• 제목/요약/키워드: Design complexity

검색결과 1,997건 처리시간 0.025초

물 정수압 저널 베어링의 이론적 해석 (Theoretical Analysis of Water Hydrostatic Journal Bearings)

  • 박성환;박상신
    • Tribology and Lubricants
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    • 제27권2호
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    • pp.71-76
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    • 2011
  • In this study, the nondimensional load capacity of water hydrodynamic journal bearings is calculated. A generalized coordinate formulation is applied to handle the complexity of bearing geometry. A window-based analysis program is developed to analysis the cylindrical hydrostatic bearings. Load capacities are calculated according to some design parameters such as clearance, diameter of orifice, size of recesses and temperature. The results are presented and discussed.

GMA 용접공정에서 용접부의 표면 및 이면의 온도분포 (Temperature distribution of top and back surface in GMA welding process)

  • 김영선;조형석
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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    • pp.1408-1411
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    • 1996
  • In arc welding processes, because of the complexity and nonlinearity of heat transfer phenomena, it is often difficult to design an effective control system based upon an exact mathematic model. In this paper, we simulated the welding process for various welding conditions and positions to investigate the variations of temperature distribution for those cases. Those will be used as a preinformation for developing quality control system for arc welding process.

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Multi-Chip Packaging for Mobile Telephony

  • Bauer, Charles E.
    • 마이크로전자및패키징학회지
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    • 제8권2호
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    • pp.49-52
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    • 2001
  • This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

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Fast Voronoi Divider for VQ Code book Designs

  • Jang, Gang-Yi;Choi, Tae-Young
    • The Journal of the Acoustical Society of Korea
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    • 제15권1E호
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    • pp.34-38
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    • 1996
  • In this paper, a new fast voronoi divider for vector quantization (VQ) is introduced, which results from Theorem that the nearest vectors in the sense of minimum mean square error(MMSE) have almost the same mean values of their elements. An improved splitting method for a VQ codebook design using the fast voronoi divider is also presented. Experimental results show that the new method reduces the complexity of training a VQ codebook several times with a high signal to noise ratio(SNR) using an appropriate extensive parameter of codebook.

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전기철도의 DC급전시스템 시뮬레이터 (Simulator for DC Power Supply System in Electric Railway)

  • 정상기;홍재승
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2000년도 추계학술대회 논문집
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    • pp.720-726
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    • 2000
  • The advance of traction motor control technology and the complexity of the traction power supply system makes the simulation essential in determining the dimension of the traction power supply system. The conventional method, use of the simplified and/or empirical equations, becomes inadequate in optimization of the design. The simulator presented in this paper is a numerical time based simulator running on a PC. The input to the simulator includes the track data, the train characteristic, network data and operating data. Basically the simulator conducts train running simulation and loadflow study repeatedly. The principle algorithms and its output is discussed in the paper.

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효율적인 공간 복잡도의 LFSR 곱셈기 설계 (Design of an LFSR Multiplier with Low Area Complexity)

  • 정재형;이성운;김현성
    • 한국정보보호학회:학술대회논문집
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    • 한국정보보호학회 2003년도 하계학술대회논문집
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    • pp.33-36
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    • 2003
  • 본 논문에서는 GF(2$^{m}$ ) 상에서 효율적인 공간 복잡도를 가진 LFSR(Linear Feedback Shift Register) 구조 기반의 모듈러 곱셈기를 제안한다. 제안된 구조는 기약다항식으로 모든 계수가 1인 속성의 AOP(All One Polynomial)를 이용한다. 제안된 구조는 구조복잡도 면에서 기존의 구조들보다 훨씬 효율적이다. 제안된 곱셈기는 공개키 암호의 기본 구조로 사용될 수 있다.

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CAES를 위한 최적 사이징 소프트웨어 개발 (Development of Optimal Sizing Software for CAES)

  • 최경현;양경부;김동수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1236-1239
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    • 2008
  • Through the optimization design of the pneumatic components it leads the energy efficiency increasement and resources saving. Also it effects on the high speed operation, low speed operation, low weight, and complexity of pneumatic systems. In this paper the development of the software will be described based on Object-Oriented technology, which will provide function for development of pneumatic system without any deep knowledge about pneumatic system.

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제어규칙 분해법을 이용한 다변수 퍼지 논리 제어기 (Multivariable Fuzzy Logic Controller using Decomposition of Control Rules)

  • 이평기
    • 한국산업융합학회 논문집
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    • 제9권3호
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    • pp.173-178
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    • 2006
  • For the design of multivariable fuzzy control systems decomposition of control rules is a efficent inference method since it alleviates the complexity of the problem. In some systems, however, inference error of the Gupta's decomposition method is inevitable because of its approximate nature. In this paper we define indices of applicability which decides whether the decomposition method can be applied to a multivariable fuzzy system or not.

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H-이진트리체제의 타임스탬프 프로토콜 분석 (The Design & Analysis of Time-Stamp Protocol with H-Binary Tree)

  • 정경원;도경화;전문석
    • 한국전자거래학회지
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    • 제7권2호
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    • pp.157-171
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    • 2002
  • We want to find a timestamping method which improves efficient performance and have high-level security to send secured messages in the digital signature and the law of e-commerces. Our paper shows a H-binary tree of time stamp to use a time stamp protocol with high security and performance in the packets of sending messages. We implement and analyze the protocols, show to compare with previous RSA methods. Our proposed protocol has O(log n) time complexity and high-performance.

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MultiChip Packaging for Mobile Telephony

  • Bauer, Charles E.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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    • pp.1-7
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    • 2001
  • This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

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