• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Journal of the Korean Magnetics Society
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• v.7 no.3
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• pp.152-158
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• 1997

NiFeCo/ Cu /Co trilayers were formed on 4$^{\circ}$ tilt-cut Si(111) substrates with a Cu(50$\AA$) underlayer and large-scaled test magnetoresistive RAM (MRAM) cells were fabricated using a conventional lithographic process. NiFeCo / Cu /Co trilayers deposited on the same templates without any applied magnetic field showed strong in plane uniaxial magnetic anisotropy and excellent magnetoresistive (MR) properties such as high MR ration and sensitivity within a low external magnetic field, which are suitable properties for a MRAM application. In order to obtain optimized MR results in NiFeCo /Cu /Co trilayers, the thickness of Cu spacer was varied. Interlayer coupling between two magnetic layers was observed and it was found that the MR properties were strongly dependent on the coupling force, especially near 20 $\AA$ of Cu spacer thickness. Test MRAM cells were fabricated using the optimized NiFeCo (60$\AA$)/ Cu (25$\AA$)/ Co (30$\AA$) trilayer thin films. With a 10 mA of sense current and 5$\times$$10^5$ of word current, 10 mV of signal output was obtained, which implies the strong potentials of NiFeCo/ Cu /Co trilayer thin films for a MRAM application.

• Journal of the Korean institute of surface engineering
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• v.51 no.4
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• pp.243-248
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• 2018

All solid state thin film batteries with two types of cell structure, Pt / $LiCoO_2$ / LiPON / Cu and Pt / $LiCoO_2$ / LiPON / $LiCoO_2$ / Cu, are prepared and their electrochemical performances are investigated to evaluate the effect of $LiCoO_2$ interlayer at the interface of LiPON / Cu. The crystallinity of the deposited $LiCoO_2$ thin films is confirmed by XRD and Raman analysis. The crystalline $LiCoO_2$ cathode thin film is obtained and $LiCoO_2$ as the interlayer appears to be amorphous. The surface morphology of Cu current collector after cycling of the batteries is observed by AFM. The presence of a 10 nm-thick layer of $LiCoO_2$ at the interface of LiPON / Cu enhances the interfacial adhesion and reduces the interfacial resistance. As a result, Li plating / stripping at the interface of LiPON / Cu during charge/discharge reaction takes place more uniformly on Cu current collector, while without the interlayer of $LiCoO_2$ at the interface of LiPON / Cu, the Li plating / stripping is localized on current collector. The thin film batteries with the interlayer of $LiCoO_2$ at the interface of LiPON / Cu exhibits enhanced initial coulombic efficiency, reversible capacity and cycling stability. The thickness of the anode current collector Cu also appears to be crucial for electrochemical performances of all solid state thin film batteries.

• Korean Journal of Materials Research
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• v.6 no.12
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• pp.1192-1198
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• 1996

배선 재료나 salicide 트랜지스터에 적용될 것으로 기대되는 Cu 배선과 Co 단일층 및 Co/Ti 이중층을 사용하여 형성된 코발트 실리사이드간의 열적 안정성에 대하여 조사하였다. 40$0^{\circ}C$열처리후 Cu3Si 막이 CoSi2층과 Si 기판 사이에 형성되었는데, 이것은 Cu 원자의 확산에 기인한 것이다. $600^{\circ}C$에서의 열처리 후에 형성된 최종막의 구조는 각각 Cu/CoSi2/Cu3Si/Si과 TiO2/Co-Ti-Si 합금/CoSi2/Cu3Si/Si였으며, 상부에 형성된 TiO2층은 산소 오염에 의한 것으로 밝혀졌다.

• Journal of the Korean Chemical Society
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• v.38 no.2
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• pp.136-145
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• 1994

Polymeric complexes such as M(Ⅱ)(PVPS)(SND), M(Ⅱ)(PVPS)(SOPD) have been prepared with monomeric complexes, M(Ⅱ)(SND) and M(Ⅱ)(SOPD)[M: Co(Ⅱ), Ni(Ⅱ), and Cu(Ⅱ)] and polymer PVPS. These complexes have been indentified by elemental analysis, spectroscopy, and T.G.A. From the results, it was found that M(Ⅱ)(PVPS)(SND), M(Ⅱ)(PVPS)(SOPD) complexes were penta-coordinated configuration. Electrochemical properties of these complexes studied by cyclic voltammetry and differential pulse polarography in 0.1 M TEAP-DMF solution at glassy carbon electrode. Co(Ⅱ)(PVPS)(SND) and Co(Ⅱ)(PVPS)(SOPD) showed irreversible two step reduction, such as Co(Ⅲ)/Co(Ⅱ) and Co(Ⅱ)/Co(Ⅰ), and Ni(Ⅱ)(PVPS)(SND), Ni(Ⅱ)(PVPS)(SOPD), Cu(Ⅱ)(PVPS)(SND), and Cu(Ⅱ)(PVPS)(SOPD) complexes showed irreversible one step reduction, such as Ni(Ⅱ)/Ni(Ⅰ) and Cu(Ⅱ)/Cu(Ⅰ), respectively.

• Proceedings of the Korean Magnestics Society Conference
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• 1998.05a
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• pp.50-51
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• 1998

• Journal of the Korean Magnetics Society
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• v.8 no.2
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• pp.79-85
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• 1998

The $[Ni_{80}Fe_{20}/Cu/Co/Cu]$ multilayers were grown by evaporation technique, and according to magnetic exchange coupling relation, magnetoresistance ratio and magnetization curve were studied by Co inserting $Ni_{80}Fe_{20}/Cu$ interface. Insertion of Co layer to the antiferromagnetically coupled system, i. e $t_{Cu} = 25\;{\AA}$, decrese the MR ratio contrary to previous reports. However the insertion to the ferromagneticalyl coupled $(t_{Cu} = 27\;{\AA})$ and the noncoupled $(t_{Cu} = 47\;{\AA})$ systems increase the ratio to 3.5 % and 6 % respectively. The results imply that the insertion change the magnetic exchange coupling state as well as the spin dependent scattering of conduction electrons. Besides, insertion of Co layer between Cu and $Ni_{80}Fe_{20}$ layer enhaces thermal stability to the 300 $^{\circ}C$, which indicates that insertion of Co has a role of the effective diffusion barrier.

• Journal of the Korean Vacuum Society
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• v.3 no.2
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• pp.227-233
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• 1994

CuAlGeSe4 및 CuAlGeSe4 ; Co2+ 결정을 고순도의 성분원소로부터 합성하고 서냉법으로 결정을 성장시켰다. 이들결정은 chalcopyrite 결정구조를 갖고 있으며 직접전이형 energy gap 구조를 갖고 286K에서 energy gap은 CuAlGeSe4 결정의 경우는 2.394eV이며 CuAlGeSe4 ; Co2+ 결정의 경우는 2.302 eV로 주어졌다. CuAlGeSe4 : Co2+ 결정에서 cobalt에 의한 불순물 광흡수 peak들은 12243, 7002, 3890 cm-1에서 나타났으며 이 peak들은 CuAlGeSe4 : Co2+ 결정의 Td symmetry site에 위치한 Co2+ ion의 energy 준위사이의 전자전이에 의한 optical absorption임을 규명했다.

• Journal of the Korean Magnetics Society
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• v.9 no.5
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• pp.251-255
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• 1999

NiFe(60 $\AA$)/Co(0$\AA$$\leq$x$\AA$$\leq$15$\AA$)/Cu(60$\AA$)/Co(30$\AA$) spin valve thin films were prepared on 4$^{\circ}$ tilt-cut Si(111) substrates with a 50 $\AA$ thick Cu underlayer without applying any external magnetic field during the deposition, and the effects of inserted ultrathin Co layer on magnetic anisotropy and GMR properties of the NiFe(60 $\AA$)/Cu(60$\AA$)/Co(30$\AA$) spin valves were investigated. As the ultrathin Co layer was inserted into the NiFe/Cu interface of the spin valves, GMR ratio was increased from about 1.5% to 3.5%, and the easy axis of NiFe(60 $\AA$) layer was rotated by 90$^{\circ}$. Accordingly, it was aligned along the same direction with the easy axis of Co(30 $\AA$)layer. Therefore, squared R-H curves was obtained in the spin valves, which is favorable properties for the digital GMR devices such as MRAM. In order to investigate the change of magnetic anisotropy of NiFe layer of the spin valves in more details,XRD measurement was performed using NiFe(500 $\AA$) and NiFe(500 $\AA$)/Co(10 $\AA$) thin films on the same templates. Strong (220) NiFe peak was observed in both films regardless of the inserted Co layer, so it was thought that the variation of magnetic anisotropy of NiFe layer is from the interface effect, the change of interface from NiFe/Cu to NiFe/Co, rather than the volume effect such as the change of magnetocrystalline effect.

• Journal of the Korean Chemical Society
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• v.53 no.3
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• pp.233-243
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• 2009

We have investigated the infrared spectra for CO adsorbed on silica supported nickel(Ni-Si$O_2$), silica supported copper(Cu-Si$O_2$), silica supported nickel-copper alloys(Ni/Cu-Si$O_2$) of several compositions with varying CO pressures(0.2 $torr{\sim}$50 torr) at room temperature and on pumping to vacumn at room temperature within the frequency range of 1500 $cm^{-1}{\sim}2500\;cm^{-1}$. Four bands(2059.6 $cm^{-1},\;{\sim}$2036.5 $cm^{-1},\;{\sim}$ 1868.7 $cm^{-1},\;{\sim}$ 1697.1 $cm^{-1}$) were observed for Ni-Si$O_2$, two bands($\sim$2115.5 $cm^{-1},\;{\sim}$1743.0 $cm^{-1}$) were observed for Cu-Si$O_2$ and five bands(${\sim}2123.2\;cm^{-1}$, 2059.6 $cm^{-1},\;{\sim}$2036.4 $cm^{-1},\;{\sim}$1899.5 $cm^{-1},\;{\sim}$1697.1 $cm^{-1}$) were observed for Ni/Cu-Si$O_2$. These absorption bands correspond with those of the previous reports approximately. The bands below 1800 $cm^{-1}$ were only observed with Ni metal or Ni/Cu alloy crystal plane containing step at room temperature and the ${\sim}1697.1\;cm^{-1}$ bands observed with Ni-Si$O_2$ and Ni/Cu-Si$O_2$ may be ascribed to CO molecule adsorbed on the adsorption sites near step. The bands below 2000 $cm^{-1}$ were rarely observed with Cu metal crystal plane at room temperature and the 1743.0 $cm^{-1}$ bands may be ascribed to CO molecule adsorbed on the adsorption sites near step. The band shifts of adsorbed CO with varing Cu contents from 0 to 0.5 mole fraction at the same CO pressure or at the same pumping time to vacumn were below 21 $cm^{-1}$. and comparatively small than those with other ⅠB metal addition. It may means ligand effect of Cu d electron is small.