• Title/Summary/Keyword: Deposition factor

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Radiological Characterization of the High-sensitivity MOSFET Dosimeter (고감도 MOSFET 선량계 방사선학적 특성 연구)

  • Cho Sung Koo;Kim Chan-Hyeong
    • Progress in Medical Physics
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    • v.15 no.4
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    • pp.215-219
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    • 2004
  • Due to their excellence for the high-energy therapy range of photon beams, researchers show increasing interest in applying MOSFET dosimeters to low- and medium-energy applications. In this energy range, however, MOSFET dosimeter is complicated by the fact that the interaction probability of photons shows significant dependence on the atomic number, Z, due to photoelectric effect. The objective of this study is to develop a very detailed 3-dimensional Monte Carlo simulation model of a MOSFET dosimeter for radiological characterizations and calibrations. The sensitive volume of the High-Sensitivity MOSFET dosimeter is very thin (1 ${\mu}{\textrm}{m}$) and the standard MCNP tallies do not accurately determine absorbed dose to the sensitive volume. Therefore, we need to score the energy deposition directly from electrons. The developed model was then used to study various radiological characteristics of the MOSFET dosimeter. the energy dependence was quantified for the energy range 15 keV to 6 MeV; finding maximum dependence of 6.6 at about 40 keV. A commercial computer code, Sabrina, was used to read the particle track information from an MCNP simulation and count the tracks of simulated electrons. The MOSFET dosimeter estimated the calibration factor by 1.16 when the dosimeter was at 15 cm depth in tissue phantom for 662 keV incident photons. Our results showed that the MOSFET dosimeter estimated by 1.11 for 1.25 MeV photons for the same condition.

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A Study on the Photo-Conductive Characteristics of (p)ZnTe/(n)Si Solar Cell and (n)CdS-(p)ZnTe/(n)Si Poly-Junction Thin Film ((p)ZnTe/(n)Si 태양전지와 (n)CdS-(p)ZnTe/(n)Si 복접합 박막의 광도전 특성에 관한 연구)

  • Jhoun, Choon-Saing;Kim, Wan-Tae;Huh, Chang-Su
    • Solar Energy
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    • v.11 no.3
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    • pp.74-83
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    • 1991
  • In this study, the (p)ZnTe/(n)Si solar cell and (n)CdS-(p)ZnTe/(n)Si poly-junction thin film are fabricated by vaccum deposition method at the substrate temperature of $200{\pm}1^{\circ}C$ and then their electrical properties are investigated and compared each other. The test results from the (p)ZnTe/(n)Si solar cell the (n)CdS-(p)ZnTe/(n)Si poly-junction thin fiim under the irradiation of solar energy $100[mW/cm^2]$ are as follows; Short circuit current$[mA/cm^2]$ (p)ZnTe/(n)Si:28 (n)CdS-(p)ZnTe/(n)Si:6.5 Open circuit voltage[mV] (p)ZnTe/(n)Si:450 (n)CdS-(p)ZnTe/(n)Si:250 Fill factor (p)ZnTe/(n)Si:0.65 (n)CdS-(p)ZnTe/(n)Si:0.27 Efficiency[%] (p)ZnTe/(n)Si:8.19 (n)CdS-(p)ZnTe/(n)Si:2.3 The thin film characteristics can be improved by annealing. But the (p)ZnTe/(n)Si solar cell are deteriorated at temperatures above $470^{\circ}C$ for annealing time longer than 15[min] and the (n)CdS-(p)ZnTe/(n)Si thin film are deteriorated at temperature about $580^{\circ}C$ for longer than 15[min]. It is found that the sheet resistance decreases with the increase of annealing temperature.

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A study on the oxide semiconductor $[(I_{n2}O_3)_x{\cdot}(S_nO_2)_{1-x}]_{(n)}/Silicon(p)$, solar cells fabricated by two source evaporation (이가열원(二加熱源) 증착법(蒸着法)에 이한 산화물(酸化物) 반도체(半導體) $[(I_{n2}O_3)_x{\cdot}(S_nO_2)_{1-x}]_{(n)}/Silicon(p)$, 태양전지(太陽電池)에 관한 연구(硏究))

  • Jhoon, Choon-Saing;Kim, Yong-Woon;Lim, Eung-Choon
    • Solar Energy
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    • v.12 no.2
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    • pp.62-78
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    • 1992
  • The solar cells of $ITO_{(n)}/Si_{(p)}$, which are ITO thin films deposited and heated on Si wafer 190[$^{\circ}C$], were fabricated by two source vaccum deposition method, and their electrical properties were investigated. Its maximum output is obtained when the com- position of the thin film consist of indium oxide 91[mole %] and thin oxide 9[mole %]. The cell characteristics can be improved by annealing but are deteriorated at temperature above 600[$^{\circ}C$] for longer than 15[min]. Also, we investigated the spectral response with short circuit current of the cells and found that the increasing of the annealing caused the peak shifted to the long wavelength region. And by experiment of the X-ray diffraction, it is shown to grow the grains of the thin film with increasment of annealing temperature. The test results from the $ITO_{(n)}/Si_{(p)}$ solar cell are as follows. short circuit current : Isc= 31 $[mW/cm^2]$ open circuit voltage : Voc= 460[mV] fill factor : FF=0.71 conversion efficiency : ${\eta}$=11[%]. under the solar energy illumination of $100[mW/cm^2]$.

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Percutaneous Absorption of Antisense Phosphorothioate Oligonucleotide in vitro

  • Lee, Young-Mi;Song, Kyung;Lee, Sung-Hee;Ko, Geon-Il;Kim, Jae-Baek;Sohn, Dong-Hwan
    • Archives of Pharmacal Research
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    • v.19 no.2
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    • pp.116-121
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    • 1996
  • Antisense oligonucleotides seem to provide a promising new tool for the therapy. Choi et al. (1995) reported antisense phosphorothioate oligonucleotides (PS-ODN, 25 mer) complementary to TGF-.betha. mRNA designed for scar formation inhibitor to eliminate scars, which was caused by undesired collagen deposition due to overexpression of TGF-.betha., in wounded skin. PS-ODN were evaluated in vitro for skin penetration using normal and tape-stripped damaged rat skin. The in vitro skin transports were carried out with partially modified PS-ODN (6S) and fully modified PS-ODN (25S). The cumulative amount of PS-ODN (6S) penetrated through normal rat skin was $0.234{\pm}0.041{\mu}g/cm^2$ and that of tape-stripped damaged rat skin was $1.077{\pm}0.301{\mu}g/cm^2$ over 8 hrs. PS-ODN (25S) can not be found in receptor medium through normal skin due to high molecular weight (Mol.Wt.=8,000) and polyanionic charge. However, the cumulative amount of PS-ODN (25S) penetrated across damaged rat skin in PBS was $0.340{\pm}0.296{\mu}g/cm^2$ over 8 hrs. The absense of dermis raised the cumulative amount of PS-ODN (6S) penetrated through rat skin. And the fluxes of PS-ODN (6S) and PSODN (25S) at 8hrs across damaged rat skin were $134.63{\pm}37.67{\mu}g/cm^2$ h, and $42.50{\pm}36.95ng/cm^2$ h, respectively. While PS-ODN (25S) was stable in 10% heat inactivated fetal bovine serum (FBS) during 24 hrs, PS-ODN (6S) was less stable than PS-ODN (25S), but was markedly stable than unmodified phosphodiester. It is suggested that the cumulative amount of PS-ODN (6S) penetrated through damaged rat skin is larger than that of PS-ODN (25S) since the former is easier to degrade by nuclease than the latter and then is apt to penetrate into skin. Thus, PS-ODN represents a logical candidate for further evaluation due to the potential for delivery into the wounded skin.

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Effects of Chrysanthemum indicum L. Extract on the Function of Osteoblastic MC3T3-E1 Cells under Oxidative Stress Induced by Hydrogen PeroxideJee (감국(Chrysanthemum indicum L.) 추출물이 H2O2로 유도한 산화적 스트레스에서 MC3T3-E1 조골세포 기능에 미치는 영향)

  • Yun, Jee-Hye;Hwang, Eun-Sun;Kim, Gun-Hee
    • Korean Journal of Food Science and Technology
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    • v.44 no.1
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    • pp.82-88
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    • 2012
  • Chrysanthemum indicum L. (Asteraceae) is a traditional herbal medicine that has been used for the treatment of inflammation, hypertension, and respiratory diseases due to its strong antagonistic activity against inflammatory cytokines. The effects of Chrysanthemum indicum L. Extract (CIE) for increasing cell growth, alkaline phosphatase (ALP) activity, and collagen content were totally inhibited, suggesting that the effect of CIE might be partly involved with estrogen activity. Furthermore, the protective effects of CIE on the response of osteoblasts to oxidative stress were evaluated. Osteoblastic MC3T3-E1 cells were incubated with hydrogen peroxide and/or CIE, and markers of osteoblast function and oxidative damage were examined. CIE significantly increased cell survival, ALP activity, and calcium deposition, and decreased the production of Reactive Oxygen Species (ROS) and Tumor Necrosis Factor-${\alpha}$ (TNF-${\alpha}$) in osteoblasts. Taken together, these results indicate that the enhancement of osteoblast function by CIE may prevent osteoporosis and inflammatory bone diseases.

Analysis of Siting Criteria of Overseas Geological Repository (II): Hydrogeology (국외 심지층 처분장 부지선정기준 분석 (II) : 수리지질)

  • Jung, Haeryong;Kim, Hyun-Joo;Cheong, Jae-Yeol;Lee, Eun Yong;Yoon, Jeong Hyoun
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.11 no.3
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    • pp.253-257
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    • 2013
  • Geology, hydrogeology, and geochemistry are the main technical siting factors of a geological repository for spent nuclear fuels. This paper evaluated the siting criteria of overseas geological repository with related to hydrogeologic properties, such as hydraulic conductivity, partitioning coefficient, dispersion coefficient, boundary condition, and water age. Each country establishes the siting criteria based on its important geological backgrounds and information, and social environment. For example, Sweden and Finland that have decided a crystalline rock as a host rock of a geological repository show different siting criteria for hydraulic conductivity. In Sweden, it is preferable to avoid area where the hydraulic conductivity on a deposition hole scale (~30m) exceeds $10^{-8}m/s$, whereas Finland does not decide any criterion for the hydraulic conductivity because of limited data for it. In addition, partitioning coefficients should be less than 10-1 of average value in Swedish crystalline bedrock. However, the area where shows 100 times less than average partitioning coefficients of radionuclides in crystalline rock should be avoided in Sweden. In German, the partitioning coefficients for the majority of the long-term-relevant radionuclides should be greater than or equal to $0.001m^3/kg$. Therefore, it is strongly required to collect much and exact information for the hydrogeologic properties in order to set up the siting criteria.

Large-Area Synthesis of High-Quality Graphene Films with Controllable Thickness by Rapid Thermal Annealing

  • Chu, Jae Hwan;Kwak, Jinsung;Kwon, Tae-Yang;Park, Soon-Dong;Go, Heungseok;Kim, Sung Youb;Park, Kibog;Kang, Seoktae;Kwon, Soon-Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.130.2-130.2
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    • 2013
  • Today, chemical vapor deposition (CVD) of hydrocarbon gases has been demonstrated as an attractive method to synthesize large-area graphene layers. However, special care should be taken to precisely control the resulting graphene layers in CVD due to its sensitivity to various process parameters. Therefore, a facile synthesis to grow graphene layers with high controllability will have great advantages for scalable practical applications. In order to simplify and create efficiency in graphene synthesis, the graphene growth by thermal annealing process has been discussed by several groups. However, the study on growth mechanism and the detailed structural and optoelectronic properties in the resulting graphene films have not been reported yet, which will be of particular interest to explore for the practical application of graphene. In this study, we report the growth of few-layer, large-area graphene films using rapid thermal annealing (RTA) without the use of intentional carbon-containing precursor. The instability of nickel films in air facilitates the spontaneous formation of ultrathin (<2~3 nm) carbon- and oxygen-containing compounds on a nickel surface and high-temperature annealing of the nickel samples results in the formation of few-layer graphene films with high crystallinity. From annealing temperature and ambient studies during RTA, it was found that the evaporation of oxygen atoms from the surface is the dominant factor affecting the formation of graphene films. The thickness of the graphene layers is strongly dependent on the RTA temperature and time and the resulting films have a limited thickness less than 2 nm even for an extended RTA time. The transferred films have a low sheet resistance of ~380 ${\Omega}/sq$, with ~93% optical transparency. This simple and potentially inexpensive method of synthesizing novel 2-dimensional carbon films offers a wide choice of graphene films for various potential applications.

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A Study on the Removal of Cu Impurity on Si Substrate and Mechanism Using Remote Hydrogen Plasma (리모트 수소 플라즈마를 이용한 Si 기판 위의 Cu 불순물 제거)

  • Lee, Jong-Mu;Jeon, Hyeong-Tak;Park, Myeong-Gu;An, Tae-Hang
    • Korean Journal of Materials Research
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    • v.6 no.8
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    • pp.817-824
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    • 1996
  • Removal of Cu impurities on Si substrates using remote H-plasma was investigated. Si substrates were intentionally contaminated by 1ppm ${CuCI}_{2}$, standard chemical solution. To determine the optimal process condition, remote H-plasma cleaning was conducted varying the parameters of rf power, cleaning time and remoteness(the distance between the center of plasma and the surface of Si substrate). After remote H-plasma cleaning was conducted, Si surfaces were analysed by TXRF(total x-ray reflection fluorescence) and AFM(atomic force microscope). The concentration of Cu impurity was reduced by more than a factor of 10 and its RMS roughness was improved by more than 30% after remote H-plasma cleaning. TXRF analysis results show that remote H-plasma cleaning is effective in eliminating Cu impurity on Si surface when it is performed under the optimal process condition. AFM analysis results also verifies that remote H-plasma cleaning makes no damage to the Si surface. The deposition mechanism of Cu impurity may be explained by the redox potential(oxidation-reduction reaction potential) theory. Based on the XPS analysis results we could draw a conclusion that Cu impurities on the Si substrate are removed together with the oxide by a "lift-off" mechanism when the chemical oxide( which forms when Cu ions are adsorbed on the Si surface) is etched off by reactive hydrogen atoms.gen atoms.

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Fabrication of FBAR (SMR) using Reflector (반사층을 이용한 FBAR(SMR)의 제조)

  • Lee, Jae-Bin;Kwak, Sang-Hyon;Kim, Hyeong-Joon;Park, Hee-Dae;Kim, Young-Sik
    • Korean Journal of Materials Research
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    • v.9 no.12
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    • pp.1263-1269
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    • 1999
  • An FBAR(Solidly Mounted Resonator) was fabricated using reflector layers which prohibit the penetration of bulk acoustic wave into substrate. The SMR consisted of top and bottom electrodes(Al films), a piezoelectric layer (ZnO film), reflector layers(W/$Si_2$ films) and Si substrate. The electrodes were deposited by dc sputtering. The piezoelectric layer and the reflector layers were deposited by rf magnetron sputtering. The control of crystallinity, microstructures and electric properties of each layer was essential for attaining the optimum FBAR characteristics. Under the best deposition conditions for FBAR devices, the ZnO films had highly c-axis preferred orientation(${\sigma}=2.17^{\circ}$), resistivity of $10^4\;{\omega}cm$, and surface roughness of 10.6 ${\AA}$. On the other hand, the surface roughness of W and $Si_2$ films was 16 ${\AA}$ and 33 ${\AA}$, respectively, and the resistivity of Al film was $5.1{\times}10^{-6}\;{\Omega}cm$. The SMR devices were fabricated by the conventional semiconductor processes. In the resonance conditions of the SMR, the series resonance frequency (fs) and the parallel resonance frequency(fp) were 1.244 GHz and 1.251 GHz, respectively and the quality factor(Q) was 1200.

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Characteristics of Nickel_Titanium Dual-Metal Schottky Contacts Formed by Over-Etching of Field Oxide on Ni/4H-SiC Field Plate Schottky Diode and Improvement of Process (Ni/4H-SiC Field Plate Schottky 다이오드 제작 시 과도 식각에 의해 형성된 Nickel_Titanium 이중 금속 Schottky 접합 특성과 공정 개선 연구)

  • Oh, Myeong-Sook;Lee, Jong-Ho;Kim, Dae-Hwan;Moon, Jeong-Hyun;Yim, Jeong-Hyuk;Lee, Do-Hyun;Kim, Hyeong-Joon
    • Korean Journal of Materials Research
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    • v.19 no.1
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    • pp.28-32
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    • 2009
  • Silicon carbide (SiC) is a promising material for power device applications due to its wide band gap (3.26 eV for 4H-SiC), high critical electric field and excellent thermal conductivity. The Schottky barrier diode is the representative high-power device that is currently available commercially. A field plate edge-terminated 4H-SiC was fabricated using a lift-off process for opening the Schottky contacts. In this case, Ni/Ti dual-metal contacts were unintentionally formed at the edge of the Schottky contacts and resulted in the degradation of the electrical properties of the diodes. The breakdown voltage and Schottky barrier height (SBH, ${\Phi}_B$) was 107 V and 0.67 eV, respectively. To form homogeneous single-metal Ni/4H-SiC Schottky contacts, a deposition and etching method was employed, and the electrical properties of the diodes were improved. The modified SBDs showed enhanced electrical properties, as witnessed by a breakdown voltage of 635 V, a Schottky barrier height of ${\Phi}_B$=1.48 eV, an ideality factor of n=1.04 (close to one), a forward voltage drop of $V_F$=1.6 V, a specific on resistance of $R_{on}=2.1m{\Omega}-cm^2$ and a power loss of $P_L=79.6Wcm^{-2}$.