• Title/Summary/Keyword: Die Angle

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A Study on the Burr Formation in Shearing with Al Alloy (Al 합금의 전단작업시 발생하는 버어에 관한 연구)

  • Ko, Dae-Lim;Jung, Dong-Won;Kim, Jim-Moo;Lee, Kyung-Sick
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.6 no.2
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    • pp.17-21
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    • 2007
  • Shearing including punching, blanking, trimming, slitting, etc is one of the most frequently used processes in sheet metal manufacturing. It has been widely used for manufacturing autobody, electronic components, aircraftbody, etc. In this paper, it has been researched by the experiment to examine the effect of burr height corresponding to die clearance, cutting angle, tool sharpness, etc. This paper presents the experimental results with using Al alloy sheet.

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Machining Technology of Free From Surface using Controlled of Cutting Speed (절삭속도 일정제어를 통한 자유곡명의 가공기술)

  • 김경균;강명창;이득우;정융호;김정석
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.806-809
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    • 2000
  • The factors which can improve tool life in machining are consisted of tool geometries, tool materials, coating methods. cutting environments, cutting conditions and so on. Cutting speed in cutting conditions is one of the important factors which can directly influence on the tool life. This paper deals the machinability which is concerned about the cutting direction and the tilt angle of fret form surface in hot die steel(STD I I). The NC datum were analysrd and the effective tool diameters were calculated according to the change of tilt angle the program which can continue the cutting speed with the change of spindle revolution is developed.

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Development of Seesaw-Type CSP Solder Ball Loader (CSP용 시소타입 로딩장치의 개발)

  • Lee, J.H.;Koo, H.M.;Woo, Y.H.;Lee, C.W.;Shin, Y.E.
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.873-878
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    • 2000
  • Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

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Cutting force analysis in ball-end milling processes of STD11 (STD11의 볼엔드밀링 공정에서의 절삭력 해석)

  • 김남규
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.52-57
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    • 2000
  • STD11 is one of difficult-to-cut materials and its cutting characteristic data is not built enough. A bad cutting condition of it leads to low productivity of die and mould, so it is necessary to evaluate the machining characteristics of STD11. In this paper, the relations of the geometry of ball-end mill and mechanics of machining with it are studied. The helix angle of ball-end mill varies according to a location of elemental cutting edge in the cutting process are difficult to calculate accurately. To calculate instantaneous cutting forces, it is supposed that the tangential, radial and axial cutting force coefficients are functions of elemental cutting edge location. Elemental cutting forces in the x,y and z direction are calculated by coordinate transformation. The total cutting forces are calculated by integrating the elemental cutting forces of engaged cutting edge elements. This model is verified by slot and side cutting experiments of STD11 workpiece which was heat-treated to HRC45.

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Prediction of crack propagation path in IC package by BEM (경계요소법에 의한 반도체 패키지의 균열진전경로 예측)

  • Song, Chun-Ho;Chung, Nam-Yong
    • Proceedings of the KSME Conference
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    • 2001.06a
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    • pp.286-291
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    • 2001
  • Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

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A Study on the Process of Tube End Spining by the Upper bound Method and Finite Element Method (상계해법과 유한요소법을 이용한 스피닝공정 해석에 관한 연구)

  • 김진형;홍성인;이영선
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1996.03b
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    • pp.23-30
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    • 1996
  • The purpose of this study was to investigate changes in thewall thickness of tube sinking and working forces by the upper bound method and ABAQUS code. The independent variables were : Workpiece material, original wall thickness of tube, die angle, friction, and diameter reduction. The results indicated that of these five variables were a factor in wall-thickness increase and working forces. Three variables, a inner tube wall angle and two angles of the velocity discontinuous surfaces, are optimized in this proposed velocity field by the upper bound method. In this method, we can estimate the working forces and final tube thicknesses whcih are similar to acturla forming process. Optimized process variables which are obtained by upper bound method are used in ABAQUS pre-model . In ABAQUS analysis, the stress and the strain contours which are considered to be heat generation occured by the friction during forming process are observed.

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A study on the process of tube end spinning by the upper bound method and the finite element method (상계해법과 유한요소법을 이용한 스피닝공정 해석에 관한 연구)

  • 김전형;홍성인;이정환;이영선
    • Transactions of Materials Processing
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    • v.6 no.6
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    • pp.517-526
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    • 1997
  • The purpose of this study is to investigate changes in the wall thickness of tube sinking and working forces by the upper bound method and ABAQUS code. The independent variables are ; workpiece material, original wall thickness of tube, die angle, friction, and reduction of diameter. The results indicate that these five variables are factors of the increase in wall-thickness and working forces. Three variables, a inner tube wall angle and two angles of the velocity discontinuous surfaces, are optimized in this proposed velocity field by the upper bound method. In this method, we can estimate the working forces and final tube thicknesses similar to actual forming process. Optimum process variables which are obtained by upper bound method are used in ABAQUS pre-model.

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A Study of Characteristic According to Rake Angel of Endmill (엔드밀의 경사각에 따른 특성 연구)

  • 김경배;서천석;박찬섭;고성림
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.10a
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    • pp.471-478
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    • 2000
  • Endmill is one of the most important cutting tool, not only for machining of mold and die, but also for manufacturing of car industrial. Futhermore with spindle speeds on the increase and machined-surface quality aspiring to higher levels. The purpose of this study is an analysis of endmill's rake angle for appropriate tools design and making for the high speed machining. In this study, Experimental works are also executed to measure shape of endmills, cutting force, on different shape of endmills. Finally, To get concept of endmill design, Tool life was experimented on various design of tool from this study.

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FE-Simulation on drawing process of $Al-1\%Si$ bonding wire considering influence of fine Si particle (미세 Si 입자의 영향을 고려한 $Al-1\%Si$ 본딩 와이어의 신선공정해석)

  • Hwang W. H.;Moon H. J.;Ko D. C.;Kim B. M.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.393-396
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    • 2005
  • This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.

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A study on the fabrication and processing of ultra-precision diamond tools using FIB milling (FIB milling을 이용한 고정밀 다이아몬드공구 제작과 공정에 관한 연구)

  • Wi, Eun-Chan;Jung, Sung-Taek;Kim, Hyun-Jeong;Song, Ki-Hyeong;Choi, Young-Jae;Lee, Joo-Hyung;Baek, Seung-Yup
    • Design & Manufacturing
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    • v.14 no.2
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    • pp.56-61
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    • 2020
  • Recently, research for machining next-generation micro semiconductor processes and micro patterns has been actively conducted. In particular, it is applied to various industrial fields depending on the machining method in the case of FIB (Focused ion beam) milling. In this study, intends to deal with FIB milling machining technology for ultra-precision diamond tool fabrication technology. Ultra-precision diamond tools require nano-scale precision, and FIB milling is a useful method for nano-scale precision machining. However, FIB milling has a problem of Gaussian characteristics that are differently formed according to the beam current due to the input of an ion beam source, and there are process conditions to be considered, such as a side clearance angle problem of a diamond tool that is differently formed according to the tilting angle. A series of process steps for fabrication a ultra-precision diamond tool were studied and analyzed for each process. It was confirmed that the effect on the fabrication process was large depending on the spot size of the beam and the current of the beam as a result of the experimental analysis.