• Korean Journal of Materials Research
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• v.11 no.3
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• pp.215-220
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• 2001

Amorphous Ti-Si-N films of approximately 200 and 650 thickness were reactively sputtered on Si wafers using a dc magnetron sputtering system at various $N_2$/Ar flow ratios. Their barrier properties between Cu (750 ) and Si were investigated by using sheet resistance measurements, XRD, SEM, RBS, and AES depth profiling focused on the effect of the nitrogen content in Ti-Si-N thin film on the Ti-Si-N barrier properties. As the nitrogen content increases, first the failure temperature tends to increase up to 46 % and then decrease. Barrier failure seems to occur by the diffusion of Cu into the Si substrate to form Cu$_3$Si, since no other X- ray diffraction intensity peak (for example, that for titanium silicide) than Cu and Cu$_3$Si Peaks appears up to 80$0^{\circ}C$. The optimal composition of Ti-Si-N in this study is $Ti_{29}$Si$_{25}$N$_{46}$. The failure temperatures of the $Ti_{29}$Si$_{25}$N$_{465}$ barrier layers 200 and 650 thick are 650 and $700^{\circ}C$, respectively.ely.

• Applied Chemistry for Engineering
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• v.16 no.6
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• pp.768-771
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• 2005

The deposition of silicon nitride ($SiN_x$) thin films was carried out on $SiO_2/Si$ substrate at room temperature by reactive dc magnetron sputtering. The analysis of deposited $SiN_x$ films using x-ray photoelectron spectroscopy indicated that the composition of $SiN_x$ films was Si-rich. The deposited $SiN_x$ thin films were annealed by varying annealing temperature and time. X-ray diffraction (XRD) analysis was performed in order to examine the crystallization of Si in $SiN_x$ thin films. The optical and electrical properties of $SiN_x$ thin films were measured for the observation of Si nanodot. As a result, we observed the XRD peaks that might be the Si crystals. As the annealing time and annealing temperature increased, the photoluminescence intensity of $SiN_x$ films gradually increased. The capacitance-voltage characteristics of $SiN_x$ film measured before and after annealing indicated that the trap effect of electrons or holes occurred due to the existence Si nanodots in the $SiN_x$ thin films.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.129-129
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• 2016

Graphene, as a single layer of $sp^2$-bonded carbon atoms packed into a 2D honeycomb crystal lattice, has attracted much attention due to its outstanding properties. In order to synthesize high quality graphene, transition metals, such as nickel and copper, have been widely employed as catalysts, which needs transfer to desired substrates for various applications. However, the transfer steps are not only complicated but also inevitably induce defects, impurities, wrinkles, and cracks of graphene. Furthermore, the direct synthesis of graphene on dielectric surfaces has still been a premature field for practical applications. Therefore, cost effective and concise methods for transfer-free graphene are essentially required for commercialization. Here, we report a facile transfer-free graphene synthesis method through nickel and carbon co-deposited layer. In order to fabricate 100 nm thick NiC layer on the top of $SiO_2/Si$ substrates, DC reactive magnetron sputtering was performed at a gas pressure of 2 mTorr with various Ar : $CH_4$ gas flow ratio and the 200 W DC input power was applied to a Ni target at room temperature. Then, the sample was annealed under 200 sccm Ar flow and pressure of 1 Torr at $1000^{\circ}C$ for 4 min employing a rapid thermal annealing (RTA) equipment. During the RTA process, the carbon atoms diffused through the NiC layer and deposited on both sides of the NiC layer to form graphene upon cooling. The remained NiC layer was removed by using a 0.5 M $FeCl_3$ aqueous solution, and graphene was then directly obtained on $SiO_2/Si$ without any transfer process. In order to confirm the quality of resulted graphene layer, Raman spectroscopy was implemented. Raman mapping revealed that the resulted graphene was at high quality with low degree of $sp^3$-type structural defects. Additionally, sheet resistance and transmittance of the produced graphene were analyzed by a four-point probe method and UV-vis spectroscopy, respectively. This facile non-transfer process would consequently facilitate the future graphene research and industrial applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.214.1-214.1
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• 2015

Thin-film transistors (TFTs)의 채널층으로 널리 쓰이는 indium-gallium-zinc oxide (IGZO)는 높은 전자 이동도(약 10 cm2/Vs)를 나타내며 유기 발광 다이오드디스플레이(OLED)와 대면적 액정 디스플레이(LCD)에 필수적으로 사용되고 있다. 하지만, 이러한 재료는 우수한 TFT의 채널층의 특성을 가지는 반면, ZnO 기반 재료이기 때문에 소자 구동에서의 안정성은 가장 큰 문제로 남아있다. 따라서 최근, IGZO layer의 특성을 향상시키기 위한 연구가 다양한 방법으로 시도되고 있다. IGZO의 조성비를 조절하여 전기적 특성을 최적화거나 IGZO layer의 조성 중 Ga을 다른 금속 메탈로 대체하는 연구도 이루어지고 있다. 그러나 IGZO에 미량의 도펀트를 첨가하여 박막 특성 변화를 관찰한 연구는 거의 진행되지 않고 있다. 산화물 TFTs의 전기적 특성과 안정성은 산소 함량에 영향을 많이 받는 것으로 알려져 있으며, 더욱이 TFT 채널층으로 쓰이는 IGZO 박막의 고유한 산소 공공은 디바이스 작동 중 열적으로 활성화 되어 이온화 상태가 될 때 소자의 안정성을 저하시키는 것이 문제점으로 지적되고 있다. 그러므로 본 연구에서는 낮은 전기 음성도(1.22)와 표준전극전위(-2.372 V)를 가지며 산소와의 높은 본드 엔탈피 값(719.6 kJ/mol)을 가짐으로써 산소 공공생성을 억제할 것으로 기대되는 yttrium을 IGZO의 도펀트로 도입하였다. 따라서 본 연구에서는 Y-IGZO의 박막 특성 변화를 관찰하고자 한다. 본 연구에서는 magnetron co-sputtering법으로 IGZO 타깃(DC)과 Y2O3 타깃(RF)를 이용하여 기판 가열 없이 동시 방전을 이용해 non-alkali glass 기판 위에 증착 하였다. IGZO 타깃은 DC power 110 W으로 고정하였으며 Y2O3 타깃에는 RF Power를 50 W에서 110 W까지 증가시키면서 Y 도핑량을 조절하였다. Working pressure는 고 순도 Ar을 20 sccm 주입하여 0.7 Pa로 고정하였다. 모든 실험은 $50{\times}50mm$ 기판 위에 총 두께 $50nm{\pm}2$ 박막을 증착 하였으며, 그 함량에 따른 전기적 특성 및 광학적 특성을 살펴보았다. 또한, IGZO 박막 제조 시 박막의 안정화를 위해 열처리과정은 필수적이다. 하지만 본 연구에서는 열처리를 진행하지 않고 Y-IGZO의 안정성 개선 여부를 보기 위하여 20일 동안 상온에서 방치하여 그 전기적 특성변화를 관찰하였다. 나아가 Y-IGZO 채널 층을 갖는 TFT 소자를 제조하여 소자 구동 특성을 관찰 하였다. Y2O3 타깃에 가해지는 RF Power가 70 W 일 때 Y-IGZO박막은 IGZO박막과 비교하여 상대적으로 캐리어 밀도는 낮은 반면 이동도는 높은 최적 특성을 얻을 수 있었다. 상온방치 결과 Y-IGZO박막은 IGZO박막에 비해 전기적 특성 변화 폭이 적었으며 이것은 Y 도펀트에 의한 안정성 개선의 결과로 예상된다. 투과도는 Y 도핑에 의하여 약 1.6 % 정도 상승하였으며 밴드 갭 내에서 결함 준위로 작용하는 산소공공의 억제로 인한 결과로 판단된다.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.601-606
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• 2000

Nickel mono-silicide(NiSi) shows no increase of resistivity as the line width decreases below 0.15$\mu\textrm{m}$. Furthermore, thin silicide can be made easily and restrain the redistribution of dopants, because NiSi in created through the reaction of one nickel atom and one silicon atom. Therefore, we investigated the deposition condition of Ni films, heat treatment condition and basic properties of NiSi films which are expected to be employed for sub-0.15$\mu\textrm{m}$ class devices. The nickel silicide film was deposited on the Si wafer by using a dc-magnetron sputter, then annealed at the temperature range of $150~1000^{\circ}C$. Surface roughness of each specimen was measured by using a SPM (scanning probe microscope). Microstructure and qualitative composition analysis were executed by a TEM-EDS(transmission electron microscope-energy dispersive x-ray spectroscope). Electrical properties of the materials at each annealing temperature were measured by a four-point probe. As the results of our study, we may conclude that; 1. SPM can be employed as a non-destructive process to monitor NiSi/NiSi$_2$ transformation. 2. For annealing temperature over $800^{\circ}C$, oxygen pressure $Po_2$ should be kept below $1.5{\times}10^{-11}torr$ to avoid oxidation of residual Ni. 3. NiSi to $NiSi_2$ transformation temperature in our study was $700^{\circ}C$ from the four-point probe measurement.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.5
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• pp.986-991
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• 2016

In this study, we prepared ITO thin films on $Nb_2O_5/SiO_2$ double buffer layer using DC magnetron sputtering method and investigated electrical and optical properties with various substrate temperatures (room temperature ~ $400^{\circ}C$). The resistivity showed a decreasing tendency, because crystallinity has been improved due to the enlarged grain size with increasing substrate temperature. ITO thin film deposited at $400^{\circ}C$ showed the most excellent value of resistivity and sheet resistance as $3.03{\times}10^{-4}{\Omega}{\cdot}cm$, $86.6{\Omega}/sq.$, respectively. In results of optical properties, average transmittance was increased but chromaticity ($b^*$) was decreased in visible light region (400~800nm) with increasing substrate temperature. Average transmittance and chromaticity ($b^*$) of ITO thin film deposited at $400^{\circ}C$ exhibited significantly improved results as 85.8% and 2.13 compared to 82.8% and 4.56 of the ITO thin film without buffer layer. Finally, we found that ITO thin film introduced $Nb_2O_5/SiO_2$ double buffer layer has a remarkably improved optical property such as transmittance and chromaticity due to the index matching effect.

• Journal of the Korean Magnetics Society
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• v.14 no.5
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• pp.192-195
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• 2004

Magnetic properties by exchange biased perpendicular magnetic anisotropy in [Pd(0.8 nm)/Co(0.8 nm)]$_{5}$/FeMn(15 nm) multilayers deposited by dc magnetron sputtering system are investigated. As inserted Pd layer of interface between [Pd/Co] multilayer and FeMn film, the Hex of perpendicular anisotropy was improved from 127 Oe to 145 Oe. But result of an experiment by thermal stability, the Hex of the case that an inserted layer was inserted in decreased from low 20$0^{\circ}C$ in about 5$0^{\circ}C$ more if not inserted. If Ta was a buffer layer, the experiment results along material of buffer layer, the H$_{ex}$ obtained the largest 127 Oe. And if Pd was a buffer layer, H$_{ex}$ obtained the largest 169 Oe. Also, the Hc in buffer layer of Ta and Pd obtained the largest 203 Oe and 453 Oe, respectively.

• Journal of the Korean Magnetics Society
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• v.11 no.2
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• pp.72-77
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• 2001

Top spin valve films with PtMn antiferromagnetic layers were deposited using a multi-target dc magnetron sputtering in (100)Si substrates overcoated with 500 $\AA$ of Al$_2$O$_3$. Firstly, the post-deposition annealing was performed at 270$\^{C}$ in a unidirectional magnetic field of 3 kOe to induce the crystallographic transformation of the PtMn layer from a fcc (111) to a fct (111) structure. Secondly, the spin valve films were annealed without magnetic fields and magnetic properties were measured. In Si/A1$_2$O$_3$ (500$\AA$)/Ta(50$\AA$)NiFe(40$\AA$)/CoFe(17$\AA$)/Cu(28$\AA$)/CoFe (30$\AA$)PtMn(200$\AA$)Ta(50$\AA$) top spin valve samples, the MR ratio decreased slowly with increasing annealing temperature up to 325$\^{C}$. But above 325$\^{C}$, the MR ratio decreased rapidly to 1%, due to a collapse of the exchange coupling between a antiferromagnetic layer and a pinned layer with increasing annealing temperature. Also above 325$\^{C}$, the exchange biased field rapidly decreased and the interlayer coupling field rapidly increased with increasing annealing temperature. A change in the interlayer coupling field was resulted from the increase in interface roughness due to Mn-interdiffusion through the grain boundaries. We confirmed the temperature in changing magnetic properties agreed well with the blocking temperature of PtMn based spin valve structure.

• Applied Chemistry for Engineering
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• v.31 no.3
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• pp.291-298
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• 2020

ZITO/Ag/ZITO multilayer transparent electrodes at room temperature on glass substrates were prepared using RF/DC magnetron sputtering. Transparent conductive films with a sheet resistance of 9.4 Ω/㎡ and a transmittance of 83.2% at 550 nm were obtained for the multilayer structure comprising ZITO/Ag/ZITO (100/8/42 nm). The sheet resistance and transmittance of ZITO/Ag/ZITO multilayer films meant that they would be highly applicable for use in polymer-dispersed liquid crystal (PDLC)-based smart windows due to the ability to effectively block infrared rays (heat rays) and thereby act as an energy-saving smart glass. Effects of the thickness of the PDLC layer and the intensity of ultraviolet light (UV) on electro-optical properties, photopolymerization kinetics, and morphologies of difunctional urethane acrylate-based PDLC systems were investigated using new transparent conducting electrodes. A PDLC cell photo-cured using UV at an intensity of 2.0 mW/c㎡ with a 15 ㎛-thick PDLC layer showed outstanding off-state opacity, good on-state transmittance, and favorable driving voltage. Also, the PDLC-based smart window optimized in this study formed liquid crystal droplets with a favorable microstructure, having an average size range of 2~5 ㎛ for scattering light efficiently, which could contribute to its superior final performance.

• Journal of the Korean Magnetics Society
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• v.7 no.1
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• pp.38-43
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• 1997

For amorphous $Co_{1-x}Ti_x$(X=0.13, 0.16, 0.21 at.%) thin films deposited by DC magnetron sputtering method ferromagnetic resonance experiments have been used to investigate the dependence of surface magnetic properties according to annealing temperature (150~225 $^{\circ}C$). Spin wave resonance spectra for all annealing temperatures consist of several volume modes and one(or two) surface mode. It is suggested that both surfaces of the film have a perpendicular hard axis to the film plane(negative surface anisotropy). Also, the surface anisotropy $K_{s2}$ at substrate film interface is varied slowly from -0.11 to -0.25 erg/ $\textrm{cm}^2$ and the surface anisotropy $K_{s1}$ at film-air interface is varied from 0.16 to -0.53 erg/ $\textrm{cm}^2$ with increasing annealing temperature. We conjecture that the variation of surface anisotropy $K_{s1}$ is due to the increase of Co concentration resulted from Ti oxidation for low temperature annealing(150~200 $^{\circ}C$) and the diffusion of Co atoms near the film surfaces for high temperature annealing(225~250 $^{\circ}C$).