• Title/Summary/Keyword: Design complexity

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Theoretical Analysis of Water Hydrostatic Journal Bearings (물 정수압 저널 베어링의 이론적 해석)

  • Park, Seong-Hwan;Park, Sang-Shin
    • Tribology and Lubricants
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    • v.27 no.2
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    • pp.71-76
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    • 2011
  • In this study, the nondimensional load capacity of water hydrodynamic journal bearings is calculated. A generalized coordinate formulation is applied to handle the complexity of bearing geometry. A window-based analysis program is developed to analysis the cylindrical hydrostatic bearings. Load capacities are calculated according to some design parameters such as clearance, diameter of orifice, size of recesses and temperature. The results are presented and discussed.

Temperature distribution of top and back surface in GMA welding process (GMA 용접공정에서 용접부의 표면 및 이면의 온도분포)

  • 김영선;조형석
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10b
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    • pp.1408-1411
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    • 1996
  • In arc welding processes, because of the complexity and nonlinearity of heat transfer phenomena, it is often difficult to design an effective control system based upon an exact mathematic model. In this paper, we simulated the welding process for various welding conditions and positions to investigate the variations of temperature distribution for those cases. Those will be used as a preinformation for developing quality control system for arc welding process.

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Multi-Chip Packaging for Mobile Telephony

  • Bauer, Charles E.
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.2
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    • pp.49-52
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    • 2001
  • This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

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Fast Voronoi Divider for VQ Code book Designs

  • Jang, Gang-Yi;Choi, Tae-Young
    • The Journal of the Acoustical Society of Korea
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    • v.15 no.1E
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    • pp.34-38
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    • 1996
  • In this paper, a new fast voronoi divider for vector quantization (VQ) is introduced, which results from Theorem that the nearest vectors in the sense of minimum mean square error(MMSE) have almost the same mean values of their elements. An improved splitting method for a VQ codebook design using the fast voronoi divider is also presented. Experimental results show that the new method reduces the complexity of training a VQ codebook several times with a high signal to noise ratio(SNR) using an appropriate extensive parameter of codebook.

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Simulator for DC Power Supply System in Electric Railway (전기철도의 DC급전시스템 시뮬레이터)

  • 정상기;홍재승
    • Proceedings of the KSR Conference
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    • 2000.11a
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    • pp.720-726
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    • 2000
  • The advance of traction motor control technology and the complexity of the traction power supply system makes the simulation essential in determining the dimension of the traction power supply system. The conventional method, use of the simplified and/or empirical equations, becomes inadequate in optimization of the design. The simulator presented in this paper is a numerical time based simulator running on a PC. The input to the simulator includes the track data, the train characteristic, network data and operating data. Basically the simulator conducts train running simulation and loadflow study repeatedly. The principle algorithms and its output is discussed in the paper.

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Design of an LFSR Multiplier with Low Area Complexity (효율적인 공간 복잡도의 LFSR 곱셈기 설계)

  • 정재형;이성운;김현성
    • Proceedings of the Korea Institutes of Information Security and Cryptology Conference
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    • 2003.07a
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    • pp.33-36
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    • 2003
  • 본 논문에서는 GF(2$^{m}$ ) 상에서 효율적인 공간 복잡도를 가진 LFSR(Linear Feedback Shift Register) 구조 기반의 모듈러 곱셈기를 제안한다. 제안된 구조는 기약다항식으로 모든 계수가 1인 속성의 AOP(All One Polynomial)를 이용한다. 제안된 구조는 구조복잡도 면에서 기존의 구조들보다 훨씬 효율적이다. 제안된 곱셈기는 공개키 암호의 기본 구조로 사용될 수 있다.

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Development of Optimal Sizing Software for CAES (CAES를 위한 최적 사이징 소프트웨어 개발)

  • Choi, Kyung-Hyun;Yang, Kyung-Bu;Kim, Dong-Soo
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1236-1239
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    • 2008
  • Through the optimization design of the pneumatic components it leads the energy efficiency increasement and resources saving. Also it effects on the high speed operation, low speed operation, low weight, and complexity of pneumatic systems. In this paper the development of the software will be described based on Object-Oriented technology, which will provide function for development of pneumatic system without any deep knowledge about pneumatic system.

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Multivariable Fuzzy Logic Controller using Decomposition of Control Rules (제어규칙 분해법을 이용한 다변수 퍼지 논리 제어기)

  • Lee, Pyeong-Gi
    • Journal of the Korean Society of Industry Convergence
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    • v.9 no.3
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    • pp.173-178
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    • 2006
  • For the design of multivariable fuzzy control systems decomposition of control rules is a efficent inference method since it alleviates the complexity of the problem. In some systems, however, inference error of the Gupta's decomposition method is inevitable because of its approximate nature. In this paper we define indices of applicability which decides whether the decomposition method can be applied to a multivariable fuzzy system or not.

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The Design & Analysis of Time-Stamp Protocol with H-Binary Tree (H-이진트리체제의 타임스탬프 프로토콜 분석)

  • 정경원;도경화;전문석
    • The Journal of Society for e-Business Studies
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    • v.7 no.2
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    • pp.157-171
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    • 2002
  • We want to find a timestamping method which improves efficient performance and have high-level security to send secured messages in the digital signature and the law of e-commerces. Our paper shows a H-binary tree of time stamp to use a time stamp protocol with high security and performance in the packets of sending messages. We implement and analyze the protocols, show to compare with previous RSA methods. Our proposed protocol has O(log n) time complexity and high-performance.

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MultiChip Packaging for Mobile Telephony

  • Bauer, Charles E.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.04a
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    • pp.1-7
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    • 2001
  • This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

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