• 한국도로학회:학술대회논문집
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• 한국도로학회 2005년도 춘계학술대회 논문집
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• pp.11-19
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• 2005

• 한국도로학회:학술대회논문집
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• 한국도로학회 2006년도 춘계학술대회 논문집
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• pp.105-112
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.749-750
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• 2009

• 한국섬유공학회:학술대회논문집
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• 한국섬유공학회 1998년도 가을 학술발표회논문집
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• pp.248-251
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• 1998

최근 전자, 의료, 인공지능, 합금, 고분자 등의 여러 분야에 걸쳐 smart 재료에 관한 연구가 흥미롭게 진행되고 있는데, smart 재료의 특성은 Sensor-processor-actuator의 기능을 한 재료 시스템 내에 갖고 있는 경우를 뜻하기 때문에 자기진단, 자기수복기능 및 자기조정기능을 가질 수 있다[1]. (중략)

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 1997년도 봄 학술발표회 논문집
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• pp.81-88
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• 1997

• 한국염색가공학회:학술대회논문집
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• 한국염색가공학회 2010년도 제3회 국제학회
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• pp.38-39
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• 2010

• 한국도로학회:학술대회논문집
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• 한국도로학회 2008년도 추계학술대회 논문집
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• pp.75-82
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• 2008

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• Structural Engineering and Mechanics
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• 제83권6호
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• pp.745-756
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• 2022

This study aims to determine the cause of the load resistance loss in storage racks that can be attributed to external forces such as earthquakes and to improve safety by developing reinforcement systems that can prevent load resistance loss. To this end, a static cyclic loading test was performed on pallet racks commonly used in logistics warehouses. The test results indicated that a pallet rack exposed to an external force loses more than 50% of its load resistance owing to the damage caused to column-beam joints. Three reinforcement systems were developed for preventing load resistance loss in storage racks exposed to an external force and for performing differentiated target functions: column reinforcement device, seismic damper, and viscoelastic damper. Shake table testing was performed to evaluate the earthquake response and verify the performance of these reinforcement systems. The results confirmed that, the maximum displacement, which causes the loss of load resistance and the permanent deformation of racks under external force, is reduced using the developed reinforcement devices. Thus, the appropriate selection of the developed reinforcement devices by users can help secure the safety of the storage racks.

• Corrosion Science and Technology
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• 제23권4호
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• pp.266-277
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• 2024

Due to its good corrosion and heat resistance with excellent mechanical properties, 304L stainless steel is commonly used in the fabrication of spent nuclear fuel dry storage canisters. However, welds are sensitive to stress corrosion cracking (SCC) due to residual stress generation. Although SCC resistance can be improved by stress relieving the weld and changing the chloride environment, it is difficult to change corrosion environment for certain applications. Stress control in the weld can improve SCC resistance. Ultrasonic shot peening (USP) needs further research as compressive residual stresses and microstructure changes due to plastic deformation may play a role in improving SCC resistance. In this study, 304L stainless steel was welded to generate residual stresses and exposed to a chloride environment after USP treatment to improve SCC properties. Effects of USP on SCC resistance and crack growth of specimens with compressive residual stresses generated more than 1 mm from the surface were studied. In addition, correlations of compressive residual stress, grain size, intergranular corrosion properties, and pitting potential with crack propagation rate were determined and the improvement of SCC properties by USP was analyzed.