• Journal of Korean Tunnelling and Underground Space Association
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• v.16 no.6
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• pp.585-597
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• 2014

In this study, the cutter acting forces were measured by 3-directional load cell at two different skew angles and various S/d ratios during a series of linear cutting tests using a slim conical pick. The analysis for cutting performance were carried out after calculating average values of the measured results. The increase of penetration depth results in the decrease of specific energy. And the variations of the cutter acting forces depending on penetration depth in the case of 6 degree skew angle were smaller than in the case of 0 degree skew angle. From this results, 6 degree skew angle is more effective than 0 degree skew angle in designing optimal specifications of cutting head. In addition, $F_c/F_n$ under the setting of 6 degree skew angle was smaller than under the setting of 0 degree skew angle. However, it should be considered that the increase of cutter acting force in the cutting direction accompanied the increase of driving force in the case of the setting for 6 degree skew angle.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1309-1316
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But products with inferior quality are produced under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO2, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism and determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.2
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• pp.218-225
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. However, inferior goods may be made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to a GaN wafer, because the GaN wafer is harder than other wafers such as SiO$_2$, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using a scriber.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.164-167
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• 2002

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO$_2$, GaAs, CaAsP, and AlCaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Korean Journal of Applied Biomechanics
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• v.26 no.4
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• pp.433-441
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• 2016

Objective: The purpose of this study was to understand the injury mechanism and to provide quantitative data to use in prevention or posture correction training by conducting kinematic and kinetic analyses of risk factors of lower extremity joint injury depending on the change of direction at different angles after a landing motion. Method: This study included 11 men in their twenties (age: $24.6{\pm}1.7years$, height: $176.6{\pm}4.4cm$, weight: $71.3{\pm}8.0kg$) who were right-leg dominant. By using seven infrared cameras (Oqus 300, Qualisys, Sweden), one force platform (AMTI, USA), and an accelerometer (Noraxon, USA), single-leg drop landing was performed at a height of 30 cm. The joint range of motion (ROM) of the lower extremity, peak joint moment, peak joint power, peak vertical ground reaction force (GRF), and peak vertical acceleration were measured. For statistical analysis, one-way repeated-measures analysis of variance was conducted at a significance level of ${\alpha}$ <.05. Results: Ankle and knee joint ROM in the sagittal plane significantly differed, respectively (F = 3.145, p = .024; F = 14.183, p = .000), depending on the change of direction. However, no significant differences were observed in the ROM of ankle and knee joint in the transverse plane. Significant differences in peak joint moment were also observed but no statistically significant differences were found in negative joint power between the conditions. Peak vertical GRF was high in landing (LAD) and after landing, left $45^{\circ}$ cutting (LLC), with a significant difference (F = 9.363, p = .000). The peak vertical acceleration was relatively high in LAD and LLC compared with other conditions, but the difference was not significant. Conclusion: We conclude that moving in the left direction may expose athletes to greater injury risk in terms of joint kinetics than moving in the right direction. However, further investigation of joint injury mechanisms in sports would be required to confirm these findings.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.19 no.1
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• pp.120-130
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• 1994

The leadwire cutting machine that has been used recently cuts leadwires by putting one-side force with the same priciple as a saw, and applies a stress at soldered part of PCB. Because the stress becomes one cause of contact-defect, a leadwire cutting robot that cuts leadwire-site with nipper and does not apply stress is considered, In this paper a technique of detecting leadwire-site is studied for the purpose of using on automatic leadwire cutting robots. A technique deriving 2-dimensional site-information with many I-dimensional binary data of perspective front-view of PCB taken from various direction was proposed. Simulation and experiments were done under the same condition each other and a small universal PCB was choosen as an experimental object. As a result of simulations and experiments, the proposed technique turns out to be very useful for automatic leadwire cutting robots.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.137-143
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• 2022

Composite materials, being light-weight and of high mechanical strength, are increasingly used in various industries such as the aerospace, automobile, sporting-goods manufacturing, and ship-building industries. Recently, manufacturing of composite materials using 3D printers has increased. 3D-printed composite materials are made in free-form and adapted for end-use by adjusting the fiber content and orientation. However, research on the machining of 3D printed composite materials is limited. The aim of this study is to develop a machine learning method to select machining conditions for machining of 3D-printed composite materials. The composite material was composed of Onyx and carbon fibers and stacked sequentially. The experiments were performed using the following machining conditions: spindle speed, feed rate, depth of cut, and machining direction. Cutting forces of the different machining conditions were measured by milling the composite materials. PCA, a method of machine learning, was developed to select the machining conditions and will be used in subsequent experiments under various machining conditions.

• Journal of the Society of Naval Architects of Korea
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• v.31 no.1
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• pp.121-132
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• 1994

The aim of the present paper is to clarify the damage characteristics fur ship bottom stiffened platings in grounding. For this purpose, a series of tests are performed. A rigid wedge is quasi-statically pushed into the high tensile steel plates with two stiffeners. The aspect ratio of plates(a/B) is in the range from 1.0 to 2.5 and the thickness of plates is in the range from 3.4 to 7.0mm. Also other parameters, namely the shape of wedge tip, wedge angle and property/direction of stiffeners are varied. The test is carried out using the 100ton universal test machine. During the loading. both applied force and length of cutting(penetration) resulting in the grounding force-penetration response are measured.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.7
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• pp.158-166
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• 1996

In this study, a flexible disk grinding process is applied in order to produce high precision product. A new model was developed considering feed motion along horizontal and vertical direction. Different types of feed speed variation was tested with respect to distinct process stages in order to achieve flat surface. It was observed that highest order polynomial form for both horizontal and vertical feed speed variation among the proposed categories produced surface close to flat one. Disk deflection trend during the process was visualized confirming the proposed scheme. Cutting force and VRR(volume removal rate) was observed as an aid to process planning.

• Journal of Technologic Dentistry
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• v.9 no.1
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• pp.51-55
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• 1987

One of the primary advantages of acrylic resin teeth is their ability to bond chemically to the denture base resins. Fracture od acrylic resin teeth from a maxillary denture, however, is not uncommon. Bonding failures have been attributed to faulty boil-out procedures that fail to eliminate all traces of wax from the ridge lap surfaces of the teeth and to contamination of the ridge lap surface by careless application of tinfoil substitute. Attempts to increase the strength of the bond between acrylic resin teeth and heat-cured denture base resin include grinding the glossy ridge lap surface (in fluid system), painting the ridgelap surface of the teeth with monomer-polymer solution, and cutting retention grooves in the ridge lap surface of the teeth. This latter method has been tested by applying a tensile force in a labial direction to the incisal part of the lingual surface of the acrylic resin teeth. A progressive shear compressive load was applied at an angle to the lingual surface of acrylic resin teeth bonded to denture base acrylic resin. No statistically singificant advantage was derived by preparing retention grooves of different shapes in the ridgelap surface of the denture teeth.