• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.729-732
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• 2000

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing such as blade, wafer, cutting water and cutting condition. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer as GaAs. In order to overcome this problem, a new dicing process is necessary. This paper describes a new machine using scriber, breaker, and precision servo mechanism in order to dice an semiconductor wafer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.8
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• pp.1309-1316
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But products with inferior quality are produced under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO2, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism and determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.2
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• pp.218-225
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. However, inferior goods may be made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to a GaN wafer, because the GaN wafer is harder than other wafers such as SiO$_2$, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using a scriber.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.164-167
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• 2002

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But inferior goods are made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not applicable this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO$_2$, GaAs, CaAsP, and AlCaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• Transactions of Materials Processing
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• v.32 no.2
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• pp.61-66
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• 2023

The quality of the sheared surface affects the stretch flangeability of steel sheet. The quality of sheared surface is influenced by several process factors such as die clearance, shape of cutting edge, use of counter punch, and shear. In this paper, the influence of these shearing process factors on the stretch flangeability of the HSS (DP980) was analyzed through a shearing and a stretch flangeability test. When the die clearance was 10%, the effect of these shearing process factors on the stretch flangeability was the greatest, and the use of an acute angle blade was found to be more advantageous in the stretch flangeability than a right angle blade. It was found that the stretch flangeability was improved when active bending was applied during shearing.

• 한국신재생에너지학회:학술대회논문집
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• 2005.06a
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• pp.33-36
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• 2005

A critical issue in the field of the rotor aerodynamics is the treatment of the wake. The wake is of primary importance in determining overall aerodynamic behavior, especially, a wind turbine blade includes the unsteady air loads problem. In this study, the wake generated by blades are depicted by a free wake model to analyse unsteady loading on blade and a new free wake model named Finite Vortex Element(FVE hereafter) is devised in order to include a wake-tower interact ion. In this new free wake model, blade-wake-tower interaction is described by cutting a vortex filament when the filament collides with a tower. This FVE model is compared with a conventional free wake model and verified by a comparison with NREL and SNU wind tunnel model. A comparison with NREL and SNU data shows validity and effectiveness of devised FVE free wake model and an efficient.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.315-319
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• 1999

This paper has been considered on the cutting characteristics such as chip formation and surface roughness for Inconel 690 alloy with difficult-to-cut because of high toughness and strength. We have made efforts solving the problem to difficult-to-cut of Inconel by improvement of tool with TiN coating and the selection of optimum cutting condition. We used the CCD camera and the surface roughness tester to observe the chip formation and the state of machined surface by using the improved tool with diamond coating and various cutting condions. We have found that the chip formation showed the tooth shape of tooth blade and the surface roughness was very poor. but it can be better by selection of optimum cutting condition.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.1-12
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• 2009

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

• Journal of Powder Materials
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• v.11 no.5
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• pp.412-420
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• 2004

The purpose of the present study is to determine an optimum composition using cheaper powders keeping with high performance of hard rock cutting diamond saw blade. With 50Fe-20(Cu . Sn)-30Co specimen, a part of Co was replaced by Ni(5%, 10%, and 15%, respectively). These specimens were hot pressed and sintered for predetermined time at various temperature. Sintering is performed by two different methods of temperature controlled method and specimen dimension controlled method. In order to determine the property of the sintered diamond saw blade, 3 point bending tester, X-ray diffractometer, and SEM were used. As the Co in the bond alloy was replaced by Ni, the hardness of the specimen increased. Thus the 50Fe-20(CuㆍSn)-15Co-15Ni specimen showed the maximum hardness of 104(HRB). The results of 3 point bending test showed that flexure strength decreased along with increase in Ni content. This is attributed to the formation of intermetallic compound(Ni$_{x}$Sn) determined by X-ray diffraction. The fracture surface after 3 point bending test showed that diamond was fractured in the specimen containing 0%, 5%, and 10%Ni, and the fracture occurred at the interface between diamond and matrix in the specimen containing 15%Ni. The cutting ability test showed that the abrasive property was not changed in the specimen containing 0%, 5%, and 10%Ni. The optimum composition determined in this study is 50Fe-20(CuㆍSn)-20Co-10Ni.

• Journal of the Korean Society of Propulsion Engineers
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• v.13 no.1
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• pp.34-42
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• 2009

High-speed air turbine handpieces have been used as a dental cutting tool in clinical dentistry for over 50 years, but little study has been reported on their performance analysis. Therefore, the effect of turbine blade shape on performance characteristics of dental air turbine handpiece were studied using CFD in this paper. Computations have been performed for five different positions of turbine blade by using frozen rotor method that is one of steady-state method. The characteristics of turbine blade for shapes and reflection angles were analyzed. As a result of the computation, torque is increased by increasing the reflection angle of turbine blade.