• Journal of the Korean Society of Industry Convergence
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• v.23 no.6_2
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• pp.935-941
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• 2020

In this study, the effect of different shapes on the heat dissipation characteristics of other porous frames on LED lighting frames was studied using finite element analysis. In addition, the heat transfer characteristics of LED frames were tested using a thermal imaging camera and the results of finite element analysis were compared to derive the optimal hole shape. According to the study, the heat dissipation effect was better for frames with hole compared to existing ones without holes. In particular, the heat dissipation characteristics test showed that for frames with holes, the rise time to the maximum temperature is fast and the maximum temperature is significantly lower. Also, we could see that the square and diamond shapes were smaller than the circular pores, but had a greater heat dissipation effect. Through this study, we have concluded that there is a limit to increasing the heat dissipation effect of the frame with a perforated shape, and it is necessary to conduct further research on the change in the shape of the frame in order to achieve a better heat dissipation effect in the future.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.1
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• pp.33-38
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• 2006

Silicon has been widely used in electronic parts as a semiconductor equipment. It, however, requires much effort to grind without microcrack and chipping because of its high hardness and brittleness. So far, many studies for the grinding of engineering ceramics have been done, but not for the grinding of silicon. In this paper, a theoretical analysis on the grinding forces is introduced. Grinding experiments were performed at various grinding conditions including grinding directions (Up grinding and Down grinding), table speeds and depth of cuts. The grinding forces were measured to compare at various grinding conditions. The experimental values agree well with theoretical ones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.7
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• pp.631-635
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• 2006

The properties of metal interlayered DLC films between the Si substrate and the DLC films were studied. DC magnetron sputtering method has been used to deposit intermediate layers of metals. And RF-PECVD method has been employed to synthesize DLC onto substrates of the silicon and metal layers. After we used metal Inter-layers, such as chromium, nickel, titanium and we studied tribological properties of the DLC films. The thickness of films were observed by field emission scanning electron microscope (FE-SEM). Also the surface morphology of the films were observed by an atomic force microscope (AFM). The crystallographic properties of the films were analyzed with X-ray diffraction (XRD), the friction coefficients were investigated by AFM in friction force microscope (FFM) mode. Tribological performances of the films were estimated by nano-indenter, stress tester measurement.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.12-14
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• 2003

본 연구에서는 우리나라의 송전선로에 주로 적용하고 있는 역상수직 2회선 배열을 기본 모델로 하여 다양한 저감 설계기술 적용시의 FRF(Field Reduction Factor)를 구하는데 중점을 두었다. 검토한 결과로는 신규선로 저감기술로서는 송전선로의 경우 지상고 증가, Compact Tower개발, Diamond Tower의 채용, 일부 구간의 Transposed 선로배치 등이 우리나라에서 적용 가능한 후보군으로 분석되었다.

• Communications of the Korean Mathematical Society
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• v.32 no.3
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• pp.765-778
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• 2017

Finding an initial feasible solution on the central path is the main difficulty of feasible interior-point methods. Although, some algorithms have been suggested to remedy this difficulty, many practical implementations often do not use perfectly centered starting points. Therefore, it is worth to analyze the case that the starting point is not exactly on the central path. In this paper, we propose a weighted-path following interior-point algorithm for solving the Cartesian $P_{\ast}({\kappa})$-linear complementarity problems (LCPs) over symmetric cones. The convergence analysis of the algorithm is shown and it is proved that the algorithm terminates after at most $O\((1+4{\kappa}){\sqrt{r}}{\log}{\frac{x^0{\diamond}s^0}{\varepsilon}}\)$ iterations.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.115-121
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• 2007

Phase contrast imaging in atomic force microscopy showed a promise as an effective tool for better understanding of micromechanical properties of surfaces at nano scale. A qualitative estimation model for phase contrast images obtained with a tapping mode AFM was developed. This investigation demonstrated the high efficiency of combined analysis of topography and phase contrast images for characterizing nanosurfaces. Phase contrast images allowed estimation of relative stiffness(elastic modulus) of the sample surface. The phase contrast images revealed a significant inhomogeneity of the nano scale worn surfaces. Phase contrast images are also capable of revealing the formation of tribofilms.

• International Journal of Highway Engineering
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• v.14 no.5
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• pp.67-74
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• 2012

PURPOSES: In this study the influence factors related to abrasion resistance of interlocking concrete block have been evaluated, and comparisons between various domestic and foreign abrasion test methods was also accomplished. METHODS: The modified rotational cutting method suggested in ASTM C 944 was applied. Surface materials with different types of fine aggregate such as crushed sand, sea sand, and mixture of crushed and sea sand were tested to compare the aggregate effect for abrasion resistance. RESULTS: The different surface mixtures with various W/C ratios, mortar and fly ash ratios have been investigated for functional and economical considerations. CONCLUSIONS: This study had obtained reliable results by changing diamond blade of rotating cutter. Therefore, in order to improve the abrasion resistance of interlocking concrete block for road, a new mix design was proposed.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.5
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• pp.70-75
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• 2000

After the patterning and probe process of wafer have been achieved, the dicing process is necessary to separate chips from a wafer. The dicing process cuts a wafer to lengthwise and crosswise direction to make many chips by using narrow circular rotating diamond blade. But inferior goods are made under the influence of complex dicing environment such as blade, wafer, cutting water and cutting conditions. This paper describes a monitoring algorithm using feature extraction in order to find out an instant of vibration signal change when bad dicing appears. The algorithm is composed of two steps: feature extraction and decision. In the feature extraction, two features processed from vibration signal which is acquired by accelerometer attached on blade head are proposed. In the decision. a threshold method is adopted to classify the dicing process into normal and abnormal dicing. Experiment have been performed for GaAs semiconductor wafer. Based upon observation of the experimental results, the proposed scheme shown a good accuracy of classification performance by which the inferior goods decreased from 35.2% to 12.8%.

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.3
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• pp.224-230
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• 2009

FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis and IC error correction, etc. Currently, FIB is not being applied to the fabrication of the micro and nano-structured mold, because of low productivity. And also sputtering rate has been required to fabricate 3D shape. In the paper, we studied the FIB-Sputtering rate according to mold materials. And surface roughness characteristics had been analysed for micro or nano mold fabrication. Si wafer, Glassy Carbon, STAVAX and DLC that have been normally considered as good micro or nano mold materials were used in the study.