• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.9
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• pp.452-455
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• 2006

The technology of wire explosion have been used to product nanopowders. A new concept was proposed to produce metallic nanosized powders, which is wire explosion in liquid media. We have exploded the Ag or Cu wires of diameter of O.3mm, 40mm long, in the de-ionized water or acetone, respectively. Electrical energy of 1.1kJ was stored in 10uF capacitor and released to the wires through a triggered spark gap switch. The process was observed by high-speed camera. Those images showed that the powders were generated by vapor condensation in the shell formed by shock wave in the water. The particles were directly dispersed into the water with collapse of the shell. The sizes of Ag and Cu nanopowders were evaluated to 35nm and 17nm, respectively.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.9
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• pp.1632-1637
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• 2010

A micro-water-nozzle, as one of a cooling means of micro-electronic devices, has been proposed and investigated. The I-V characteristics of the micro-water-nozzle and effect of applied voltage on the meniscus formation and deformation and ejection processes of de-ionized water on the micro-water-nozzle tip have been investigated. The water ejection processes, such as a drop formation, a drop deformation, a dripping, a cone jet, and an atomization, were taken place on the micro-water-nozzle tip by the electrohydrodynamic forces acted by the DC and AC high voltages applied on the meniscus of the micro-water-nozzle tip. The I-V characteristics of the micro-water-nozzle-to-plate electrode system were different from that of the same metal-point electrode system, due to the meniscus formation and water droplet ejection at the nozzle tip. The positive and negative DC and AC high voltages showed the water droplets ejection, the ejection rates of 1.8, 1.5 and 1.2 g/h respectively, which, however, showed that the proposed micro-water-nozzle-to-plate electrode system could be used as one of an effective pumping means.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.170-170
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• 2013

We present a novel etching technique for 2-dimentional (2-D) hexagonal boron nitride (h-BN) by using capacitively coupled plasma (CCP) of oxygen combined with a post-treatment by de-ionized (DI) water. Oxygen CCP etching process for h-BN has been systematically studied. It is found that a passivation layer was generated to obstruct further etching while it can be easily and radically removed by DI water. An essential cleaning effect also has been observed in the etching process, organic residues are successfully removed and the surface roughness has much decreased. Considering h-BN is the most important 2-D dielectric material and its potential application for graphene to silicon-based electronic devices, such an etching method can be widely used to control the 2-D h-BN thickness and improve the surface quality.

• Journal of the Korean Society of Visualization
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• v.13 no.3
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• pp.20-23
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• 2015

In this experiment, a heterogeneous droplet consisted of de-ionized water and olive oil was made through two 31G injection needles. The injection flow rate was $50{\mu}{\ell}/min$ and the droplet size was 2 mm. The droplet was impinged onto a sapphire plate which was heated up to $300^{\circ}C$ by a heater. Two high speed cameras were used for visualization, and the frame rate was 20,000 fps. A 150W metal halite lamp was used for illumination. The dropping height was fixed to 20 mm and the corresponding Weber number was 10.6 based on water. Due to different boiling points of two liquids, partial boiling features of heterogeneous droplet was observed. At the Leidenfrost condition, micro explosion phenomenon has occurred.

• 한국방재학회:학술대회논문집
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• 2008.02a
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• pp.807-810
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• 2008

Permeable reactive barriers containing Zero-valent iron (ZVI) are used to purify ground-water contaminants. One of the representative contaminant is trichloroethylene (TCE). ZVI can act as a reducing agent of TCE. When ZVI is oxidized to Ferric iron, TCE reduced to Ethene, which is non-harmful matter. As a ZVI becomes ferric iron, the reducing effect decreases and iron becomes unavailable. So, constant reduction of TCE requires the regular supply of reducing agent. So, we use Iron-reducing bacteria(IRB) to extend the TCE degrading ability. We perform three experiment DI water, DI water with medium, and DI water with medium and IRB. By the experiment we try to found the dissolve ability.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.18 no.1
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• pp.132-149
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• 1992

This study relates to a microemulsion gel which is applied in various cosmetic preparations because of good appearance, superior stability and a thin, uniform, non-greasy fi Am on the skin. Main object of this study is to elucidate the influence of polyol(clarifying agent and/or coupling agent in microemulsion) on microemulsion and to establish the optimum conditions for microemulsion gel formation in the view of superior consistency, stability, clarity and pick-up from a container. The constituents of the system are composed of water, polar ester oi1, nonionic surfactant and polyol. Using the three-component phase diagram and the tetrahedral-phase diagram, we have investigated the changes of transparence regions, consistency and resonance effect by an impact in microemulsion gel varying in polyol ratio. The results of this study showed that the variation in the content of water and couple ins agent has major influence on the microemulsion gel and the optimum formation region of microemulsion gel is the widest when the ratio of glycerine(coupling agent) to water is 63-75% It is believed that optimum use of polyol seems to be helpful to obtain the microemulsion gel containing maximum amount of oil phase with minimum amount of surfactant which is recently one of the major problems of cosmetic chemists.

• 연구논문집
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• s.33
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• pp.99-109
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• 2003

Recently the utilization of the ozone dissolved de-ionized water(DIW-$O_3$) in semiconductor wet cleaning process and photoresist stripping process to replace the conventional sulfuric acid and hydro peroxide mixture(SPM) method has been studied. In this paper, we propose the water-electrode type ozone generator which has the characteristics of the high concentration and purity to produce the high concentration DIW-$O_3$ for the photoresist strip process in the semiconductor fabrication. The proposed ozone generator has the dual dielectric tube structure of silent discharge type and the water is both used to electrode and cooling water. Through this study, we obtained the results of the 10.3 wt% of ozone gas concentration at the oxygen gas of 0.5 [liter/min.] and the DIW-$O_3$ concentration of 79.5 ppm.. Through the photoresist stripping test using the produced DIW-$O_3$, we confirmed that the photoresist coated on the silicon wafer was removed effectively in the 12 minutes.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.601-602
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.605-606
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2233-2234
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.