• Bulletin of the Korean Chemical Society
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• v.33 no.5
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• pp.1603-1607
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• 2012

The effects of plating process on the surface coverage of the accelerator were investigated in terms of Cu superfilling for device metallization. When a substrate having 500 nm-wide trench patterns on it was immersed in an electrolyte containing poly (ethylene glycol) (PEG)-chloride ion ($Cl^-$)-bis(3-sulfopropyl) disulfide (SPS) additives without applying deposition potential for such a time of about 100s, voids were generated inside of the electrodeposit. In time-evolved electrochemical analyses, it was observed that the process (immersion without applying potential) in the electrolyte led to the build-up of high initial coverage of SPS-Cl on the surface, resulting in the fast saturation of the coverage. Repeated experiments suggested that the fast saturation of SPS-Cl failed in superfilling while a gradual increase in the SPS-Cl coverage through competition with initially adsorbed PEG-Cl enabled it. Consequently, superfilling was achievable only in the case of applying the plating potential as soon as the substrate is dipped in an electrolyte to prevent rapid accumulation of SPS-Cl on the surface.

• Journal of Plant Biology
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• v.36 no.3
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• pp.195-201
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• 1993

The room temperature fluorescence induction of chloroplasts was utilized as a probe to locate the site of inhibition by mercury, copper and zinc on PS II by mercury. Inhibitory effect of Hg2+ on electron transport activity was notable as compared with Cu2+ and Zn2+. At concentrations of HgCl2 over 50 $\mu$M, activities of PS II and whole-chain electron transport decreased more than 70%, while that of PS I decreased about 10~30%. This suggests that PS II is more susceptible to Hg2+ than PS I is. In the presence of diphenylcarbazide (DPC), 50 $\mu$M HgCl2 inhibited the reduction of dichlorophenolindophenol (DCPIP) about 50%. Addition of heavy metals induced marked decrease in maximal variable fluorescence/initial fluorescence [(Fv)m/Fo], but no changes in Fo. With various concentrations of heavy metals, changes of chlorophyll a fluorescence emitted by PS II showed gradual decrease in photochemical quenching (qQ), which indicates an increase in reduced state of electron acceptor, QA. Especially, the addition of HgCl2 caused a notable decrease of qQ. In the presence of 50 $\mu$M CuCl2, energy-depended quenching (qE) was completely reduced, whereas in the presence of 50 $\mu$M CuCl2 and ZnCl2 it was still remained. The above results are discussed on the effects of mercury in relation to water-splitting system and plastoquinone (PQ) shuttle system.

• Bulletin of the Korean Chemical Society
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• v.25 no.6
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• pp.796-800
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• 2004

The structure of [Cu(tpen)]$(ClO_4)_2$ (tpen = N,N,N',N'-tetrakis(2-pyridylmethyl)-1,2-ethanediamine) has been identified by X-ray crystallography. The copper(II) ion is surrounded by two amine N atoms and three pyridine N atoms of the ligand, making a distorted trigonal-bipyramid. Among the six potential N donor atoms (two amine N and four pyridine N atoms), only one pyridine N atom remains uncoordinated. We examined structural changes on addition of $Cl^-$ to $[Cu(tpen)]^{2+}$(1). The addition of $Cl^-$ in methanol resulted in the formation of a novel dinuclear copper(II) complex $[Cu_2Cl_2(tpen)](ClO_4)_2{\cdot}H_2O$. The structure of the dinuclear complex was verified by X-ray crystallography. Each copper(II) ion in the dinuclear complex showed a distorted square planar geometry with two pyridine N atoms, one amine N atom and one $Cl^-$ ion.

• Resources Recycling
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• v.27 no.5
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• pp.54-60
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• 2018

The quality of steel produced from scrap can be adversely affected because of the buildup of tramp elements in recycled scrap. The tramp element of greatest concern is copper because of its effect on steel quality, even in small percentage quantities. In this study, possibility of removal of copper from ferrous scrap by using $Cl_2$ gas is experimentally examined in a small size experimental apparatus. Synthetic ferrous scraps containing copper were reacted with $Cl_2$ gas in various atmosphere. The copper was chloridized and evaporated, whereas iron was oxidized and was not reacted with Cl2 and oxygen mixture gas.

• Journal of Korean Society of Forest Science
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• v.4 no.1
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• pp.14-16
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• 1965

(1) The sterilizing effects of NaF, $CuSO_4$, $CuCO_3$, $HgCl_2$, $ZnSO_4$, and coaltar creosote on the mycelial growth of Irpex consors Berk. Polystictus versicolor L. Fr, Polystictus versicalor L. var. nigricans, and Schizophyllum commune Fr. Were studied. (2) The range of minimum density of the fungicides to check the growth of four fungi mentioned above was as follows; NaF 0.15~0.25(%) $CuSO_4$ 0.20~0.35(%) $CuCO_3$ 0.40~0.50(%) $HgCl_2$ 0.05(%) $ZnSO_4$ 0.40~0.45(%) Creosote 0.10~0.15(%) Of the fungicides tested, $HgCl_2$ was most effective in fungicidal effects, and Creosote, NaF, $CuSO_4$, $ZnSO_4$, $CuCO_3$, followed. The order of resistance of the fungi to the fungicides was as follows: S. Commune Fr. P. Versicalor L. var.nigricans I. Consors Berk P. Versicalor L. Fr. (3) The fungicides were added to the pepton-agor culture medium at the concentration between 0.01 and 0.5%, and the medium was filled into 9cm petridshes. Two square millimeter agar blocks prepared separately from the fungi Contained agar were placed in the middle of the Petri-dishes, in cubated six days at $26^{\circ}C$. Diameter of biggest Colonies were measured.

• Corrosion Science and Technology
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• v.22 no.3
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• pp.137-152
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• 2023

Polarization behavior and corrosion inhibition of copper in acidic chloride solutions containing benzotriazole were studied. Pourbaix diagrams constructed for copper in NaCl solutions with different BTAH concentrations were used to understand the polarization behavior. Open circuit potential (OCP) depended not only on chloride concentration, but also on whether a CuBTA layer was formed on the copper surface. Only when the (pH, OCP) was located well in the CuBTA region of the Pourbaix diagram, a stable corrosion inhibiting CuBTA layer was formed, which was confirmed by X-ray Photoelectron Spectroscopy (XPS) and a long-term corrosion test. The OCP for the CuBTA layer decreased logarithmically with increasing [Cl^-] activity in the solution. A minimum BTAH concentration required to form a CuBTA layer for a given NaCl concentration and pH were determined from the Pourbaix diagram. It was found that 320 ppm BTAH solution could be used to form a corrosion-inhibiting CuBTA layer inside the corrosion pit in the sprinkler copper tube, successfully reducing water leakage rate of copper tubes. These experimental results could be used to estimate water chemistry inside a corrosion pit.

• Journal of the Korean Chemical Society
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• v.37 no.9
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• pp.849-852
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• 1993

• Bulletin of the Korean Chemical Society
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• v.32 no.7
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• pp.2461-2464
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• 2011

• Electrical & Electronic Materials
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• v.1 no.2
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• pp.126-135
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• 1988

Acrylonitrile-Acrylic acid 공중합체와 이를 amidation시킬 공중합체에 구리착물을 형성시켜 IR spectrum분석, 점도측정, 전자현미경관찰, 열분석, 전기전도성등을 검토하였다. AN-AA 공중합체-Cu(II)와 아미드화 AN-AA 공중합체-Cu(II)착물은 pH9의 범위에서 가장 안정한 값을 가지며 착물이 형성되거나 Cu$_{x}$S가 도입된 공중합체는 그 구조가 ompact해짐을 알 수 있었다. 공중합체에 Cu(II)착물이 형성되면 열안정성이 감소되며 Cu(II)착물은 아세톤 용액에서 요오드로 dope 될 때 저항값이 $10^{5}$-$10^{6}$.OMEGA..cm를 나타냈다. 저항값은 CuCl$_{2}$와 I$_{2}$의 양에 영향을 받으며 20wt% 이상의 CuCl$_{2}$와 1.0wt% I$_{2}$로 처리하였을 때 반도체영역의 저항값을 보였다. 또 Cu$_{x}$S를 도입할 경우 CuSO$_{4}$의 농도가 30g/l로, 3시간 반응시켰을 때 가장 만족스러운 전도도값을 나타냈다. 공중합체-Cu(II)보다 구리이온을 도입한 Cu$_{x}$S공중합체의 전도도값이 $10^{4}$정도로서 공중합체-Cu(II)보다 높은 전도성을 나타냈다.다.

• Journal of Electrochemical Science and Technology
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• v.11 no.1
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.