• 제목/요약/키워드: Development Board

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MPU를 이용한 디바이스 모듈 자동 인식 자동화 시스템의 개발 (A Development of Automation System of Auto-Recognition for Device Modules using Micro-Processing Unit)

  • 인치호
    • 한국ITS학회 논문지
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    • 제5권3호
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    • pp.24-28
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    • 2006
  • 본 논문에서는 메인 제어 보드에 연결되는 디바이스 모듈 보드들을 자동하는 인식하는 새로운 자동화 시스템을 설계 및 구현하였다. 본 논문의 시스템은 메인보드와 디바이스 모듈 보드로 나누어 설계하였으며, 메인보드에는 모듈보드와 연결할 수 있도록 슬롯 구조에 의해 설계되었다. 제안된 슬롯구조는 장착이 편리하고 기능의 추가 및 확장이 가능하도록 하였다. 또한 장치 보드들을 자동으로 인식함으로 통해 새로운 기존의 시스템을 업그레이드하거나 새로운 디바이스의 추가하는 등의 기능변경이 용이하도록 시스템을 설계 및 개발하였다. 본 논문에서 제안 된 시스템은 K10S1 PLC를 가지고 실험 및 검증하였다. 실험 분석 결과 제품의 기능향상에 드는 간 및 비용의 단축 효과가 나타났다.

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고강도콘크리트 내화성능을 확보한 건식화 PFB 공법 개발에 관한 연구 (A Study on the Development of a Dry PFB Method with High Fire Resistance)

  • 김우재;정상진
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2008년도 추계 학술논문 발표대회
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    • pp.49-52
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    • 2008
  • The present study was to develop a dry PFB method similar to the existing gypsum board construction method in order to apply the existing wet PFB method that uses fire-resistant adhesive. It was found that the existing wet method can produce concrete compressive strength of 80MPa and fire resistance of 3 hours with 30mm PF boards. The goal of development in this study was fire resistance of 3 hours through dry construction of 15mm fire-resistant boards. 1. Improved PF board was prepared by adding inorganic fiber to existing board and using aggregate with grain size of 3mm or less. Molding was done at temperature higher than that for existing PF board molding. While wet curing is used for existing PF boards, this study used dry curing in order to enhance heat insulation performance. 2. According to the results of fire resistance test, when the dry PF method was applied, the temperature of the main reinforcing bar was 116℃ in 15mm, 103.8℃ in 20mm, and 94℃ in 25mm, and these results satisfied the current standards for fire resistance control presented by the Ministry of Land, Transport and Maritime Affairs. When a 3-hour fire resistance test was performed and the external properties of the specimen were examined, the outermost gypsum board hardly remained and internal PF board maintained its form without thermal strain.

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A study on Automatic field Test Equipment with improved maintenance and environmental reliability

  • Lee, Seok-Min
    • 한국컴퓨터정보학회논문지
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    • 제23권3호
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    • pp.9-16
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    • 2018
  • In this paper, I purpose one of the development methods for portable Automatic field Test Equipment(ATE) with VME form factor. Almost portable ATE have not used to standards form factor and they are connected by mechanical non-rigid general connectors and wire harnesses among the components. Furthermore, it is hard to reuse developed board. So, it decreases to reusability of developed board and it is hard to maintenance of ATE. Even those things have weakness for vibration and drop test especially in portable ATE. The XK9A1 ATE using VME form factor has environmental reliability through vibration, drop, temperature test. It consists of 5 developed board called the control board, the wire & wireless communication board, the power supply board, the load board and the mother board. It is connected by two wire harnesses between mother board and extern circular connectors. The control board send the data and address to other board though each 16-bit data and 20-bit address line. You can develop the function board what you want to using those data & address line when it comes to needing other function board.

Array 검출 모듈 신호처리 시스템의 테스트 소프트웨어 프로그램 개발 및 디지털 신호처리 보드 개발 (Development of Test Software Program and Digital Signal Processing Board for Array Module Signal Processing System)

  • 박지오;김영길;이진
    • 한국정보통신학회논문지
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    • 제22권3호
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    • pp.499-505
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    • 2018
  • 전 세계적으로 해운물류 안전 보안체계가 강화됨에 따라 국가물류보안 체계 구축을 위한 해운물류안전 보안 핵심기술 개발이 이루어지고 있다. 또한 미국에서 2018년 시행예정인 컨테이너 사전 100% 전수검사에 대응하기 위한 컨테이너 검색기의 핵심구성 요소인 Array 검출 시스템의 국산화 개발이 필요하다. 본 논문에서는 현재 자체 개발한 Test Digital 신호처리 Board를 가지고 TI-RTOS(Texas Instruments - Real Time Operating System)를 이용하여 개발한 Test Software Program을 제안한다. M4 MCU를 기반으로 GPIO, SRAM, TCP/IP와 SDcard등을 테스트 할 수 있는 프로그램을 개발했다. 또한 Array 검출 system 중 자체 개발한 Digital Signal Processing Board에 대한 연구를 제안하고자 한다. M4 MCU를 테스트 할 수 있는 테스트보드를 개발했고 FPGA와 MCU가 결합된 통한 X-RAY 디지털 신호처리 보드를 개발했다.

Implementation of PNP on the Control Board using Hardware/Software Co-design

  • Kim, Si-hwan;Lin, Chi-ho;Kim, Hi-seok
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2002년도 ITC-CSCC -1
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    • pp.305-308
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    • 2002
  • This paper proposes a control board that includes PNP function with extensibility and effective allocation of allocation. The object of study is to overcome limited extensity of old systems and it is to reuse the system. The system recognizes automatic subsystem from application of main system with board level that is using hardware and software co-design method. The system has both function of main-board and sub-board. So one system can operate simultaneously such as module of alien system. This system has advantages that are fast execution, according as process functional partition to hardware/ software co-design and board size is reduced as well as offer extensity of development system. We obtained good result with control board for existent Z-80 training kit.

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NEV용 스마트 Off-Board 충전시스템 설계 (Design of Smart Off-Board Charge System for Neighborhood Electric Vehicle)

  • 박성일;이정기
    • 한국전자통신학회논문지
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    • 제8권10호
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    • pp.1499-1504
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    • 2013
  • 급격한 원유가격 상승과 환경 친화적 차량에 대한 수요가 증가하면서 전기자동차에 대한 연구개발이 활발히 진행되고 있으며, 특히 근거리 전기자동차(NEV)는 양산 가능성이 매우 높은 무공해 차량으로 관련 기술에 대한 개발이 시급히 요구되는 시점이다. 본 논문에서 연구하고자 하는 중대형 2차전지 On-Board 충전기는 우주항공 및 일반 산업 분야에서도 충분히 응용가능한 요소 기술이고, Off-Board 스탠드형 충전기는 향후 활성화될 충전 인프라 구축 사업에 활용할 수 있을 것으로 예상된다.

DSP를 이용한 학습용 계전기 보드 개발 (Development of Learning Board for the Digital Relay Using DSP)

  • 안용진;최영우
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 하계학술대회 논문집 A
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    • pp.187-189
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    • 2002
  • A relaying board is developed for the study of digital relay, which is based on Digital Signal Processor(DSP). The present development is capable of understanding and application for digital relay hardware. To support the design of relaying hardware, first A/D convertor MMI and serial port for communication are embedded, and next a booting cables of three types are supplied. More particularly the relaying board that is convinient to test digital relaying algorithm. This paper concludes by implementing the distance relaying algorithm into a relaying board, the hardware test results show practically high performance.

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규격화된 분전반 제작을 위한 표준작업절차(SOP)의 공정 개발 (Process Development of a Standard Operating Procedure (SOP) for the Manufacturing of Standardized Distribution Boards)

  • 고완수;이병설;최충석
    • 한국안전학회지
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    • 제33권5호
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    • pp.21-27
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    • 2018
  • The purpose of this study is to develop a SOP (Standard Operating Procedure) for a distribution board that can monitor the leakage current of a load distribution line in real time. The developed distribution board was fabricated by applying IEC 61439-1. It consists of the distribution board and an alarm device. The work process for making the distribution board was compliant with the KEMC (Korea Electrical Manufacturers Cooperative) regulations. And the AC distribution board range is 1,000 V. In addition, the voltage in DC is less than 1500 V. The distribution board receives a 3-phases and 4-wires power supply system and can supply power to the load of a maximum of 32 single or three phase distribution circuits. Also, leakage current measured on the power distribution board was used by sensors installed. The SOP of the developed distribution board consists of the installation standards for the short circuit alarm device and sensor, the surge protection device, switches and indication lamps, and other devices. The operation procedure was prepared so that each manufacturing step of the distribution board must be confirmed by the persons in charge of preparation, production, quality control and approval before moving forward to the next step.

석고보드의 첨가제에 따른 오염물질 흡착 및 축열 성능에 대한 고찰 (Review on the heat storage performance and air pollutant adsorption properties of gypsum board according to the additives)

  • 서현정;정수광;임재한;김수민
    • 한국태양에너지학회 논문집
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    • 제35권1호
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    • pp.97-106
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    • 2015
  • Gypsum board is easy to manufacture of a variety of forms and has stable mechanical properties and thermal properties. And gypsum boards are widely used to the walls and ceiling of the building as the interior building materials. The studies about technology of applying the various features in the gypsum board with additives are being actively investigated. Development methods for enhancing performance of the gypsum board using additives are largely divided into two categories. The first case is functional gypsum board that is to improve the moisture absorption and moisture-proof properties. Also studies of adsorption and decomposition of indoor air pollutants of the gypsum board using porous materials as an additive are being actively investigated. Another case is applying thermal storage materials which gives the heat storage performance to gypsum board. In this paper, we would like to introduce the various cases of gypsum board applied various additives.