can be useful for precise molding and imprinting processes, and adjust the morphological profiles of LIPSSs and cone/spike structures for clear structural coloration and a larger range of surface wettability control, respectively, by changing the fluence of laser and the speed of raster scan. The periods of LIPSSs on metals used in our experiments are nearly independent of laser fluence. Accordingly, the structural coloration of the surface with LIPSSs can be optimized with the morphological profile of LIPSSs, controlled only by the speed of the raster scan once the laser fluence is determined for each metal sample. However, different from LIPSSs, we demonstrate that the morphological profiles of the cone/spike structures, including their size, shape, and density, can be manipulated with both the laser fluence and the raster scan speed to increase a change in the contact angle. By injection molding and imprinting processes, it is expected that fs laser-induced surface structures on metals can be replicated to the plastic surfaces and potentially beneficial to control the optical and wetting properties of the surface of injection molded and imprinted products.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.5789-5794
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• 2015

Recently, thin and light-weight production technologies are needed in IT industry in accordance with increase of the smart phones and mobile PC products. In order to make light and high rigidity products, engineering plastic and aluminum materials are frequently used in products appearance and frame hat support structure. Especially aluminum extrusion and CNC Brick processes are widely used for high strength and high rigidity technology. But extrusion method has constraints to apply exterior design and CNC Brick process has relatively high production cost and low speed of manufacturing. In this research, a new process method is introduced in order to reduce material cost and to improve manufacturing speed dramatically. Plate forging process means basically that thickening of local wall area thickness after deform exterior shape by deep drawing and bending process. Therefore, it is possible to minimize the waste of material and the manufacturing time. In this study the process of plate forging is designed using finite element program AFDEX-2D and the thickness and the width of initial deformed blank. And it is verified as a sample which is a part of laptop developed through the proposed plate forging method.