• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.101-103
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• 2016

Recently, the target object can be represented as sparse coefficient vector in visual tracking. Due to this reason, exploitation of the compressibility in the transform domain by using L1 minimization is needed. Further, L1 minimization is proposed to handle the occlusion problem in visual tracking, since tracking failures mostly are caused by occlusion. Furthermore, there is a weighted parameter in L1 minimization that influences the result of this minimization. In this paper, this parameter is analyzed for occlusion problem in visual tracking. Several coefficients that derived from median value of the target object, mean value of the arget object, the standard deviation of the target object are, 0, 0.1, and 0.01 are used as weighted parameter of L1 minimization. Based on the experimental results, the value which is equal to 0.1 is suggested as weighted parameter of L1 minimization, due to achieved the best result of success rate and precision performance parameter. Both of these performance parameters are based on one pass evaluation (OPE).

• KOREAN JOURNAL OF CROP SCIENCE
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• v.42 no.5
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• pp.604-608
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• 1997

Ten selected soybean genotypes, consisting of nine from a pedigree breeding programme and one recommended variety, were evaluated in nine different locations and over two years for stability of yield performance. Variance component analysis revealed that soybean regional yield trials should be performed at more locations rather than in more years. Five stability parameters, which were coefficient of variability, regression coefficient, deviation parameter, variance component for genotype$\times$environment interaction, and ecovalence, were employed in the evaluation. Significant genotype$\times$environment interaction was present with respect to soybean yield. The highest average yield over nine locations and two years was shown in Suwon 145, which was considered to be stable in all stability statistics. In rank correlation among stability parameters, there were highly significant correlations among stability parameters derived from three Eberhart and Russell's, Plaisted's, and Wricke's methods. Due to the different ranking of genotypes by different stability parameters, a comprehensive method should be employed to identify the promising genotype as well as to characterize the relationship between genotype and environment.

• Journal of Energy Engineering
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• v.15 no.1 s.45
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• pp.67-73
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• 2006

A calculation method on performance impact of the controllable operations parameter such as GT inlet filter ${\Delta}P$, compressor efficiency, and condenser pressure was devised to achieve best performance of combined cycle power plant with the on-line performance monitoring system. This method calculates the performance impact on the deviation between 'Expected' values and 'Actual' values. Controllable parameter targets are determined based on achievable performance given existing equipments and control conditions.

• Journal of the Korean Society for Aviation and Aeronautics
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• v.19 no.2
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• pp.16-22
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• 2011

It is recognized that the control surface fault is detected by monitoring the value of the coefficients due to the control surface deviation. It is found out the control surface stuck position by comparing the trim value with the reference value. To detect and isolate the fault, two mixed methods apply to the real-time parameter estimation and similarity measure. If the scatter of aerodynamic coefficients for the fault and normal are closing nearly, fault decision is difficult. Applying similarity measure to decide for fault or not, it makes a clear and easy distinction between fault and normal. Low power processor is applied to the real-time parameter estimator and computation of similarity measure.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.211-214
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• 2005

This research studied robust design of composite structure under combined loading of bending and torsion. DOE (Design of Experiment) technique was used to find important design factors. The results show that the beam height, beam width, layer thickness and stack angle of outer-layer are important design parameter. The $2^{nd}$ DOE and RSM (Response Surface Model) were conducted to obtain optimum design. Multi-island genetic algorithm was used to optimum design. An approximate value of 6.65 mm in deflection was expected under optimum condition. Six sigma robust design was conducted to find out guideline for control range of design parameter. To acquire six sigma level reliability, the sigma level reliability, the standard deviation of design parameter should be controlled within 2.5 % of average design value.

• Journal of Korean Institute of Industrial Engineers
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• v.31 no.2
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• pp.164-172
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• 2005

A loss function approach to a multiresponse problem is considered, when process parameters are regarded as random variables. The variation of each response may be amplified through so called propagation of error (POE), which is defined as the standard deviation of the transmitted variability in the response as a function of process parameters. The forms of POE for each response and for a pair of responses are proposed and they are reflected in our loss function approach to determine the optimal condition. The proposed method is illustrated using a polymer case. The result is compared with the case where parameter fluctuation is not considered.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.10 no.1
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• pp.64-69
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• 2014

Gr. 91 steel is used for the major structural components of Generation-IV reactor systems, such as a very high temperature reactor(VHTR) and sodium-cooled fast reactor(SFR). Since these structures are designed for up to 60 years at elevated temperatures, the prediction of long-term creep life is important for a design application of Gr. 91 steel. In this study, a number of creep rupture data were collected through world-wide literature surveys, and using these data, the long-term creep life was predicted in terms of three methods: the single-C method in Larson-Miller(L-M) parameter, multi-C constant method in the L-M parameter, and a modified method("sinh" equation) in the L-M parameter. The results of the creep-life prediction were compared using the standard deviation of error value, respectively. Modified method proposed by the "sinh" equation revealed better agreement in creep life prediction than the single-C L-M method.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.12
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• pp.15-19
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• 2016

The gate bias dependence of kink phenomenon with a large deviation from the resistance circle in Smith chart is observed in the frequency response of $S_{11}$-parameter for large multi-finger RF MOSFETs. For the first time, this bias dependence is analyzed by measuring magnitude and phase of $S_{11}$-parameter, input resistance and input capacitance. As a result, $V_{gs}$ dependent $S_{11}$-parameter is largely changed by the magnitude of input capacitance as well as dominant pole and zero frequencies of input resistance. At $V_{gs}=0V$, the kink phenomenon occurs in the high frequency region because of very small phase difference of $S_{11}$-parameter and high pole frequency of input resistance. However, the kink phenomenon at higher $V_{gs}$ is generated in the low frequency region owing to large phase difference and low pole frequency.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.57-62
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• 2012

In this paper, numerical analysis by finite element method, parameter design by the Taguchi method and ANOVA method were used to analyze about effect of design deviations and thickness variations on warpage of FCCSP substrate. Based on the computed results, it was known that core material in substrate was the most determining deviation for reducing warpage. Solder resist, prepreg and circuit layer were insignificant effect on warpage relatively. But these results meant not thickness effect was little importance but mechanical properties of core material were very effective. Warpage decreased as Solder resist and circuit layer thickness decreased but effect of prepreg thickness was conversely. Also, these results showed substrate warpage would be increased to maximum 40% as thickness deviation combination. It meant warpage was affected by thickness tolerance under manufacturing process even if it were met quality requirements. Threfore, it was strongly recommended that substrate thickness deviation should be optimized and controlled precisely to reduce warpage in manufacturing process.