• 제목/요약/키워드: Deep Hole

검색결과 188건 처리시간 0.022초

RHP에서의 $Zn_3P_2$ 박막 및 RTA법에 의한 Zn 확산의 특성 (Characterization of Zn diffusion in TnP Cy $Zn_3P_2$ thin film and rapid thermal annealing)

  • 우용득
    • 한국진공학회지
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    • 제13권3호
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    • pp.109-113
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    • 2004
  • InP에서 열처리 온도와 시간 및 활성화 온도에 따른 Zn의 확산의 특성을 electrochemical capacitance-voltage 법으로 조사하였다. InP층은 metal organic chemical vapor deposition를 이용하여 성장하였으며, 화산방법으로는 $Zn_3P_2$ 확산과 박막과 rapid thermal annealing를 사용하였다. 최대의 정공 농도를 갖는 p-lnP 층은 $550^{\circ}C$에서 5분 동안 확산과 활성화를 한 시료에서 얻었고, Zn의 농도는 $1\times10^{19}\textrm{cm}^{-3}$이었다. $550^{\circ}C$에서 5-20 분 동안 확산을 수행한 결과 정공농도의 확산 깊이는 1.51 $\mu\textrm{m}$에서 3.23 $\mu\textrm{m}$로 이동하였고, Zn의 확산계수는 $5.4\times10^{-11}\textrm{cm}^2$/sec이었다. 활성화 시간의 증가로, Zn가 더 깊게 확산하지만, 정공농도는 거의 변화가 없었다. 이는 도핑된 영역의 과잉의 침입형 Zn가 도핑되지 않은 영역으로 빠르게 확산하고 치환형 Zn로 변한다는 것을 의미한다. 정공농도는 $SiO_2$ 박막의 두께가 1,000$\AA$ 이상이어야 안정적으로 분포된다.

새로운 정공차폐 층 (Hole blocking layer)으로 DCJTB 도핑된 24MeSAlq를 이용한 백색유기발광다이오드 (White Organic Light-Emitting Diodes Using DCJTB-Doped 24MeSAlq as a New Hole-Blocking Layer)

  • 김미숙;임종태;염근영
    • 한국재료학회지
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    • 제16권4호
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    • pp.231-234
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    • 2006
  • To obtain balanced white-emission and high efficiency of the organic light-emitting diodes (OLEDs), a deep blue emitter made of N,N'-diphenyl-N,N'-bis(1-naphthyl)- (1,1'-biphenyl)-4,4'-diamine (NPB) emitter and a new red emitter made of the Bis(2,4 -dimethyl-8-quinolinolato)(triphenylsilanolato)aluminum(III) (24MeSAlq) doped with red fluorescent 4-(dicyanomethylene)-2-tert-butyl-6-(1,1,7,7-tetramethyljulolidyl-9-enyl)-4H -pyran (DCJTB) were used and the device was tuned by varying the thickness of the DCJTB-doped 24MeSAlq and $Alq_3$. For the white OLED with 10 nm thickness DCJTB (0.5%) doped 24MeSAlq and 45 nm thick $Alq_3$, the maximum luminance of about 29,700 $Cd/m^2$ could be obtained at 14.8 V. Also, Commission Internationale d'Eclairage (CIE) chromaticity coordinates of (0.32, 0.28) at about 100 $Cd/m^2$, which is very close to white light equi-energy point (0.33, 0.33), could be obtained.

A Reproducible High Etch Rate ICP Process for Etching of Via-Hole Grounds in 200μm Thick GaAs MMICs

  • Rawal, D.S.;Agarwal, Vanita R.;Sharma, H.S.;Sehgal, B.K.;Muralidharan, R.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제8권3호
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    • pp.244-250
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    • 2008
  • An inductively coupled plasma etching process to replace an existing slower rate reactive ion etching process for $60{\mu}m$ diameter via-holes using Cl2/BCl3 gases has been investigated. Process pressure and platen power were varied at a constant ICP coil power to reproduce the RIE etched $200{\mu}m$ deep via profile, at high etch rate. Desired etch profile was obtained at 40 m Torr pressure, 950 W coil power, 90W platen power with an etch rate ${\sim}4{\mu}m$/min and via etch yield >90% over a 3-inch wafer, using $24{\mu}m$ thick photoresist mask. The etch uniformity and reproducibility obtained for the process were better than 4%. The metallized via-hole dc resistance measured was ${\sim}0.5{\Omega}$ and via inductance value measured was $\sim$83 pH.

Mg Delta-Doping Effect on a Deep Hole Center Related to Electrical Activation of a p-Type GaN Thin Film

  • Park, Hyo-Yeol;Jeon, Kyoung-Nam;Kim, Keun-Joo
    • Transactions on Electrical and Electronic Materials
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    • 제11권1호
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    • pp.37-41
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    • 2010
  • The authors investigated the photoluminescence (PL) and the electron paramagnetic resonance (EPR) from an magnesium (Mg)-doped GaN thin film with a delta-doped layer. The regularly doped sample shows a PL peak at 2.776 eV for the as-grown sample, and the peak shifts to 2.904 eV and increases in intensity for the annealed sample. The delta-doped sample also shows the same PL peak as does the regularly doped sample. However, only the annealed delta-doped layer shows a sharp EPR with a small isotropic Lande g-factor, $g_{II}$, of 2.029. This resonance is attributed to the delta-doped layer, which forms a hole-bound Mg-N atomic structure instead of the $Mg_{Ga}-V_N$ defect complex, indicating that the delta-doped sample was not optically activated to form PL centers but was instead electrically activated to form a hole-bound state.

BTA드릴의 절삭 기구와 마모 특성에 관한 연구 (A Study on Cutting Mechanism and Wear Character for BTA Drill)

  • 장성규;전언찬
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.105-108
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    • 1995
  • So far,in deep drilling process there are several manufacturing problems such as hole deviation, hole over size, circularity,straightness and surface roughness. Whit regard to these problems, we atudied the abrasion process on carbided tip of BTA drill and got the follow test results through the abrasion characteristic test and analysis on cutting mechanism for the drill tooth and guide pad. 1) In SM55C drilling process, the most stable and reasonable drilling speed range for optmum abrasion characteristic of drill tooth was 60m.min. 2) The total drilling torque was about 60kg .deg.cm on condition drilling speed 60m/min and 0.15mm/rev. These results show that the theoretical burnising torque is well accord with the tested torque which is working on guide pad.

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Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging

  • Delmdahl, Ralph;Paetzel, Rainer
    • 마이크로전자및패키징학회지
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    • 제21권2호
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    • pp.53-57
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    • 2014
  • Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

펨토초 레이저에 의한 SUS 가공 특성 및 리플 생성 (Ripple Formation and Polarization Effects in Femtosecond Laser Drilling)

  • 손익부;고명진;김영섭;노영철
    • 한국레이저가공학회지
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    • 제12권1호
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    • pp.14-18
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    • 2009
  • Ripple formation of femtosecond laser in stainless steel is investigated using 184 fs pulses with a center wavelength of 785 nm. The effect of the laser polarization relative to the translation direction is observed. For drilling with a certain aspect ratio, reflections at the hole walls take place, leading to a non-uniform intensity distribution deep inside the formed hole. Finally, it is shown that a circular polarization during the drilling process significantly improves the quality of the produced holes.

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드릴가공에서 강재의 피삭성에 관한 연구 (A Study On the Machinability of Steels by Drilling)

  • 김남훈
    • 한국생산제조학회지
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    • 제5권4호
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    • pp.98-107
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    • 1996
  • In order to predict analytically torque, thrust force, tool life and chip formation in drilling, cutting models for chisel edge with various tool-chip contact length were developed in this type. Also, the experimental tests are run with various pilot holes. The following conclusions were obtained from the analysis. \circled1 It's also found experimentally that thrust force(Fz) decreases as pilot hole diameter increases. \circled2 Surface roughness for material(G) is larger that for material(J). The difference over two materials in roughness value about 0.5$mu extrm{m}$. \circled3 Flank wear of the drill in cutting material of G less than any other kinds of materials(F, G, H, I, J). \circled4 In drilling a deep hole on a workpiece over SM45C either twist drill. The chip was conical helix type at the fist suspensely change the two segment type and than two a long pitch helix style.

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난삭재의 심공가공에 관한 연구 (SKD11고합금공구강에 대한 STS타입 BTA드릴 가공) (A Study on the Deep Hole Drilling for Refractory Metals - STS type BTA drilling for SKD11 high alloy tool steel)

  • 심성보;김치옥;김철규
    • 한국해양공학회지
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    • 제13권1호통권31호
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    • pp.70-78
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    • 1999
  • 오늘날 기계공업 현장에서 심공드릴가공은 광범위한 응용과 양호한 생산성으로 인하여 그 요구가 증가 되고 있다. 그러므로, 본 연구는 난삭재인 SKD11고합금공구강을 여러가지 절삭조건하에서 BTA드릴가공하여 얻은 실험결과(표면조도, 진직도, 진원도, 원통도, 구멍확대량, 등)를 다루었으며 이들의 이론적 배경과 실험을 비교 분석하였다. 프레스금형 부품과 기계부품으로 사용되고 있는 SKD11고합금공구강은 기계가공이 힘든 난삭재료로서 그 어려움이 크므로 본 연구는 생산현장에 보다 나은 심공드릴가공결과와 관련 지식을 제공 할수 있다고 사료된다.

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Calibrating high-z QSO masses using near-IR and optical spectra

  • 김치푸옹;우종학
    • 천문학회보
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    • 제36권1호
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    • pp.48.2-48.2
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    • 2011
  • Using the newly commissioned Fiber-Multi-Object-Spectrograph at the Subaru telescope, we obtained near-IR spectra of a sample of 19 AGNs at 0.6 < z < 2.6, selected from the NOAO Deep Wide-Field Survey (NDWFS) Bootes field, in order to calibrate high-z black hole mass (MBH) estimators. MBHs are generally determined through the kinematics of ionized gas clouds around the black hole assuming virial equilibrium. The velocity profiles of $H{\beta}/H{\alpha}$, MgII and CIV are used to infer the gas kinematics of low-z, mid-z, and high-z quasars, respectively. However, the MBH based on MgII and CIV is not very well calibrated. We compare the $H{\alpha}$ - based MBH estimates from the new FMOS near-IR spectra, with the MgII-based MBH estimates from our existing optical spectra, and investigate the systematic differences.

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