• Design & Manufacturing
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• v.8 no.1
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• pp.14-18
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• 2014

Even though 3D press die design gains more attention everyday in Korea, there are shortages of infrastructure and proper environments for it. What is most needed is human resources development and 3D die design standardization, on which the pace of 3D die design adoption depends. This study focuses on 3D press die design process by looking into an instance in which 3D die design system had been used to sell dies to a company "S" in Japan.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.418-422
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• 2005

In this study, the die design and die series on the surface residual stress of cold drawn eutectoid steel wire has been investigated. Test pieces were fabricated using die series with different mean and final reduction ratio. Surface residual stresses in the axial direction were measured by X-ray diffraction, Broker's 2-dimensional GADDS system. Results were compared with stress profiles which were calculated by 3D and 2D finite element simulation, Hibbitt's ABAQUS 6.4 program in Finite Element Analysis. By means of FEA method, optimal die shape considering delta-parameter were induced and applied in order to determine die sequence designs. Balance of the drawing stresses was also introduced to optimize die sequence.

• Transactions of Materials Processing
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• v.15 no.2 s.83
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• pp.153-157
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• 2006

In this study, the die design and die series on the surface residual stress of cold drawn eutectoid steel wire have been investigated. Test pieces were fabricated using die series with different mean and final reduction ratios. Surface residual stresses in the axial direction were measured by X-ray diffraction, Bruker's 2-dimensional GADDS system. The results were compared with stress profiles that were calculated by 3D and 2D finite element simulations, ABAQUS 6.4 program in finite element analysis(FEA). By means of the FEA method, optimal die shape considering delta-parameter were induced and applied in order to determine die sequence designs. Balance of the drawing stresses was also introduced to optimize die sequence.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.202-210
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• 2011

The fabrication method of aspheric lens is changed from machining to press molding so as to improve the productivity. In the case of the press molding method, the temperature control of the molding die is most important, because the temperature of each molding die determines the quality of lens. But any practical method for direct measuring of the lens temperature and the die internal temperature is yet unknown. Besides, in the case of the press molding system in which the heating and pressing and cooing of a die is done at separate work stations, the lens productivity of the system for small lens is yet too low. The paper shows an improved structure of convective sequential system, the lens productivity of which is three times as many as the conventional convective system. To know the die internal temperature, numerical results are given using ANSYS. A new convective sequential system is developed and tested. Finally, the Taguchi method is applied in order to optimize the setting conditions of individual work station of the system.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.123-132
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from pasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64). Transference of data between AutoCAD and I-DEAS Master Series Drafting is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of five modules, which are input and shape treatment, production feasibility check, strip-layout, data-conversion and die-layout modules. The process planning and Die design system is designed by considering several factors, such as complexities of blank geometry, punch profiles, and the availability of a press equipment and standard parts. This system provides its efficiecy for strip-layout, and die design for lead frame, semiconductor.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.38 no.1
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• pp.44-51
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• 2015

When manufacturing die casting mold, generally, the casting layout design should be considered based on the relations of injection system, casting condition, gate system, and cooling system. According to the various relations of the conditions, the location of product defects was differentiated. High-qualified products can be manufactured as those defects are controlled by the proper modifications of die casting mold with keeping the same conditions. In this research, Computer Aided Engineering (CAE) simulation was performed with the several layout designs in order to optimize the casting layout design of an automotive part (Housing). In order to apply them into the production die-casting mold, the simulation results were analyzed and compared carefully. With the filling process, internal porosities caused by air entrapments were predicted and also compared with the modification of the gate system and overflow. With the solidification analysis, internal porosities occurring during the solidification process were predicted and also compared with the modified gate system. The simulation results were also applied into the production die-casting mold in order to compare the results and verify them with the real casting samples.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.284-287
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• 1987

In this paper, the design and implementation of a multiprocessor based Die Bonder Machine for the semiconductor will be described. This the partial research result, that is, the 1st year portion of the project to be performed for a period of two years from June, 1986 to May, 1988. The mechanical system consists of the following three subsystems : (i) transfer head unit, (ii) die feeding XY-table unit, and (iii) plunge up unit. The overall control system is designed to be essentially a master-slave type in which each slave is functionally fixed in view of software and also the time shared common bus structure with hardwired bus arbitration scheme is utilized, the control system consists of the following three subsystems each of which employs a 16 bits microprocessor MC 68000 : (i) die bonder processor controller, (ii) visual recognition/inspection and display system, (iii) the servo control system. It is reported that the proposed control system were applied to Working Sample and tested in real system, and the results are successful as a working sample phase.

• Proceedings of the Korea Inteligent Information System Society Conference
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• 2001.01a
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• pp.224-229
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• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.14-20
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• 1998

This paper describes a computer-aided die design system of progressive die for making CPT grid. An approach to the development of the automatic design system is based on knowledge-based rules. The developed system is designed by considering several factors, such as grid geometry and punch profile. Grid, a key component of electronic gun, is formed through a sequence of many operations, among which the pilot piercing, beading, notching, bending, swaging and slotting etc. Using the developed system, design parameters are determined and output is generated in graphic forms. Therefore the developed system provides part drawing and the assembly drawing of die set.

• Journal of Korea Foundry Society
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• v.14 no.6
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• pp.576-589
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• 1994

Water modeling experiments and computer simulation for the predictions of defects of die castings are very important to produce high quality castings with less cost. The relation between the variable air vent system and the characteristics of the fluid flow in the die cavity is studied by using water modeling tests, which give ideas on reasonable designing of die cavity, vent arrangement and gating system. In order to test the water modeling, injection is done by using water containing NaCl. Flow behaviors in cavities are visualized by high speed camera and video tape recorder, and local filling time is measured with electrode sensors. Special attention is paid to the configuration of die cavity. Simulated results by computer are examined and compared with the results of water modeling experiments. There are close correlations between the simulated results and water modeling ones.