• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.409-412
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• 2003

Fatigue strength. especially crack initiation behavior of high strength steel under marine water environment was investigated. Marine structures were usually constructed by lot of weld joints and were designed by basis of the fatigue strength of weld joints. This study was carried out to mini. The fatigue initiation behavior is more important rather than crack propagation behavior under the design of marine structures, because it is very difficult to find out the crack propagation phenomena and repair the damaged part of welded joints in sea water Then, the new configuration specimen for fatigue crack initiation tests was proposed. Using this new specimen, it is easy to carry out the crack initiation tests with relatively low cycling loading and clearly find out a crack initiation fatigue life.

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• Macromolecular Research
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• v.13 no.5
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• pp.441-445
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• 2005

Thermoplastic polyurethane elastomer (TPUe) fiber mats were successfully fabricated by electrospinning method. The TPUe fiber mats were subjected to a series of cycling tensile tests to determine the mechanical behavior. The electrospun TPUe fiber mats showed non-linear elastic and inelastic characteristics which may be due to slippage of crossed fiber (non-bonded or physical bonded structure) and breakage of the electro spun fibers at junctions (point-bonded or chemical bonding structure). The scanning electron microscopy (SEM) images demonstrated that the point-bonded structures of fiber mats played an important role in the load-bearing component as determined in loading-unloading component tests, which can be considered to have a force of restitution.

• Journal of Korean Association for Spatial Structures
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• v.23 no.4
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• pp.71-79
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• 2023

In this study, a prefabricated buckling brace (PF-BRB) was proposed, and a test specimen was manufactured based on the design formula for the initial shape and structural performance tests were performed. As a result of the experiment, all standard performance requirements presented by KDS 41 17 00 and MOE 2021 were satisfied before and after replacement of the reinforcement module, and no fracture of the joint module occurred. As a result of the incremental load test, the physical properties showed a significant difference in the stiffness ratio after yielding under the compressive load of the envelope according to the experimental results. It is judged necessary to further analyze the physical properties according to the experimental results through finite element analysis in the future.

• Wind and Structures
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• v.12 no.4
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• pp.383-400
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• 2009

Low rise building roofs can be subjected to large fluctuating pressures during a tropical cyclone resulting in fatigue failure of cladding. Following the damage to housing in Tropical Cyclone Tracy in Darwin, Australia, the Darwin Area Building Manual (DABM) cyclic loading test criteria, that loaded the cladding for 10000 cycles oscillating from zero to a permissible stress design pressure, and the Experimental Building Station TR440 test of 10200 load cycles which increased in steps to the permissible stress design pressure, were developed for assessing building elements susceptible to low cycle fatigue failure. Recently the 'Low-High-Low' (L-H-L) cyclic test for metal roofing was introduced into the Building Code of Australia (2007). Following advances in wind tunnel data acquisition and full-scale wind loading simulators, this paper presents a comparison of wind-induced cladding damage, from a "design" cyclone proposed by Jancauskas, et al. (1994), with current test criteria developed by Mahendran (1995). Wind tunnel data were used to generate the external and net pressure time histories on the roof of a low-rise building during the passage of the "design" cyclone. The peak pressures generated at the windward roof corner for a tributary area representative of a cladding fastener are underestimated by the Australian/New Zealand Wind Actions Standard. The "design" cyclone, with increasing and decreasing wind speeds combined with changes in wind direction, generated increasing then decreasing pressures in a manner similar to that specified in the L-H-L test. However, the L-H-L test underestimated the magnitude and number of large load cycles, but overestimated the number of cycles in the mid ranges. Cladding elements subjected to the L-H-L test showed greater fatigue damage than when experiencing a five hour "design" cyclone containing higher peak pressures. It is evident that the increased fatigue damage was due to the L-H-L test having a large number of load cycles cycling from zero load (R=0) in contrast to that produced during the cyclone.

• Magazine of the Korea Concrete Institute
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• v.9 no.3
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• pp.137-147
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• 1997

Interface shear strength of' concrete under static loading and deterioratiion of interface strength by fatigue loading in shear were experimentally investigated using composite beam test specimens. Thirteen beams were constructed. Five composite beams were tested statically until interface delaminations were observed in the static tests. Seven composite beam and one monolithically cast beam were subjected to two to three million cycles of fatigue load. Test variables were interface roughness, interface shear reinforcement, and presence of interface bond. The average interface shear strength of the composite beams with bonded-rough interface was 6, 060 kPa. No interface delamination was observed after cycling for the composite beams with bonded - rough interface and interface bond was not influenced by repeated application of the shear stress of 2.000 kPa(about 1/3 of the static interface shear strength). Smooth interface and unbonded-rough interface with shear reinforcement deteriorated under repeated shear loading.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.9
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• pp.1077-1082
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• 2013

To improve cycling performance, the power output of the rider and the sources of resistance (e.g., air resistance, frame stiffness, and cycle mass) must be considered. From a mechanical viewpoint, we consider how the bike frame performance can be increased while decreasing the resistance. First, to improve the competitive ability of a racing track cycle, we should consider the stiffness of the bike frame including the pedal loading and aerodynamic effects when riding. Therefore, we obtained the cross-sectional area of each part of the bike frame and then aimed to minimize the drag force through an aerodynamic parametric study. In addition, the frame should remain safe under the loading applied by the rider. Under the guidelines of the UCI (union Cycliste Internationale) regulations, the bike frame has been evaluated under the proposed loading condition, and we developed a racing track cycle for elite cyclists.

• Polymer(Korea)
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• v.36 no.1
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• pp.88-92
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• 2012

Long-term performance of polymer under constant sustained load has been the main research focus, which created a need for the accelerated test method providing proper lifetime assessment. Cycling fatigue loading is one of the accelerated test method and has been of great interest. Microstructure change of high density polyethylene under cyclic fatigue loading and creep was examined utilizing a tensile device specially designed for creep and fatigue test and also can be attachable to the X-ray diffractometer. In this way, the crystal morphology change of polyethylene under creep and cyclic fatigue load was successfully monitored and compared. Despite the marked differences in macroscopic deformation between the creep and cyclic fatigue tests, crystal morphology such as crystallinity, crystal size, and $d$-spacing was as nearly identical between the two test cases. Specimens pre-deformed to different strains, i.e., before yield point (BYP), at yield point (YP) and after yield point (AYP), however, showed markedly different changes in crystal morphology, especially between AYP and the other two specimens.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.