• Proceedings of the KIEE Conference
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• 1993.11a
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• pp.148-150
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• 1993

The IGBT(Insulated Gate Bipolar Transistor) is a power semiconductor device that has gained acceptance among power electronic circuit design engineers for motor drive and Power converter applications. The device-circuit interaction of power insulated gate bipolar transistor for a series-inductor load, both with and without a snubber are, simulated. An analytical model for the transient operation of the IGBT is used in conjunction with the load circuit state equations for the simulations.

• Journal of Institute of Control, Robotics and Systems
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• v.3 no.3
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• pp.323-331
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• 1997

A new probing mechanism and an active compliance control algorithm have been developed for the in-circuit test of a PCB( printed circuit board ). Commercially available robotic probing devices are incapable of controlling contact force generated through rigid probe contacts with a solder joint, at high speed. The uncontrollable excessive contact force often brungs about some defects on the surface of the solder joint, which is plastically deformable over some limited contact force. This force also makes unstable contact motions resulting in unreliable test data. To overcome these problems, we propose that a serially connected macro and micro device with active compliance provide the best potential for a safe and reliable in-circuit test. This paper describes the design characteristics, modeling and control scheme of the newly proposed device. The experimental results clearly show the effectiveness of the proposed system.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.8
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• pp.477-486
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• 2000

This paper presents Pspice modeling methods for spark gaps and ZnO varistors and describes the application for the two-stage surge suppression circuit which was composed of the nonlinear components. The simulation modelings of nonlinear components were conducted on the basis of the voltage and current curves measured by the impulse current with the time-to-crest of $1~50 \mus$ and the impulse voltage with the rate of the time-to-crest of 10, 100 and 1000 V/\mus$. The firing voltages of the spark gap increased with increasing the rate of the time-to-crest of impulse voltage and the measured data were in good agreement with the simulated data. The I-V curves of the ZnO varistor were measured by applying the impulse currents of which time-to-crests range from 1 to $50 \mus$ and peak amplitudes from 10 A to 2 kA. The simulation modeling was based on the I-V curves replotted by taking away the inductive effects of the test circuit and leads. The meximum difference between the measured and calculated data was of the order of 3%. Also the two-stage surge suppression circuit made of the spark gap and the ZnO varistor was investigated with the impulse voltage of $10/1000\mus$$mutextrm{s}$ wave shape. The overall agreement between the theoretical and experimental results seems to be acceptable. As a consequence, it was known that the proposed simulation techniques could effectively be used to design the surge suppression circuits combined with nonlinear components.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.5
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• pp.185-189
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• 2005

This paper focuses on the design for Rx/Tx switch module of GSM(global standard mobile) band, characterization of a miniature, low power and dual-band implementation of the front-end switch module with low-pass filer And the effort to make agreement between the simulated design and the measured data for these solutions takes the place through accumulated design and manufacturing data library. We present the design, modeling and measurement of switch module integrating GSM Rx/Tx switching circuit and LPF(low pass filter) on a LTCC(low temperature co-fired ceramic) substrate. For GSM application, insertion and return loss of the low pass filter designed was less than 0.3 dB which was less than 12.7 dB at 900 MHz. The LTCC switch module contained 10 embedded passives and 3 surface mount components integrated on 4.6$\times$4.8$\times$1.2 mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module measured at 900 MHz was 11 dB. In both of the design approach yielded excellent agreement between measured and simulated results.

• Proceedings of the KSR Conference
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• 2008.06a
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• pp.1897-1902
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• 2008

The computer system is used in many application domains and any system error in these domains may either cause critical loss or threaten environment or human life. Though examples of these domains can be found in many areas, the system, which is used in domains for carrying passengers including rolling stocks in particular, is expected to show satisfactory operation all the time. The relay control logic, which is used in rolling stocks, is complex in hardware and occupies considerably large volume. Nevertheless, it has been used for a long time, to let the system safely operate even in the occurrence of an error in the computer system. However, the relay control logic circuit is so complex that the analysis of proper circuit operation and interlocking tends to be dependent only on the designer's experiences instead of being systematically performed. Especially, the analysis following a change, addition and deletion of a previous circuit according to the requirements from a source of demand is significantly limited. In this paper, the accuracy of relay control logic is verified by the use of properties of Petri Net model. In addition, how main circuit breaker (MCB) control circuit is modeled and analyzed by the design methodology is shown.

• Journal of information and communication convergence engineering
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• v.12 no.1
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• pp.46-52
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• 2014

This article presents key research needs in three-dimensional integrated circuit (3D IC) architectural floorplanning. Architectural floorplaning is done at a very early stage of 3D IC design process, where the goal is to quickly evaluate architectural designs described in register-transfer level (RTL) in terms of power, performance, and reliability. This evaluation is then fed back to architects for further improvement and/or modifications needed to meet the target constraints. We discuss the details of the following research needs in this article: block-level modeling, through-silicon-via (TSV) insertion and management, and chip/package co-evaluation. The goal of block-level modeling is to obtain physical, power, performance, and reliability information of architectural blocks. We then assemble the blocks into multiple tiers while connecting them using TSVs that are placed in between hard IPs and inside soft IPs. Once a full-stack 3D floorplanning is obtained, we evaluate it so that the feedback is provided back to architects.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.49 no.8
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• pp.545-550
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• 2000

This paper presents design and analysis of an HID lamp ballast for a fast turn on characteristics and stable operation. It produces a high open circuit voltage for the ignition and it is controlled to supply effectively the power required to shorten the warm-up period after the breakdown. The lamp modeling by empirical data is presented. It is very effective in the designing of the control loop in the steady-state operating region. A stable operation of the lamp power regulation in the steady state is achieved, which is crucial for the long life time and constant light output. Stability analysis of the system is performed and the results are verified through various simulation results and the hardware experiments.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.59-63
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• 2005

A simulation method combined with the simulation program with integrated circuit emphasis (SPICE) and the technology computer-aided design (TCAD) has been proposed to estimate the electrical characteristics of the metal-ferroelectric-semiconductor field effect transistor (MFS/MFISFET). The complex behavior of the ferroelectric property was analyzed and surface potential of the channel region in the MFS gate structure was calculated with the numerical TCAD method. Since the calculated surface potential is equivalent with the surface potential obtained with the SPICE model of the conventional MOSFET, we can obtain the current-voltage characteristics of MFS/MFISFET corresponding to the applied gate bias. Therefore, the proposed method will be very useful for the design of the integrated circuits with MFS/MFISFET memory cell devices.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.51 no.11
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• pp.635-644
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• 2002

Many generating units can be in parallel connection to one battery and inverter. However, one of the biggest problems we encountered is that wind speed is fluctuated sharply in accordance with the unstable weather conditions. To solve this problem, we need energy storage equipment such as storage lead-acid battery. We design a system and analyze its modeling so that it supplies a stable power to the load through DC-AC inverter part. In this paper, we applied dual step-up/down buck-boost converter and dual high-frequency half-bridge converter to the proposed system. These converters are used to store energy in the battery regardless of the change of the wind speed. The operation process of two proposed types of converters for high-power battery charging is discussed along with simulation and experimental result. We design a charging circuit which is applicable in the actual wind power generation system for 30kw and confirm the circuit's validity.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.6
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• pp.7-12
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• 2010

A semi-empirical organic schottky diode model is proposed for circuit simulation. We have set up a full custom design environment for organic schottky diode circuit using Spectre AHDL, which is widely used commercial EDA tool. We measured frequency response from fabricated rectifier, and it was compared to circuit simulation results using the AHDL model. The frequency response of the fabricated rectifier circuit is not sufficient for 13.56MHz RFID, however, it is enough for 135kHz-band RFID.