• Title/Summary/Keyword: CuSn

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Flip Chip Interconnection-UBM and Material Issues

  • Jang, Se-Young
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.09a
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    • pp.193-215
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    • 2003
  • Fracture Mechanism of Flip Chip Electromigration Failure - Mostly caused by Cathode Depletion at the UBM/Solder Interface Guideline to Increase Electromigration Resistance Material Selection: Sn/Ag(/Cu) > Pb/63Sn Cu UBM > Ni UBM (but, Solder Material combination) UBM Design: thick UBM is preferable (but, Stress Issue) Pad open/UBM size: as large as possible (but, pad size & pitch limit)

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Study on the Physical Properties of Cu-Zn-Sn Alloy by Organic Additives (유기물 첨가제에 따른 Cu-Zn-Sn 합금 도금층 물성 연구)

  • Lee, Ju-Yeol;Lee, Sang-Yeol;Park, Sang-Eon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2008.11a
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    • pp.147-147
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    • 2008
  • 역전파 신경망은 반도체 공정 모델링에 효과적으로 응용되고 있으며, 모델의 예측정확도를 향상시키기 위하여 Random Generator를 개발하였다. Random Generator의 효과가 기존의 모델에 비해 예측정확도의 향상에 영향을 주었음을 알 수 있었다. 모델링에 이용한 실험데이터는 다중 유도결합형 플라즈마 장비를 이용하여 수집하였다.

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Effect of CuO-V2O5 Addition on Microwave Dielectric Properties of (Pb0.45Ca0.55(Fe0.5Nb0.5)0.9Sn0.1]O3 Ceramics

  • Ha, Jong-Yoon;Choi, Ji-Won;Yoon, Ki-Hyun;Choi, Doo-Jin;Yoon, Seok-Jin;Kim, Hyun-Jai
    • Journal of the Korean Ceramic Society
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    • v.41 no.1
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    • pp.9-12
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    • 2004
  • The effect of x wt% CuO-y wt% $V_2O_5$ content on the microwave properties of $(Pb_{0.45}Ca_{0.55})[(Fe_{0.5}Nb_{0.5})_{0.9}Sn_{0.1}]O_3$ (PCFNS) ceramics was investigated. In order to decrease the sintering temperature and use as a Low Temperature co-firing Ceramics (LTCC), CuO-$V_2O_5$ are added in the PCFNS. The bulk density, dielectric constant (${\varepsilon}_r$) and quality factor(Q${\cdot}f_0$) increased with increase in CuO content within a limited value. The microwave properties were degraded with increases in $V_2O_5$ content. The temperature coefficient of the resonant frequency (${\tau}_f$) of PCFNS was shifted to positive value abruptly with increasing the $V_2O_5$ content, while the ${\tau}_f$ was slightly shifted to positive value with increasing the CuO content. The optimized microwave properties, ${\varepsilon}_r$ = 88, Q${\cdot}f_0$ = 6100 (GHz), and ${\tau}_f$ = 18 ppm/$^{\circ}C$, were obtained in $(Pb_{0.45}Ca_{0.55})[(Fe_{0.5}Nb_{0.5})_{0.9}Sn_{0.1}]O_3$ with 0.2wt% CuO 0.05 wt% $V_2O_5$ and sintered at $1000^{\circ}C$ for 3 h. The relationship between the microstructure and microwave dielectric properties of ceramics was studied by X-Ray Diffraction (XRD) and Scanning Electron Microscopy (SEM)

Material Property Evaluation of High Temperature Creep on Pb-free Solder Alloy Joint to Reflow Time by Shear Punch-creep Test (전단펀치-크리프 시험에 의한 리플로우 시간별 Pb-free 솔더 합금 접합부에 대한 고온 크리프 물성 평가)

  • Ham, Young Pil;Heo, Woo Jin;Yu, Hyo Sun;Yang, Sung Mo
    • Transactions of the Korean Society of Automotive Engineers
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    • v.21 no.1
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    • pp.145-153
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    • 2013
  • In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

Reflow Soldering Characteristics of Sn-3.5Ag Balls for BGA (BGA용 Sn-3.5Ag 롤의 리플로 솔더링 특성)

  • 한현주;정재필;하범용;신영의;박재용;강춘식
    • Journal of Welding and Joining
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    • v.19 no.2
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    • pp.176-181
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    • 2001
  • Reflow soldering characteristics of Sn-3.5Ag and Sn-37Pb balls for BGA(Ball grid Array) were investigated. Diameter of 0.76mm ball was set on a Cu/Ni/Au-coated pad and reflowed in air with changing peak soldering temperature and conveyor speed. Peak temperatures were changed from 240 to 28$0^{\circ}C$ for Sn-3.5Ag, and from 220 to 26$0^{\circ}C$ for Sn-37Pb balls. As results, heights of solder balls increased and widths decreased with peak soldering temperature. Through aging treatment at 10$0^{\circ}C$ for 1.000 hrs, average hardness of Sn-3.5Ag balls bonded at 25$0^{\circ}C$ cecreased from 14.90Hv to 12.83Hv And with same aging conditions, average shear strength of Sn-3.5Ag balls bonded at 26$0^{\circ}C$ decreased from 1727gf to 1650gf.

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A Study on Corrosion according to Distance between Amalgam and Dissimilar Metals (아말감과 이종(異種)금속의 거리에 따른 부식에 대한 고찰)

  • Kim, Ju-won;Jeong, Eun-gyeong
    • Journal of dental hygiene science
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    • v.4 no.3
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    • pp.103-109
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    • 2004
  • The present study prepared 72 test samples - 24 made of amalgam alloy, 24 of Verabond (Ni-Cr alloy) for crown and 24 of Talladium $^{TM}alloy$ for denture - according to the manufacturers' manuals and general method in consideration of the width of the mesial-distal dental crown of the lower $1^{st}$ molar and MOD cavity in clinics, put them in a 200 ml beaker containing 80 ml of artificial saliva, and measured their galvanic corrosion at distances of 0 mm, 7 mm and 40 mm after 7 days. Isolated metals in the electrolyte such as Cu, Ag, Ni, Cr, Sn, Zn and Hg were quantitatively analyzed with Inductively Coupled Plasma - Atomic Emission Spectrometer (ICP-AES, JY-50P, VG Elemental Co. France), and from the results were drawn conclusions as follows. First, Cu, Sn, Ag, Hg and Zn were highly advantageous when amalgam contacted gold alloy compared to Ni-Cr alloy for crown and Talladium alloy for denture. In addition, although gold alloy was finest in terms of oral tissue and biocompatibility, it was most disadvantageous when it was with amalgam. Second, when amalgam contacted gold alloy, heavy metals such as Ni and Cr were not isolated at all because gold alloy did not contain such elements but Sn was isolated as much as $227.1{\pm}18.0035{\mu}g/cm^2$ although it was not included in the composition either. Hg was also isolated. These elements are assumed to have been isolated from amalgam itself. Third, when amalgam alloy was apart from gold alloy 0 mm, 7 mm and 40 mm, Cu and Ag showed significance but Hg did not. This suggests that gold alloy must not be used together with amalgam, and must not be used between dissimilar prostheses regardless of distance. Fourth, when amalgam alloy contacted Ni-Cr alloy for crown, Ag was not isolated from the amalgam, but Zn, Ni, Sn, Hg and Cu were isolated in order of quantity. Significance was observed according to distance - 0 mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Ni-Cr alloy for crown, the isolation Hg was less than that when amalgam alloy contacted Ni-Cr alloy for crown. Fifth, when amalgam alloy contacted Talladium alloy for denture, significance was observed at distances of 0mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Talladium alloy for denture, the isolation Hg was less than that when amalgam alloy contacted Talladium alloy for denture. Sixth, according to the result of ICPES test on Cu, Sn, Ag, Hg, Zn, Ni and Cr of amalgam alloy, gold ally, Verabond and Talladium alloy when these alloys contacted artificial saliva, significance was observed in Cu and Hg. Seventh, when amalgam alloy contracted two non-precious metals Ni-Cr alloy for crown and Talladium alloy for denture in artificial saliva, significance was observed in the isolated by-products of Hg, Ni and Cr according to distance.

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Evaluation of Cu Effect on Corrosion Characteristics of Zr Alloys (지르코늄합금의 부식특성에 미치는 Cu 영향 평가)

  • Kim Hyun Gil;Choi Byung Kyun;Jeong Yong Hwan
    • Korean Journal of Materials Research
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    • v.14 no.7
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    • pp.462-469
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    • 2004
  • The effect of Cu addition on the corrosion characteristics of Zr alloys that developed for nuclear fuel cladding in KAERI (Korea Atomic Energy Research Institute) was evaluated. The alloys having different element of Nb, Sn, Fe, Cr and Cu were manufactured and the corrosion tests of the alloys were performed in static autoclave at $360^{\circ}C$, distilled water condition. The alloys were also examined for their microstructures using the optical microscope and the TEM equipped with EDS and the oxide property was characterized by using X-ray diffraction. From the result of corrosion test more than 450 days, the corrosion rate of the Zr-based alloys was changed with alloying element such as Nb, Sn, Fe, Cr and especially affected by Cu addition. The corrosion resistance was increased with increasing the Cu content and the tetragonal $ZrO_2$ layer was more stabilized on the Cu-containing alloys.

Restoration and Scientific Analysis of Casting Bronze Type in Joseon Dynasty (조선왕실 주조 청동활자의 복원과 과학적 분석)

  • Yun, Yong-Hyun;Cho, Nam-Chul;Lee, Seung-Cheol
    • Journal of Conservation Science
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    • v.25 no.2
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    • pp.207-217
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    • 2009
  • After replicating 10 bronze types such as Gyemija, Gyeongjaja, Eulhaeja, etc. before the Imjin war, we studied the change of microstructure from each casting process, method, and alloy ratio by Gyechukja replicated from "Donggukyeojiseungnam". We selected the average of compositions of Eulhaeja in the National Museum of Korea as the standard(Cu 86.7%, Sn: 9.7%, Pb: 2.3%) of bronze types, so we decided on the alloy's composition of Cu 87%, Sn 15%, Pb 8% added to 5% Sn and Pb contents because of evaporating the Sn and the Pb. Before replicating major metal types, we made master-alloy first, melting it again, and then replicated metal types. The composition of the 1'st replicated Gyechukja showed the range of Cu 85.81~87.63%, Sn 9.27~10.51%, Pb 3.05~3.19%. The 2'nd replicated Gyechukja made using the branch metal left after casting the 1st replica. The 2nd replicated Gyechukja showed the composition range of Cu 87.21~88.09%, Sn 9.06~9.36%, Pb 2.80~3.05%. This result decreases a little contents of Sn and Pb as compared with metal types of the 1st replica. However, it's almost the same as the Eulhaeja's average composition ratio in the National Museum of Korea. As a result of observing the microstructure of restored Gyechukja, it showed the dendrite structure of the typical casting structure and the segregation of Pb. There is no big difference of microstructure between the 1st and the 2nd restored metal types, even though the 2nd restored types partially decreases the eutectoid region in comparison with the 1st types. The systematic and scientific restoration experiment of metal types using Joseon period will be showed the casting method and alloy ratio, and this will be of great help to the study of restoration metal types in the future.

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Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder and OSP-finished PCB (Sn-58Bi Solder와 OSP 표면 처리된 PCB의 접합강도에 미치는 시효처리와 에폭시의 영향)

  • Kim, Jungsoo;Myung, Woo-Ram;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.97-103
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    • 2014
  • Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.

Study on the Interfacial Reactions between Gallium and Cu/Au Multi-layer Metallization (갈륨과 Cu/Au 금속층과의 계면반응 연구)

  • Bae, Junhyuk;Sohn, Yoonchul
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.2
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    • pp.73-79
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    • 2022
  • In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa2 phase, and AuGa2 IMC with small particle sizes was formed on the upper part and Cu9Ga4 IMC with a thin band shape on the lower part of the CuGa2 layer. CuGa2 particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu6Sn5 growth. As a result of analyzing the CuGa2 growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.