• Transactions of Materials Processing
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• v.13 no.3
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• pp.285-289
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• 2004

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.49-53
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• 2005

The objective of this research was to establish the size limitation of micro metal forming and analyze the formability of foil. Flat-rolled ultra thin metallic copper foil($3{\mu}m$ in thickness) was used as a forming material and foil was annealed to improve the formability at the temperature of $385^{\circ}C$. Forming die was fabricated by using etching technique of DRIE(deep reactive ion etching) and HNA isotropic etching. For the forming die and coupe. foil were vacuum packed and the forming was conducted as applying hydrostatic pressure of 250MPa to the vacuum packed unit. We successfully obtained the micro channels of $12\~14{\mu}m$ width and $9{\mu}m$ depth from micro forming process we designed. We also investigated the thickness strain distribution of foil from experiment and FE simulation result. Micro channels had a good formability of smooth surface and size accuracy. We expect that micro metal forming technology will be applied to production of micro parts.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.244.2-244.2
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• 2013

Contact Pattern을 Plasma Etching을 통해 Pattering 공정을 진행함에 있어서 Plasma 내에 존재하는 High Energy Ion 들의 Bombardment 에 의해, Contact Bottom 의 Silicon Lattice Atom 들은 Physical 한 Damage를 받아 Electron 의 흐름을 방해하게 되어, Resistance를 증가시키게 된다. 또한 Etchant 로 사용되는 Fluorine 과 Chlorine Atom 들은, Contact Bottom 에 Contamination 으로 작용하게 되어, 후속 Contact 공정을 진행하면서 증착되는 Ti 나 Co Layer 와 Si 이 반응하는 것을 방해하여 Ohmic Contact을 형성하기 위한 Silicide Layer를 형성하지 못하도록 만든다. High Aspect Ratio Contact (HARC) Etching 을 진행하면서 Contact Profile을 Vertical 하게 형성하기 위하여 Bias Power를 증가하여 사용하게 되는데, 이로부터 Contact Bottom에서 발생하는 Etchant 로 인한 Damage 는 더욱 더 증가하게 된다. 이 Damage Layer를 추가적인 Secondary Damage 없이 제거하기 위하여 본 연구에서는 원자층 식각방법(Atomic Layer Etching Technique)을 사용하였다. 실험에 사용된 원자층 식각방법을 이용하여, Damage 가 발생한 Si Layer를 Secondary Damage 없이 효과적으로 Control 하여 제거할 수 있음을 확인하였으며, 30 nm Deep Contact Bottom 에서 Damage 가 제거될 수 있음을 확인하였다. XPS 와 Depth SIMS Data를 이용하여 상기 실험 결과를 확인하였으며, SEM Profile 분석을 통하여, Damage 제거 결과 및 Profile 변화 여부를 확인하였으며, 4 Point Prove 결과를 통하여 결과적으로 Resistance 가 개선되는 결과를 얻을 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.316-316
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• 2012

본 연구에서는 Si wafer에 마스크 공정 및 Slit-etching 공정을 적용하여 25 um 피치의 probe unit을 개발하기 위해 Deep Si Etching 장비를 이용하여 식각공정 조건에 따른 특성을 평가하였다. 25 um pitch는 etch 폭의 크기에 따라 3종류로 설계하였으며, 식각공정은 2수준, 4인자 실험계획법에 의해 8회 실험을 수행하였다. 실험계획법에 의해 미니탭을 활용하여 최적조건을 구한 결과 12.5 um etch 폭에서는 가스유량은 200 sccm, 에칭시간 7 sec, 코일 파워 1500W, 에칭 압력은 43.7 mtorr의 조건이 etch 형태 및 profile angle이 목표치에 근접한 결과를 얻었다. 또한 probe pitch를 30~60 um까지 증가시켰을 경우 Etch depth는 증가하였으며, 식각율 또한 증가한 현상을 보였다. 재현성 실험을 위해 위의 최적조건을 이용하여 2회 반복하여 실험한 경우 모든 시편이 목표치에 도달하였다. 이는 미세피치화 되는 프로브 유닛의 기초데이터로 활용될 수 있다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05e
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• pp.77-80
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• 2003

MEMS(Micro Electro Mechanical System) 기술에서 실리콘 식각기술의 중요성으로 플라즈마 식각기술의 개발이 꾸준히 진행되고 있다. 이중에서 ICP(Inductive Coupled Plasma)는 기존의 증착장치에 유도결합식 플라즈마를 추가로 발생시켜 증착막의 특성을 획기적으로 개선시키는 가장 최근에 개발된 기술이며, 이용에너지를 증가시키지 않고도 이용밀도를 높이고 이용업자들에 방향성을 가할 수 있는 새로운 플라즈마 기술로, 주로 MEMS 제조공정에 응용되고 있다. 본 연구에서는 STS-ICP $ASE^{HR}$을 이용하여 식각과 증착공정을 반복하여 식각을 하는 Bosch 식각에 관하여 연구하였다 STS-ICP $ASE^{HR}$ 장비의 Platen power, Coil power 및 Process pressure에 다양한 변화를 주어 각 변수에 따른 식각속도를 관찰하였다. 각 공정별 변수를 변화시킨 결과 Platen power 12W, Coil power 500W, 식각/Passivation Cycle 6/7sec 일 경우 식각속도는 $1.2{\mu}m$/min 이었고, Sidewall profile은 $90{\pm}0.7^{\circ}$로 나타나 매우 우수한 결과를 보였다.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.1
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• pp.75-81
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• 2014

Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.2 s.95
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• pp.60-67
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• 1999

Micro-fabrication techniques such as lithography and LIGA processes usually require large investment and are suitable for mass production. Therefore, there is a need for a new micro-fabrication technique that is flexible and more cost effective. In this paper a novel, economical and flexible method of producing micro-pattern on silicon wafer is presented. This method relies on selective removal of mask by mechanical cutting. Then micro-pattern is produced by chemical etching. V-shaped grooved of about 3 ${\mu}m$ wide and 2 ${\mu}m$ deep has been made on ${SiO_2}m$ coated silicon wafer with this method. This method may be utilized for making microstructures in MEMS application at low cost.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.424-429
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• 2008

Surface wettability in terms of the size of the micro nano structures has been examined. To evaluate the influence of the nano structures on the contact angles, we fabricated two different kinds of structures: squarepillar-type microstructure with nano-protrusions and without nano-protrusions. Microstructure and nanostructure arrays were fabricated by deep reactive ion etching (DRIE) and reactive ion etching (RIE) processes, respectively. And plasma polymerized fluorocarbon (PPFC) was finally deposited onto the fabricated structures. Average value of the measured contact angles from microstructures with nanoprotrusions was $6.37^{\circ}$ higher than that from microstructures without nano-protrusions. This result indicates that the nano-protrusions give a crucial effect to increase the contact angle.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1702-1703
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• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

• Korean Institute of Interior Design Journal
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• v.17 no.6
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• pp.11-20
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• 2008

The purpose of this study is to find out the theoretical background of spatial fantage effects in Piranesi etching "Le Carceri" called 'Architectural Capriccio'. In a life time Piranesi created a prodigious oeuvre of dramatic and fantastic images about magnificent buildings and mysterious ruins and prison. The increasing "tourism" after the middle of the 18th century contributed a lot to Piranesi's success. He was famous for his poetic views of Rome and also his fantastic imaginary interiors. The terms "Capriccio" and "Veduta" are strongly connected with Piranesi's work. The term Veduta describes a form of landscape depiction in print with close to reality imitation of the scenery, whereas the "Capriccio" contains the elements of invention in artificial architectural landscape. Trained in Venice as an engineer and architect, his studies had included perspective and stage design. These skills, allied to his deep knowledge of archaeology, provided the substance for his Veduta, etchings of ancient Rome. But his most remarkable etchings are those of imaginary interiors, the Carceri d'Invenzione(Imaginary Prisons), a series of capric plates issued in 1750. It appears to Piranesi etching 'Le Carceri' that 18th century experimental scenography's effect very strongly. Also, it can understand about "Scena per Angolo" which was revealed by Ferdinando Galli Bibiena that Piranesi spatial view and viewpoint deconstruction operate motive and cause. Piranesi's spatial fortification was influence by Filippo Juvarra's spatial concept. As a result of this research will be foundation of understanding deeply that Piranesi etching has been affect to present architecture and art.