• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.1-16
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• 2023

Recently, the shift to next-generation wide-bandgap (WBG) power semiconductor for electric vehicle is accelerated due to the need to improve power conversion efficiency and to overcome the limitation of conventional Si power semiconductor. With the adoption of WBG semiconductor, it is also required that the packaging materials for power modules have high temperature durability. As an alternative to conventional high-temperature Pb-based solder, Ag sintering die attach, which is one of the power module packaging process, is receiving attention. In this study, we will introduce the recent research trends on the Ag sintering die attach process. The effects of sintering parameters on the bonding properties and methodology on the exact physical properties of Ag sintered layer by the realization 3D image are discussed. In addition, trends in thermal shock and power cycle reliability test results for power module are discussed.

• Journal of the Korean Society for Nondestructive Testing
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• v.15 no.2
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• pp.364-370
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• 1995

The purpose of this paper was to develop a nondestructive evaluation method of sintered material by ultrasonic method. The density distribution of sintered material becomes inhomogeneous partially because of the friction between the powder and the die during compaction. The inhomogeneity was investigated by measurement of the energy attenuation coefficient and the shift of the center frequency in the frequency spectrum of the ultrasonic reflection echo. The experimental results showed that the center frequency of reflection wave depended linearly on the density of sintered materials. However, the attenuation coefficient decreased inversely as the density increased. This study shows that the shift of the center frequency in the frequency spectrum of reflection wave can be used to a nondestructive evaluation of sintered materials.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.667-670
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• 2005

본 논문은 100um와 80um의 텅스텐 와이어를 이용하여 세라믹(Ceramic)기판에 홀(Hole)을 뚫어 텅스텐 와이어를 수직으로 세우는 방식으로 수직형의 마이크로 스프링을 제작하였다. 마이크로 스프링의 설계를 위해 제한된 실험 결과와 신경회로망을 이용하여 텅스텐 와이어의 두께와 높이, 쉬프트(Shift)의 양을 변화시키면서 장력(Tension force)을 모델링하였고 제작을 통해 검증하였다. 이는 기존의 수평형 프로브카드의 한계를 대체할 수 있는 수직형 프로브카드의 핵심 모듈로서 멀티다이(Multi Die) 뿐만 아니라 범핑(Bumping)타입의 칩 테스트도 가능하다.

• Journal of Navigation and Port Research
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• v.35 no.4
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• pp.299-302
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• 2011

In this letter, the effect of quality factor on center frequency deviation in miniaturized coupled line bandpass filter (BPF) with diagonally end-shorted at their opposite sides and lumped capacitors is theoretically analyzed. The miniaturized BPF of a two-stage structure with two types of quality factors in standard CMOS process was designed and manufactured at 5.5 GHz. The die area of BPF was $1.44{\times}0.41\;mm^2$. The measured center frequency of BPF with a quality factor of 4.9 was deviated from 5.5 GHz to 4.7 GHz. The one with 14.8 was shifted to 5GHz. The theoretical and measured results validate that quality factor influences the center frequency shift of BPF.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1195-1198
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• 2003

Micro former has been known as a useful tool for machining micro parts. It makes micro holes automatically with punches, a hole-shape die and material by rotation of crank shaft synchronously. Micro displacement in micro forming affects on the performance of machining because micro forming size is similar with its mechanical displacement. Therefore, the measurement of this micro displacement is essential to be guaranteed to obtain high forming precision in the whole machine as well as its devices. This paper addresses the development of a laser interferometer to measure micro displacement for a micro former. The laser interferometer is able to measure micro displacement during a few micro seconds with non-contact. For the experiment, a laser probe is installed on the optical table with optical devices and a micro displacement generating device. The velocity decoding board is also added to calculate doppler shift frequency directly. Finally simple experiments are conducted to confirm its functional operation.

• The Journal of Korean Physical Therapy
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• v.5 no.1
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• pp.79-87
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• 1993

The purpose of this literature review was to identify the physiological changes with aging. The results of this renew were to follows : We have seen a wide variety of such changes in the cells and in all organ systems. 1. At least 40 percent of people over 65 will die of cardiac disease, 15 percent of cerebrovascular disease, and possibly another 5 percent of other types of vascular impairment. 2. The increase rigidity of the thoracic wall and the decreased strength of the expiratory muscles decrease the propulsive effectiveness of the cough. 3. The density of capillaries per motor units is decreased. 4. Starting before age 40 in both sexes there is a shift from an increase in bone mass to a progressive decrease. 5. Histologic studies show a lim age-correlated decrease in the number of Pacini's. Merkel's, and Meissner's corpuscles.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.450-453
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• 2008

During the drawing of reentrant section like a spline, the unfilled in the corner of dies or the bended product emerges from the large reduction of area, the complex shaped sections and other nonuniform properties in material and lubrication conditions. In this study, the drawing of the spline section with the non-rotary symmetry from a circular aluminum billet has been analyzed by using commercial code DEFORM-3D. A new die construction method preventing the spline from the drawback of bending and the unfilled defect has been suggested and verified through the analysis using centroid shift method and the hybrid construction between converged and diverged profile.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.35-41
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• 2003

The multihole blanking of thin sheet metal using progressive die set is an important process on production of precision electronic machine parts such as IC leadframe. In this paper, in order to investigate the influence of blanking order on the final lead profile and deformed configuration, simulation technique for progressive blanking process is proposed and analyzed by LS-DYNA. The results of FE-simulations are in good agreement with the experimental results. Consequently, from the results of FE-analysis based on the procedure proposed in this paper, it is possible to predict the deformation of lead and to manufacture high precision leadframes in progressive blanking process and these results might be used as a guideline to develop layout design system in multihole blanking process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.272-281
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• 2013

This paper presents low power frequency shift keying (FSK) transmitter using all digital PLL (ADPLL) for smart utility network (SUN). In order to operate at low-power and to integrate a small die area, the ADPLL is adopted in transmitter. The phase noise of the ADPLL is improved by using a fine resolution time to digital converter (TDC) and digitally controlled oscillator (DCO). The FSK transmitter is implemented in $0.18{\mu}m$ 1-poly 6-metal CMOS technology. The die area of the transmitter including ADPLL is $3.5mm^2$. The power consumption of the ADPLL is 12.43 mW. And, the power consumptions of the transmitter are 35.36 mW and 65.57 mW when the output power levels are -1.6 dBm and +12 dBm, respectively. Both of them are supplied by 1.8 V voltage source. The frequency resolution of the TDC is 2.7 ps. The effective DCO frequency resolution with the differential MOS varactor and sigma-delta modulator is 2.5 Hz. The phase noise of the ADPLL output at 1.8 GHz is -121.17 dBc/Hz with a 1 MHz offset.

• ETRI Journal
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• v.26 no.3
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• pp.229-240
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• 2004

This paper reports on our development of a dual-mode transceiver for a CMOS high-rate Bluetooth system-onchip solution. The transceiver includes most of the radio building blocks such as an active complex filter, a Gaussian frequency shift keying (GFSK) demodulator, a variable gain amplifier (VGA), a dc offset cancellation circuit, a quadrature local oscillator (LO) generator, and an RF front-end. It is designed for both the normal-rate Bluetooth with an instantaneous bit rate of 1 Mb/s and the high-rate Bluetooth of up to 12 Mb/s. The receiver employs a dualconversion combined with a baseband dual-path architecture for resolving many problems such as flicker noise, dc offset, and power consumption of the dual-mode system. The transceiver requires none of the external image-rejection and intermediate frequency (IF) channel filters by using an LO of 1.6 GHz and the fifth order onchip filters. The chip is fabricated on a $6.5-mm^{2}$ die using a standard $0.25-{\mu}m$ CMOS technology. Experimental results show an in-band image-rejection ratio of 40 dB, an IIP3 of -5 dBm, and a sensitivity of -77 dBm for the Bluetooth mode when the losses from the external components are compensated. It consumes 42 mA in receive ${\pi}/4-diffrential$ quadrature phase-shift keying $({\pi}/4-DQPSK)$ mode of 8 Mb/s, 35 mA in receive GFSK mode of 1 Mb/s, and 32 mA in transmit mode from a 2.5-V supply. These results indicate that the architecture and circuits are adaptable to the implementation of a low-cost, multi-mode, high-speed wireless personal area network.