• Title/Summary/Keyword: Damage removal

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Effect of Metal Removal and Traction Force on Contact Fatigue Life (견인력과 접촉표면 제거가 접촉피로수명에 미치는 영향)

  • Seo Jung-Won;Hur Hun-Mu;Choi Jae-Boong;Kim Young-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.10 s.241
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    • pp.1384-1391
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    • 2005
  • Damage often occurs on the surface of railway wheels due to wheel-rail contact fatigue. It should be removed before reaching wheel failure, because wheel failure can cause derailment with loss of life and property. The increase or decrease of the contact fatigue lift by the metal removal of the contact surface were investigated by many researchers, but they have not considered initial residual stress and traction force. The railway wheel has the initial residual stress formed during the manufacturing process, and the residual stress is changed by thermal stress induced by braking. The traction force and residual stress are operated on wheels of locomotive and electric motor vehicle. In this study, the effect of metal removal depth on the contact fatigue life for a railway wheel has been evaluated by applying lolling contact fatigue test. The effect of the traction force and metal removal on the contact fatigue life has been estimated by finite element analysis. It has been found that the initial residual stress determines the amount of metal removal depth if the traction coefficient is less than 0.15. If the traction coefficient is greater than 0.2, however, the amount of metal removal depth is independent on the intial residual stress.

DCT and DWT based Damaged Weather Radar Image Retrieval (DCT 및 DWT 기반의 손상된 기상레이더 영상 복원 기법)

  • Jang, Bong-Joo;Lim, Sanghun;Kim, Won;Noh, Huiseong
    • Journal of Korea Multimedia Society
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    • v.20 no.2
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    • pp.153-162
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    • 2017
  • Today, weather radar is used as a key tool for modern high-tech weather observations and forecasts, along with a wide variety of ground gauges and weather satellites. In this paper, we propose a frequency transform based weather radar image processing technique to improve the weather radar image damaged by beam blocking and clutter removal in order to minimize the uncertainty of the weather radar observation. In the proposed method, DCT based mean energy correction is performed to improve damage caused by beam shielding, and DWT based morphological image processing and high frequency cancellation are performed to improve damage caused by clutter removal. Experimental results show that the application of the proposed method to the damaged original weather radar image improves the quality of weather radar image adaptively to the weather echo feature around the damaged area. In addition, radar QPE calculated from the improved weather radar image was also qualitatively confirmed to be improved by the damage. In the future, we will develop quantitative evaluation scales through continuous research and develop an improved algorithm of the proposed method through numerical comparison.

Effect of N2/Ar flow rates on Si wafer surface roughness during high speed chemical dry thinning

  • Heo, W.;Lee, N.E.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.128-128
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    • 2010
  • In this study, we investigated the evolution and reduction of the surface roughness during the high-speed chemical dry thinning process of Si wafers. The direct injection of NO gas into the reactor during the supply of F radicals from NF3 remote plasmas was very effective in increasing the Si thinning rate, due to the NO-induced enhancement of the surface reaction, but resulted in the significant roughening of the thinned Si surface. However, the direct addition of Ar and N2 gas, together with NO gas, decreased the root mean square (RMS) surface roughness of the thinned Si wafer significantly. The process regime for the increasing of the thinning rate and concomitant reduction of the surface roughness was extended at higher Ar gas flow rates. In this way, Si wafer thinning rate as high as $20\;{\mu}m/min$ and very smooth surface roughness was obtained and the mechanical damage of silicon wafer was effectively removed. We also measured die fracture strength of thinned Si wafer in order to understand the effect of chemical dry thinning on removal of mechanical damage generated during mechanical grinding. The die fracture strength of the thinned Si wafers was measured using 3-point bending test and compared. The results indicated that chemical dry thinning with reduced surface roughness and removal of mechanical damage increased the die fracture strength of the thinned Si wafer.

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Ductile Fracture Behaviour under Mode I Loading Using Rousellier Ductile Damage Theory

  • Oh, Dong-Joon;Howard, I.C.;Yates, J.R.
    • Journal of Mechanical Science and Technology
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    • v.14 no.9
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    • pp.978-984
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    • 2000
  • The aim of this study is to investigate the ductile fracture behaviour under Mode I loading using SA533B pressure vessel steel. Experiments consist of the Round Notch Bar Test (RNB), Single Edge Crack Bending Test (SECB), and V-Notch Bar Test (VNB). Results from the RNB test were used to tune the damage modelling constant. The other tests were performed to acquire the J-resistance curves and to confirm the damage constants. Microstructural observation includes the measurement of crack profile to obtain the roughness parameter. Finally, simulation using Rousellier Ductile Damage Theory (RDDT) was carried out with 4-node quadrilateral element ($L_c=0.25\;mm$). For the crack advance, the failed element removal technique was adopted with a ${\beta}$ criterion. In conclusion, the predicted simulation using RDDT showed a good agreement with the experimental results. A trial using a roughness parameter was made for a new evaluation of J-resistance curve, which is more conservative than the conventional one.

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EUVL Mask Defect Isolation and Repair using Focused Ion Beam (Focused Ion Beam을 이용한 EUVL Mask Defect Isolation 및 Repair)

  • 김석구;백운규;박재근
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.2
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    • pp.5-9
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    • 2004
  • Microcircuit fabrication requires precise control of impurities in tiny regions of the silicon. These regions must be interconnected to create components and VLSI circuits. The patterns to define such regions are created by lithographic processes. In order to image features smaller than 70 nm, it is necessary to employ non-optical technology (or next generation lithography: NGL). One such NGL is extreme ultra-violet lithography (EUVL). EUVL transmits the pattern on the wafer surface after reflecting ultra-violet through mask pattern. If particles exist on the blank mask, it can't transmit the accurate pattern on the wafer and decrease the reflectivity. It is important to care the blank mask. We removed the particles on the wafer using focused ion beam (FIB). During removal, FIB beam caused damage the multi layer mask and it decreased the reflectivity. The relationship between particle removal and reflectivity is examined: i) transmission electron microscope (TEM) observation after particle removal, ii) reflectivity simulation. It is found that the image mode of FIB is more effective for particle removal than spot and bar mode.

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Effects of Metal Removal on Contact Fatigue Life (접촉표면 제거가 접촉피로수명에 미치는 영향평가)

  • Seo Jung-Won;Hur Hun-Mu;Kwon Suk-Jin;Goo Byeong-Choon
    • Proceedings of the KSR Conference
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    • 2004.10a
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    • pp.692-697
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    • 2004
  • Damage often occurs on the surface of railway wheel by wheel-rail contact fatigue. It should be removed before reaching wheel failure, because wheel failure can cause derailment with loss of life and property. The increase or decrease of the contact fatigue life by the metal removal of the contact surface were shown by many researchers, but it has not explained precisely why fatigue life increases or decreases. In this study, the effect of metal removal depth on the contact fatigue life for railway wheel has been evaluated by applying finite element analysis. It has been revealed that the residual stress and the plastic flow are the main factors determining the fatigue life. Finally, the contact fatigue life according to metal removal has been estimated.

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Removal of fractured implant screws: case report (파절된 임플란트 나사의 제거: 증례보고)

  • Kim, Tae-Su;Lee, Jae-Hyun;Lee, Won-Sup;Lee, Su-Young
    • Journal of Dental Rehabilitation and Applied Science
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    • v.31 no.1
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    • pp.60-66
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    • 2015
  • Screw loosening and screw fracture of abutment is one of most frequent mechanical complications in implant restoration. Fractured fragments in implant restoration like abutment and screw should be completely removed and the procedure needs minimal damage to the fixture of implant. In some cases, it could fail to remove fractured fragments and cause a lot of damage to the fixture of implant. These situations could render implant unusable at the worst. This article describes three different situations and simple techniques for successful removal of fractured fragments without damage of implants. The procedures used are described in this clinical report.

Biological Characteristics of the Ginseng Stem Fungus Gnat (Phytosciara procera) and Its Environmental-friendly Control Using Modified Topping of Ginseng Peduncles

  • Lee, Seung-Hwan;Shin, Jung-Sup;Hong, Tae-Gyun;Ahn, Young-Joon;Cho, Dae-Hui
    • Journal of Ginseng Research
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    • v.34 no.1
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    • pp.23-29
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    • 2010
  • This study examined the biological characteristics of the insect and examined potential cultural controls using peduncle topping methods. Ginseng stem fungus gnat eggs hatched after 5 days; ecdysis lasted 3-4 weeks, and after 5 days pupation, adults emerged. Adults deposited eggs 1-2 days after emerging, and the entire life cycle lasted 32-40 days. The fungus gnats laid eggs $327\times220{\mu}m$ in size on cut planes of stems, but not on intact stem parts that had not been topped or wounded. Analyses of major weather data for the experimental areas and weather data for the past 30 years acquired from the Korea Meteorological Administration revealed that fungus gnat dispersion was prevalent under highly humid conditions and in areas with thick and frequent fogging. Among the topping times examined, fungus gnat damage to ginseng was lowest when topping occurred in late May. Among the five different topping methods evaluated on experimental ginseng farms, the cumulative fungus gnat damage to ginseng was low (0.8%) under partial peduncle topping (removal of peduncle with lateral fruit remaining) and removal of only flower buds (0.6%), with fungus gnat control effects of 82% and 86%, respectively, compared to conventional topping (removal of peduncle about 5 cm above its base). No fungus gnat damage to ginseng was observed under the no-topping treatment. These results suggest that partial topping of peduncles, while letting lateral fruits remain, is a potentially environmentally friendly method of controlling the ginseng stem fungus gnat.

Evaluation of Radiological Effects on the Aptamers to Remove Ionic Radionuclides in the Liquid Radioactive Waste

  • Minhye Lee;Gilyong Cha;Dongki Kim;Miyong Yun;Daehyuk Jang;Sunyoung Lee;Song Hyun Kim;Hyuncheol Kim;Soonyoung Kim
    • Journal of Radiation Protection and Research
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    • v.48 no.1
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    • pp.44-51
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    • 2023
  • Background: Aptamers are currently being used in various fields including medical treatments due to their characteristics of selectively binding to specific molecules. Due to their special characteristics, the aptamers are expected to be used to remove radionuclides from a large amount of liquid radioactive waste generated during the decommissioning of nuclear power plants. The radiological effects on the aptamers should be evaluated to ensure their integrity for the application of a radionuclide removal technique. Materials and Methods: In this study, Monte Carlo N-Particle transport code version 6 (MCNP6) and Monte Carlo damage simulation (MCDS) codes were employed to evaluate the radiological effects on the aptamers. MCNP6 was used to evaluate the secondary electron spectrum and the absorbed dose in a medium. MCDS was used to calculate the DNA damage by using the secondary electron spectrum and the absorbed dose. Binding experiments were conducted to indirectly verify the results derived by MCNP6 and MCDS calculations. Results and Discussion: Damage yields of about 5.00×10-4 were calculated for 100 bp aptamer due to the radiation dose of 1 Gy. In experiments with radioactive materials, the results that the removal rate of the radioactive 60Co by the aptamer is the same with the non-radioactive 59Co prove the accuracy of the previous DNA damage calculation. Conclusion: The evaluation results suggest that only very small fraction of significant number of the aptamers will be damaged by the radioactive materials in the liquid radioactive waste.

THE CHARACTERISTICS OF FRETTING WEAR

  • Iwabuchi, Akira
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 1996.05a
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    • pp.1-3
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    • 1996
  • The characteristics of fretting wear are reviewed. Fretting damage depends on slip amplitude and classified into three groups: (1) an annular damage according to Mindlin's analysis at microslip region, (2) strong adhesive deformation without loose wear particles at the intermediate region, and (3) formation of fine oxide particles at the gross slip region. The critical slip amplitude of fretting is the boundary between (2) and (3). The boundary slip amplitude depends on normal load. The wear rate increases and saturates with increasing slip amplitude. But it is constant by considering the critical amplitude. The role of oxide particles are discussed. Three different actions are noted: accelerating wear, preventing wear and insignificant effect. The oxide shows two opposing effect depends on normal load and slip amplitude. This is related to the removal rate from the interface (abrasive action) and compaction rate at the interface to form a protective layer. The effect of oxidation is significant to determine the wear and friction. The diffusion of oxygen is restricted at the small amplitude. As a result, crack formation at the boundary is a predominant damage, related to fretting fatigue damage.

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